JPWO2021084902A5 - - Google Patents
Download PDFInfo
- Publication number
- JPWO2021084902A5 JPWO2021084902A5 JP2021554128A JP2021554128A JPWO2021084902A5 JP WO2021084902 A5 JPWO2021084902 A5 JP WO2021084902A5 JP 2021554128 A JP2021554128 A JP 2021554128A JP 2021554128 A JP2021554128 A JP 2021554128A JP WO2021084902 A5 JPWO2021084902 A5 JP WO2021084902A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- chips
- bonded
- manufacturing
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims 61
- 238000004519 manufacturing process Methods 0.000 claims 12
- 238000000034 method Methods 0.000 claims 11
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 6
- 238000010521 absorption reaction Methods 0.000 claims 6
- 229910052710 silicon Inorganic materials 0.000 claims 6
- 239000010703 silicon Substances 0.000 claims 6
- 238000000926 separation method Methods 0.000 claims 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical group O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 2
- 229910052814 silicon oxide Inorganic materials 0.000 claims 2
- 230000015572 biosynthetic process Effects 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019196386 | 2019-10-29 | ||
| JP2019196386 | 2019-10-29 | ||
| PCT/JP2020/033410 WO2021084902A1 (ja) | 2019-10-29 | 2020-09-03 | チップ付き基板の製造方法、及び基板処理装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2021084902A1 JPWO2021084902A1 (enExample) | 2021-05-06 |
| JPWO2021084902A5 true JPWO2021084902A5 (enExample) | 2022-06-27 |
| JP7330284B2 JP7330284B2 (ja) | 2023-08-21 |
Family
ID=75714631
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021554128A Active JP7330284B2 (ja) | 2019-10-29 | 2020-09-03 | チップ付き基板の製造方法、及び基板処理装置 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20220406603A1 (enExample) |
| JP (1) | JP7330284B2 (enExample) |
| KR (2) | KR20250121140A (enExample) |
| CN (2) | CN114586135B (enExample) |
| TW (2) | TWI874441B (enExample) |
| WO (1) | WO2021084902A1 (enExample) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20240016994A (ko) * | 2021-06-03 | 2024-02-06 | 도쿄엘렉트론가부시키가이샤 | 기판 처리 방법 |
| WO2023032833A1 (ja) * | 2021-09-06 | 2023-03-09 | 東京エレクトロン株式会社 | 基板処理方法及び基板処理装置 |
| US20230343606A1 (en) * | 2022-04-22 | 2023-10-26 | Tokyo Electron Limited | Method for forming semiconductor packages using dielectric alignment marks and laser liftoff process |
| US20240178180A1 (en) * | 2022-11-30 | 2024-05-30 | Tokyo Electron Limited | Systems and methods for bonding semiconductor devices |
| KR102853614B1 (ko) * | 2024-08-07 | 2025-09-04 | (주)에이치아이티에스 | 칩 본딩 방법 |
Family Cites Families (31)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04340251A (ja) * | 1991-02-07 | 1992-11-26 | Fujitsu Ltd | 半導体装置の製造方法 |
| JP4389447B2 (ja) * | 2003-01-28 | 2009-12-24 | セイコーエプソン株式会社 | 電気光学装置の製造方法 |
| JP2004288689A (ja) * | 2003-03-19 | 2004-10-14 | Matsushita Electric Ind Co Ltd | 電子部品製造方法および電子部品の集合体の製造方法 |
| KR20070018713A (ko) * | 2005-08-10 | 2007-02-14 | 가부시끼가이샤 르네사스 테크놀로지 | 반도체 장치의 제조 방법 및 반도체 장치 |
| JP5389490B2 (ja) * | 2009-03-23 | 2014-01-15 | 東京エレクトロン株式会社 | 三次元集積回路の製造方法及び装置 |
| JP2011049210A (ja) * | 2009-08-25 | 2011-03-10 | Seiko Epson Corp | 薄膜素子群の転写方法 |
| WO2012133760A1 (ja) * | 2011-03-30 | 2012-10-04 | ボンドテック株式会社 | 電子部品実装方法、電子部品実装システムおよび基板 |
| JP6008940B2 (ja) * | 2012-03-13 | 2016-10-19 | シチズンホールディングス株式会社 | 半導体発光装置及びその製造方法 |
| JP2015046569A (ja) | 2013-07-31 | 2015-03-12 | マイクロン テクノロジー， インク． | 半導体装置の製造方法 |
| JP6145061B2 (ja) * | 2014-03-04 | 2017-06-07 | 東京エレクトロン株式会社 | 接合システムおよび接合方法 |
| US10446531B2 (en) * | 2014-09-26 | 2019-10-15 | Renesas Electronics Corporation | Electronic device and semiconductor device |
| WO2018003602A1 (ja) * | 2016-06-28 | 2018-01-04 | リンテック株式会社 | 整列治具、整列方法及び転着方法 |
| CN106601657B (zh) * | 2016-12-12 | 2019-12-17 | 厦门市三安光电科技有限公司 | 微元件的转移系统、转移方法、制造方法、装置和电子设备 |
| EP3590130A1 (de) * | 2017-03-02 | 2020-01-08 | EV Group E. Thallner GmbH | Verfahren und vorrichtung zum bonden von chips |
| US10403537B2 (en) * | 2017-03-10 | 2019-09-03 | Facebook Technologies, Llc | Inorganic light emitting diode (ILED) assembly via direct bonding |
| TW201911457A (zh) * | 2017-07-26 | 2019-03-16 | 優顯科技股份有限公司 | 用於批量移轉微半導體結構之方法 |
| TWI653694B (zh) * | 2017-09-13 | 2019-03-11 | 英屬開曼群島商錼創科技股份有限公司 | 微型發光元件陣列製造方法、轉移載板以及微型發光元件陣列 |
| JP6973927B2 (ja) * | 2017-10-24 | 2021-12-01 | 株式会社ディスコ | チップの製造方法 |
| JP7185638B2 (ja) * | 2017-11-16 | 2022-12-07 | リンテック株式会社 | 半導体装置の製造方法 |
| US10325791B1 (en) * | 2017-12-13 | 2019-06-18 | Facebook Technologies, Llc | Formation of elastomeric layer on selective regions of light emitting device |
| US11227812B2 (en) * | 2019-08-28 | 2022-01-18 | Taiwan Semiconductor Manufacturing Company, Ltd. | Package and manufacturing method thereof |
| US11264343B2 (en) * | 2019-08-30 | 2022-03-01 | Taiwan Semiconductor Manufacturing Co., Ltd. | Bond pad structure for semiconductor device and method of forming same |
| US11557581B2 (en) * | 2019-09-23 | 2023-01-17 | Taiwan Semiconductor Manufacturing Company, Ltd. | Package structure and method of fabricating the same |
| US12080672B2 (en) * | 2019-09-26 | 2024-09-03 | Adeia Semiconductor Bonding Technologies Inc. | Direct gang bonding methods including directly bonding first element to second element to form bonded structure without adhesive |
| US11094672B2 (en) * | 2019-09-27 | 2021-08-17 | Intel Corporation | Composite IC chips including a chiplet embedded within metallization layers of a host IC chip |
| US11804469B2 (en) * | 2020-05-07 | 2023-10-31 | Invensas Llc | Active bridging apparatus |
| US11631647B2 (en) * | 2020-06-30 | 2023-04-18 | Adeia Semiconductor Bonding Technologies Inc. | Integrated device packages with integrated device die and dummy element |
| CN114597138A (zh) * | 2020-12-03 | 2022-06-07 | 群创光电股份有限公司 | 半导体封装的制造方法 |
| US12125820B2 (en) * | 2021-02-12 | 2024-10-22 | Taiwan Semiconductor Manufacturing Co., Ltd. | Through-dielectric vias for direct connection and method forming same |
| US11664315B2 (en) * | 2021-03-11 | 2023-05-30 | Taiwan Semiconductor Manufacturing Company, Ltd. | Structure with interconnection die and method of making same |
| JP2022170858A (ja) * | 2021-04-30 | 2022-11-11 | シャープ株式会社 | マイクロｌｅｄ実装基板、マイクロｌｅｄディスプレイ及びマイクロｌｅｄ実装基板の製造方法 |
-
2020
- 2020-08-25 TW TW109128862A patent/TWI874441B/zh active
- 2020-08-25 TW TW114102667A patent/TW202522760A/zh unknown
- 2020-09-03 CN CN202080073979.9A patent/CN114586135B/zh active Active
- 2020-09-03 US US17/772,166 patent/US20220406603A1/en active Pending
- 2020-09-03 KR KR1020257025004A patent/KR20250121140A/ko active Pending
- 2020-09-03 CN CN202511278398.XA patent/CN121123034A/zh active Pending
- 2020-09-03 KR KR1020227017319A patent/KR102839966B1/ko active Active
- 2020-09-03 WO PCT/JP2020/033410 patent/WO2021084902A1/ja not_active Ceased
- 2020-09-03 JP JP2021554128A patent/JP7330284B2/ja active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPWO2021084902A5 (enExample) | ||
| US7572350B2 (en) | Method of cutting laminate, apparatus for manufacturing laminate, method of manufacturing laminate, and laminate | |
| TWI684222B (zh) | 半導體裝置之製造方法 | |
| JP5221279B2 (ja) | 積層デバイスの製造方法 | |
| TWI655744B (zh) | 積層元件的製造方法 | |
| TWI699827B (zh) | 處理基板的方法 | |
| CN105047612A (zh) | 晶片的加工方法 | |
| KR102349663B1 (ko) | 웨이퍼의 가공 방법 | |
| CN108022877A (zh) | 晶片的加工方法 | |
| CN108015650B (zh) | 晶片的加工方法 | |
| CN105935842B (zh) | 器件芯片的制造方法 | |
| CN108022876B (zh) | 晶片的加工方法 | |
| JP2011035245A (ja) | 板状ワークの分割方法 | |
| TW201535781A (zh) | 光裝置 | |
| TW201822307A (zh) | 中介載板的製造方法 | |
| TWI582843B (zh) | The manufacturing method of the attached wafer | |
| CN105960707A (zh) | 装卸器晶片移除 | |
| JP5975763B2 (ja) | ウエーハの加工方法 | |
| CN108453370A (zh) | 被加工物的加工方法 | |
| US7491288B2 (en) | Method of cutting laminate with laser and laminate | |
| KR20180068862A (ko) | 인터포저의 제조 방법 | |
| JP2015065209A (ja) | ウェーハの分割方法 | |
| JP2017050408A (ja) | 積層ウェーハの製造方法 | |
| JP6710465B2 (ja) | ウェーハの加工方法 | |
| TWI707454B (zh) | 半導體裝置 |