CN114600562B - 印刷电路板 - Google Patents

印刷电路板 Download PDF

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Publication number
CN114600562B
CN114600562B CN202080073737.XA CN202080073737A CN114600562B CN 114600562 B CN114600562 B CN 114600562B CN 202080073737 A CN202080073737 A CN 202080073737A CN 114600562 B CN114600562 B CN 114600562B
Authority
CN
China
Prior art keywords
insulating layer
cavity
disposed
via electrode
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202080073737.XA
Other languages
English (en)
Chinese (zh)
Other versions
CN114600562A (zh
Inventor
申钟培
李秀旻
郑载勋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
LG Innotek Co Ltd
Original Assignee
LG Innotek Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by LG Innotek Co Ltd filed Critical LG Innotek Co Ltd
Priority to CN202411507300.9A priority Critical patent/CN119545648A/zh
Publication of CN114600562A publication Critical patent/CN114600562A/zh
Application granted granted Critical
Publication of CN114600562B publication Critical patent/CN114600562B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
    • H05K1/183—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC] associated with components mounted in and supported by recessed areas of the PCBs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
    • H05K1/185—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC] associated with components encapsulated in the insulating substrate of the PCBs; associated with components incorporated in internal layers of multilayer circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0041—Etching of the substrate by chemical or physical means by plasma etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4697—Manufacturing multilayer circuits having cavities, e.g. for mounting components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structure Of Printed Boards (AREA)
CN202080073737.XA 2019-10-21 2020-10-21 印刷电路板 Active CN114600562B (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202411507300.9A CN119545648A (zh) 2019-10-21 2020-10-21 印刷电路板

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
KR10-2019-0130455 2019-10-21
KR1020190130455A KR102710005B1 (ko) 2019-10-21 2019-10-21 회로기판
PCT/KR2020/014386 WO2021080305A1 (ko) 2019-10-21 2020-10-21 인쇄회로기판

Related Child Applications (1)

Application Number Title Priority Date Filing Date
CN202411507300.9A Division CN119545648A (zh) 2019-10-21 2020-10-21 印刷电路板

Publications (2)

Publication Number Publication Date
CN114600562A CN114600562A (zh) 2022-06-07
CN114600562B true CN114600562B (zh) 2024-11-15

Family

ID=75619445

Family Applications (2)

Application Number Title Priority Date Filing Date
CN202080073737.XA Active CN114600562B (zh) 2019-10-21 2020-10-21 印刷电路板
CN202411507300.9A Pending CN119545648A (zh) 2019-10-21 2020-10-21 印刷电路板

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN202411507300.9A Pending CN119545648A (zh) 2019-10-21 2020-10-21 印刷电路板

Country Status (5)

Country Link
US (2) US12144116B2 (https=)
JP (2) JP7688631B2 (https=)
KR (2) KR102710005B1 (https=)
CN (2) CN114600562B (https=)
WO (1) WO2021080305A1 (https=)

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KR102888075B1 (ko) * 2020-09-18 2025-11-19 엘지이노텍 주식회사 회로기판, 패키지 기판 및 이의 제조 방법
WO2022108386A1 (ko) * 2020-11-20 2022-05-27 엘지이노텍 주식회사 회로 기판
KR20220151431A (ko) * 2021-05-06 2022-11-15 삼성전기주식회사 인쇄회로기판
KR102824545B1 (ko) * 2021-08-10 2025-06-25 엘지이노텍 주식회사 회로 기판 및 이를 포함하는 안테나 패키지 기판
KR20230023492A (ko) * 2021-08-10 2023-02-17 엘지이노텍 주식회사 회로기판 및 이를 포함하는 패키지 기판
JP2024538347A (ja) * 2021-11-05 2024-10-18 エルジー イノテック カンパニー リミテッド 回路基板
EP4443500A4 (en) * 2021-11-29 2025-11-19 Lg Innotek Co Ltd PRINTED ROUTE MAP
KR20230105265A (ko) * 2022-01-03 2023-07-11 엘지이노텍 주식회사 회로 기판 및 이를 포함하는 반도체 패키지
CN118946454A (zh) * 2022-03-31 2024-11-12 三井金属矿业株式会社 带载体的金属箔
JP2025528230A (ja) * 2022-08-18 2025-08-26 エルジー イノテック カンパニー リミテッド 回路基板およびこれを含む半導体パッケージ
KR20250033675A (ko) * 2023-09-01 2025-03-10 삼성전기주식회사 인쇄회로기판
WO2025186425A1 (en) * 2024-03-07 2025-09-12 At&S Austria Technologie & Systemtechnik Aktiengesellschaft Component carrier with resin-embedded component, and manufacturing method
KR20260015585A (ko) * 2024-07-25 2026-02-03 엘지이노텍 주식회사 회로기판 및 반도체 패키지
KR102917261B1 (ko) * 2024-09-06 2026-01-23 엘지이노텍 주식회사 회로기판

Citations (2)

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CN103703874A (zh) * 2011-07-13 2014-04-02 揖斐电株式会社 电子部件内置电路板及其制造方法
CN111148347A (zh) * 2018-11-05 2020-05-12 三星电机株式会社 印刷电路板和封装结构

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US7056595B2 (en) 2003-01-30 2006-06-06 Metglas, Inc. Magnetic implement using magnetic metal ribbon coated with insulator
JP4669305B2 (ja) 2005-03-09 2011-04-13 日本特殊陶業株式会社 配線基板
US8101868B2 (en) 2005-10-14 2012-01-24 Ibiden Co., Ltd. Multilayered printed circuit board and method for manufacturing the same
KR100659510B1 (ko) 2006-02-16 2006-12-20 삼성전기주식회사 캐비티가 형성된 기판 제조 방법
CN103270819B (zh) * 2010-10-20 2016-12-07 Lg伊诺特有限公司 印刷电路板及其制造方法
JP2012164952A (ja) * 2011-01-20 2012-08-30 Ibiden Co Ltd 電子部品内蔵配線板及びその製造方法
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CN103703874A (zh) * 2011-07-13 2014-04-02 揖斐电株式会社 电子部件内置电路板及其制造方法
CN111148347A (zh) * 2018-11-05 2020-05-12 三星电机株式会社 印刷电路板和封装结构

Also Published As

Publication number Publication date
KR20210046978A (ko) 2021-04-29
CN119545648A (zh) 2025-02-28
CN114600562A (zh) 2022-06-07
JP7688631B2 (ja) 2025-06-04
JP2022553349A (ja) 2022-12-22
US20250031312A1 (en) 2025-01-23
US20220377902A1 (en) 2022-11-24
WO2021080305A1 (ko) 2021-04-29
KR102915866B1 (ko) 2026-01-21
KR102710005B1 (ko) 2024-09-26
US12144116B2 (en) 2024-11-12
KR20240145925A (ko) 2024-10-07
JP2025109988A (ja) 2025-07-25

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