JP2022553349A5 - - Google Patents
Info
- Publication number
- JP2022553349A5 JP2022553349A5 JP2022523716A JP2022523716A JP2022553349A5 JP 2022553349 A5 JP2022553349 A5 JP 2022553349A5 JP 2022523716 A JP2022523716 A JP 2022523716A JP 2022523716 A JP2022523716 A JP 2022523716A JP 2022553349 A5 JP2022553349 A5 JP 2022553349A5
- Authority
- JP
- Japan
- Prior art keywords
- insulating layer
- circuit board
- board according
- base
- via electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2025086443A JP2025109988A (ja) | 2019-10-21 | 2025-05-23 | 回路基板 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2019-0130455 | 2019-10-21 | ||
| KR1020190130455A KR102710005B1 (ko) | 2019-10-21 | 2019-10-21 | 회로기판 |
| PCT/KR2020/014386 WO2021080305A1 (ko) | 2019-10-21 | 2020-10-21 | 인쇄회로기판 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025086443A Division JP2025109988A (ja) | 2019-10-21 | 2025-05-23 | 回路基板 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2022553349A JP2022553349A (ja) | 2022-12-22 |
| JP2022553349A5 true JP2022553349A5 (https=) | 2024-03-28 |
| JP7688631B2 JP7688631B2 (ja) | 2025-06-04 |
Family
ID=75619445
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022523716A Active JP7688631B2 (ja) | 2019-10-21 | 2020-10-21 | 回路基板 |
| JP2025086443A Pending JP2025109988A (ja) | 2019-10-21 | 2025-05-23 | 回路基板 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025086443A Pending JP2025109988A (ja) | 2019-10-21 | 2025-05-23 | 回路基板 |
Country Status (5)
| Country | Link |
|---|---|
| US (2) | US12144116B2 (https=) |
| JP (2) | JP7688631B2 (https=) |
| KR (2) | KR102710005B1 (https=) |
| CN (2) | CN114600562B (https=) |
| WO (1) | WO2021080305A1 (https=) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102888075B1 (ko) * | 2020-09-18 | 2025-11-19 | 엘지이노텍 주식회사 | 회로기판, 패키지 기판 및 이의 제조 방법 |
| WO2022108386A1 (ko) * | 2020-11-20 | 2022-05-27 | 엘지이노텍 주식회사 | 회로 기판 |
| KR20220151431A (ko) * | 2021-05-06 | 2022-11-15 | 삼성전기주식회사 | 인쇄회로기판 |
| KR102824545B1 (ko) * | 2021-08-10 | 2025-06-25 | 엘지이노텍 주식회사 | 회로 기판 및 이를 포함하는 안테나 패키지 기판 |
| KR20230023492A (ko) * | 2021-08-10 | 2023-02-17 | 엘지이노텍 주식회사 | 회로기판 및 이를 포함하는 패키지 기판 |
| JP2024538347A (ja) * | 2021-11-05 | 2024-10-18 | エルジー イノテック カンパニー リミテッド | 回路基板 |
| EP4443500A4 (en) * | 2021-11-29 | 2025-11-19 | Lg Innotek Co Ltd | PRINTED ROUTE MAP |
| KR20230105265A (ko) * | 2022-01-03 | 2023-07-11 | 엘지이노텍 주식회사 | 회로 기판 및 이를 포함하는 반도체 패키지 |
| CN118946454A (zh) * | 2022-03-31 | 2024-11-12 | 三井金属矿业株式会社 | 带载体的金属箔 |
| JP2025528230A (ja) * | 2022-08-18 | 2025-08-26 | エルジー イノテック カンパニー リミテッド | 回路基板およびこれを含む半導体パッケージ |
| KR20250033675A (ko) * | 2023-09-01 | 2025-03-10 | 삼성전기주식회사 | 인쇄회로기판 |
| WO2025186425A1 (en) * | 2024-03-07 | 2025-09-12 | At&S Austria Technologie & Systemtechnik Aktiengesellschaft | Component carrier with resin-embedded component, and manufacturing method |
| KR20260015585A (ko) * | 2024-07-25 | 2026-02-03 | 엘지이노텍 주식회사 | 회로기판 및 반도체 패키지 |
| KR102917261B1 (ko) * | 2024-09-06 | 2026-01-23 | 엘지이노텍 주식회사 | 회로기판 |
Family Cites Families (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7056595B2 (en) | 2003-01-30 | 2006-06-06 | Metglas, Inc. | Magnetic implement using magnetic metal ribbon coated with insulator |
| JP4669305B2 (ja) | 2005-03-09 | 2011-04-13 | 日本特殊陶業株式会社 | 配線基板 |
| US8101868B2 (en) | 2005-10-14 | 2012-01-24 | Ibiden Co., Ltd. | Multilayered printed circuit board and method for manufacturing the same |
| KR100659510B1 (ko) | 2006-02-16 | 2006-12-20 | 삼성전기주식회사 | 캐비티가 형성된 기판 제조 방법 |
| CN103270819B (zh) * | 2010-10-20 | 2016-12-07 | Lg伊诺特有限公司 | 印刷电路板及其制造方法 |
| JP2012164952A (ja) * | 2011-01-20 | 2012-08-30 | Ibiden Co Ltd | 電子部品内蔵配線板及びその製造方法 |
| CN103703874A (zh) * | 2011-07-13 | 2014-04-02 | 揖斐电株式会社 | 电子部件内置电路板及其制造方法 |
| JP2013247216A (ja) | 2012-05-25 | 2013-12-09 | Konica Minolta Inc | 圧電素子およびそれを備えたインクジェットヘッド |
| KR101814113B1 (ko) * | 2012-11-02 | 2018-01-02 | 삼성전기주식회사 | 인쇄회로기판의 제조방법 |
| KR101472672B1 (ko) * | 2013-04-26 | 2014-12-12 | 삼성전기주식회사 | 전자부품 내장 인쇄회로기판 및 그 제조방법 |
| KR101613525B1 (ko) * | 2014-10-15 | 2016-04-20 | 주식회사 심텍 | 피오피 타입의 인쇄회로기판 및 그 제조 방법 |
| JP6503687B2 (ja) * | 2014-10-23 | 2019-04-24 | イビデン株式会社 | プリント配線板 |
| KR102536256B1 (ko) * | 2015-04-03 | 2023-05-25 | 엘지이노텍 주식회사 | 임베디드 인쇄회로기판 |
| US9549468B1 (en) * | 2015-07-13 | 2017-01-17 | Advanced Semiconductor Engineering, Inc. | Semiconductor substrate, semiconductor module and method for manufacturing the same |
| US9686866B2 (en) | 2015-08-23 | 2017-06-20 | Unimicron Technology Corp. | Package structure and manufacturing method thereof |
| KR101726568B1 (ko) | 2016-02-24 | 2017-04-27 | 대덕전자 주식회사 | 회로기판 제조방법 |
| KR102501905B1 (ko) * | 2017-11-09 | 2023-02-21 | 삼성전기주식회사 | 인쇄회로기판 및 그 제조방법 |
| KR101912290B1 (ko) * | 2017-12-06 | 2018-10-29 | 삼성전기 주식회사 | 팬-아웃 반도체 패키지 |
| JP7016256B2 (ja) | 2017-12-28 | 2022-02-04 | 京セラ株式会社 | 印刷配線板の製造方法 |
| JP6978335B2 (ja) * | 2018-02-02 | 2021-12-08 | 新光電気工業株式会社 | 電子部品内蔵基板及びその製造方法と電子部品装置 |
| US20200053887A1 (en) * | 2018-08-09 | 2020-02-13 | At&S Austria Technologie & Systemtechnik Aktiengesellschaft | Mechanically Robust Component Carrier With Rigid and Flexible Portions |
| KR20200051215A (ko) | 2018-11-05 | 2020-05-13 | 삼성전기주식회사 | 인쇄회로기판 및 이를 포함하는 패키지 구조물 |
-
2019
- 2019-10-21 KR KR1020190130455A patent/KR102710005B1/ko active Active
-
2020
- 2020-10-21 CN CN202080073737.XA patent/CN114600562B/zh active Active
- 2020-10-21 US US17/770,757 patent/US12144116B2/en active Active
- 2020-10-21 WO PCT/KR2020/014386 patent/WO2021080305A1/ko not_active Ceased
- 2020-10-21 CN CN202411507300.9A patent/CN119545648A/zh active Pending
- 2020-10-21 JP JP2022523716A patent/JP7688631B2/ja active Active
-
2024
- 2024-09-20 KR KR1020240127169A patent/KR102915866B1/ko active Active
- 2024-10-09 US US18/910,822 patent/US20250031312A1/en active Pending
-
2025
- 2025-05-23 JP JP2025086443A patent/JP2025109988A/ja active Pending