JPWO2021080305A5 - - Google Patents

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Publication number
JPWO2021080305A5
JPWO2021080305A5 JP2022523716A JP2022523716A JPWO2021080305A5 JP WO2021080305 A5 JPWO2021080305 A5 JP WO2021080305A5 JP 2022523716 A JP2022523716 A JP 2022523716A JP 2022523716 A JP2022523716 A JP 2022523716A JP WO2021080305 A5 JPWO2021080305 A5 JP WO2021080305A5
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JP
Japan
Prior art keywords
insulating layer
via electrode
circuit board
base
horizontal direction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022523716A
Other languages
English (en)
Japanese (ja)
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JP2022553349A (ja
JP2022553349A5 (https=
JP7688631B2 (ja
Publication date
Priority claimed from KR1020190130455A external-priority patent/KR102710005B1/ko
Application filed filed Critical
Publication of JP2022553349A publication Critical patent/JP2022553349A/ja
Publication of JP2022553349A5 publication Critical patent/JP2022553349A5/ja
Publication of JPWO2021080305A5 publication Critical patent/JPWO2021080305A5/ja
Priority to JP2025086443A priority Critical patent/JP2025109988A/ja
Application granted granted Critical
Publication of JP7688631B2 publication Critical patent/JP7688631B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2022523716A 2019-10-21 2020-10-21 回路基板 Active JP7688631B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2025086443A JP2025109988A (ja) 2019-10-21 2025-05-23 回路基板

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
KR10-2019-0130455 2019-10-21
KR1020190130455A KR102710005B1 (ko) 2019-10-21 2019-10-21 회로기판
PCT/KR2020/014386 WO2021080305A1 (ko) 2019-10-21 2020-10-21 인쇄회로기판

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2025086443A Division JP2025109988A (ja) 2019-10-21 2025-05-23 回路基板

Publications (4)

Publication Number Publication Date
JP2022553349A JP2022553349A (ja) 2022-12-22
JP2022553349A5 JP2022553349A5 (https=) 2024-03-28
JPWO2021080305A5 true JPWO2021080305A5 (https=) 2024-03-28
JP7688631B2 JP7688631B2 (ja) 2025-06-04

Family

ID=75619445

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2022523716A Active JP7688631B2 (ja) 2019-10-21 2020-10-21 回路基板
JP2025086443A Pending JP2025109988A (ja) 2019-10-21 2025-05-23 回路基板

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2025086443A Pending JP2025109988A (ja) 2019-10-21 2025-05-23 回路基板

Country Status (5)

Country Link
US (2) US12144116B2 (https=)
JP (2) JP7688631B2 (https=)
KR (2) KR102710005B1 (https=)
CN (2) CN119545648A (https=)
WO (1) WO2021080305A1 (https=)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102888075B1 (ko) * 2020-09-18 2025-11-19 엘지이노텍 주식회사 회로기판, 패키지 기판 및 이의 제조 방법
US20230413425A1 (en) * 2020-11-20 2023-12-21 Lg Innotek Co., Ltd. Circuit board
KR20220151431A (ko) * 2021-05-06 2022-11-15 삼성전기주식회사 인쇄회로기판
KR102824545B1 (ko) * 2021-08-10 2025-06-25 엘지이노텍 주식회사 회로 기판 및 이를 포함하는 안테나 패키지 기판
KR20230023492A (ko) * 2021-08-10 2023-02-17 엘지이노텍 주식회사 회로기판 및 이를 포함하는 패키지 기판
KR20230065804A (ko) * 2021-11-05 2023-05-12 엘지이노텍 주식회사 회로기판 및 이를 포함하는 패키지 기판
JP2024544050A (ja) * 2021-11-29 2024-11-27 エルジー イノテック カンパニー リミテッド 回路基板
KR20230105265A (ko) * 2022-01-03 2023-07-11 엘지이노텍 주식회사 회로 기판 및 이를 포함하는 반도체 패키지
WO2023189839A1 (ja) * 2022-03-31 2023-10-05 三井金属鉱業株式会社 キャリア付金属箔
JP2025528230A (ja) * 2022-08-18 2025-08-26 エルジー イノテック カンパニー リミテッド 回路基板およびこれを含む半導体パッケージ
KR20250033675A (ko) * 2023-09-01 2025-03-10 삼성전기주식회사 인쇄회로기판
WO2025186425A1 (en) * 2024-03-07 2025-09-12 At&S Austria Technologie & Systemtechnik Aktiengesellschaft Component carrier with resin-embedded component, and manufacturing method
KR20260015585A (ko) * 2024-07-25 2026-02-03 엘지이노텍 주식회사 회로기판 및 반도체 패키지
KR102917261B1 (ko) * 2024-09-06 2026-01-23 엘지이노텍 주식회사 회로기판

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Publication number Priority date Publication date Assignee Title
US7056595B2 (en) 2003-01-30 2006-06-06 Metglas, Inc. Magnetic implement using magnetic metal ribbon coated with insulator
JP4669305B2 (ja) 2005-03-09 2011-04-13 日本特殊陶業株式会社 配線基板
US8101868B2 (en) * 2005-10-14 2012-01-24 Ibiden Co., Ltd. Multilayered printed circuit board and method for manufacturing the same
KR100659510B1 (ko) 2006-02-16 2006-12-20 삼성전기주식회사 캐비티가 형성된 기판 제조 방법
US9282626B2 (en) * 2010-10-20 2016-03-08 Lg Innotek Co., Ltd. Printed circuit board and method for manufacturing the same
JP2012164952A (ja) * 2011-01-20 2012-08-30 Ibiden Co Ltd 電子部品内蔵配線板及びその製造方法
KR20150024944A (ko) 2011-07-13 2015-03-09 이비덴 가부시키가이샤 전자 부품 내장 배선판 및 그 제조 방법
JP2013247216A (ja) 2012-05-25 2013-12-09 Konica Minolta Inc 圧電素子およびそれを備えたインクジェットヘッド
KR101814113B1 (ko) * 2012-11-02 2018-01-02 삼성전기주식회사 인쇄회로기판의 제조방법
KR101472672B1 (ko) * 2013-04-26 2014-12-12 삼성전기주식회사 전자부품 내장 인쇄회로기판 및 그 제조방법
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JP6503687B2 (ja) * 2014-10-23 2019-04-24 イビデン株式会社 プリント配線板
KR102536256B1 (ko) * 2015-04-03 2023-05-25 엘지이노텍 주식회사 임베디드 인쇄회로기판
US9549468B1 (en) * 2015-07-13 2017-01-17 Advanced Semiconductor Engineering, Inc. Semiconductor substrate, semiconductor module and method for manufacturing the same
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KR101726568B1 (ko) 2016-02-24 2017-04-27 대덕전자 주식회사 회로기판 제조방법
KR102501905B1 (ko) * 2017-11-09 2023-02-21 삼성전기주식회사 인쇄회로기판 및 그 제조방법
KR101912290B1 (ko) * 2017-12-06 2018-10-29 삼성전기 주식회사 팬-아웃 반도체 패키지
JP7016256B2 (ja) * 2017-12-28 2022-02-04 京セラ株式会社 印刷配線板の製造方法
JP6978335B2 (ja) * 2018-02-02 2021-12-08 新光電気工業株式会社 電子部品内蔵基板及びその製造方法と電子部品装置
US20200053887A1 (en) * 2018-08-09 2020-02-13 At&S Austria Technologie & Systemtechnik Aktiengesellschaft Mechanically Robust Component Carrier With Rigid and Flexible Portions
KR20200051215A (ko) 2018-11-05 2020-05-13 삼성전기주식회사 인쇄회로기판 및 이를 포함하는 패키지 구조물

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