KR102710005B1 - 회로기판 - Google Patents

회로기판 Download PDF

Info

Publication number
KR102710005B1
KR102710005B1 KR1020190130455A KR20190130455A KR102710005B1 KR 102710005 B1 KR102710005 B1 KR 102710005B1 KR 1020190130455 A KR1020190130455 A KR 1020190130455A KR 20190130455 A KR20190130455 A KR 20190130455A KR 102710005 B1 KR102710005 B1 KR 102710005B1
Authority
KR
South Korea
Prior art keywords
insulating layer
cavity
circuit board
layer
inclination angle
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020190130455A
Other languages
English (en)
Korean (ko)
Other versions
KR20210046978A (ko
Inventor
신종배
이수민
정재훈
Original Assignee
엘지이노텍 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to KR1020190130455A priority Critical patent/KR102710005B1/ko
Application filed by 엘지이노텍 주식회사 filed Critical 엘지이노텍 주식회사
Priority to US17/770,757 priority patent/US12144116B2/en
Priority to CN202411507300.9A priority patent/CN119545648A/zh
Priority to JP2022523716A priority patent/JP7688631B2/ja
Priority to PCT/KR2020/014386 priority patent/WO2021080305A1/ko
Priority to CN202080073737.XA priority patent/CN114600562B/zh
Publication of KR20210046978A publication Critical patent/KR20210046978A/ko
Priority to KR1020240127169A priority patent/KR102915866B1/ko
Application granted granted Critical
Publication of KR102710005B1 publication Critical patent/KR102710005B1/ko
Priority to US18/910,822 priority patent/US20250031312A1/en
Priority to JP2025086443A priority patent/JP2025109988A/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
    • H05K1/183—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC] associated with components mounted in and supported by recessed areas of the PCBs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
    • H05K1/185—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC] associated with components encapsulated in the insulating substrate of the PCBs; associated with components incorporated in internal layers of multilayer circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0041—Etching of the substrate by chemical or physical means by plasma etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4697—Manufacturing multilayer circuits having cavities, e.g. for mounting components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structure Of Printed Boards (AREA)
KR1020190130455A 2019-10-21 2019-10-21 회로기판 Active KR102710005B1 (ko)

Priority Applications (9)

Application Number Priority Date Filing Date Title
KR1020190130455A KR102710005B1 (ko) 2019-10-21 2019-10-21 회로기판
CN202411507300.9A CN119545648A (zh) 2019-10-21 2020-10-21 印刷电路板
JP2022523716A JP7688631B2 (ja) 2019-10-21 2020-10-21 回路基板
PCT/KR2020/014386 WO2021080305A1 (ko) 2019-10-21 2020-10-21 인쇄회로기판
US17/770,757 US12144116B2 (en) 2019-10-21 2020-10-21 Printed circuit board
CN202080073737.XA CN114600562B (zh) 2019-10-21 2020-10-21 印刷电路板
KR1020240127169A KR102915866B1 (ko) 2019-10-21 2024-09-20 회로 기판
US18/910,822 US20250031312A1 (en) 2019-10-21 2024-10-09 Printed circuit board
JP2025086443A JP2025109988A (ja) 2019-10-21 2025-05-23 回路基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020190130455A KR102710005B1 (ko) 2019-10-21 2019-10-21 회로기판

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020240127169A Division KR102915866B1 (ko) 2019-10-21 2024-09-20 회로 기판

Publications (2)

Publication Number Publication Date
KR20210046978A KR20210046978A (ko) 2021-04-29
KR102710005B1 true KR102710005B1 (ko) 2024-09-26

Family

ID=75619445

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020190130455A Active KR102710005B1 (ko) 2019-10-21 2019-10-21 회로기판
KR1020240127169A Active KR102915866B1 (ko) 2019-10-21 2024-09-20 회로 기판

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020240127169A Active KR102915866B1 (ko) 2019-10-21 2024-09-20 회로 기판

Country Status (5)

Country Link
US (2) US12144116B2 (https=)
JP (2) JP7688631B2 (https=)
KR (2) KR102710005B1 (https=)
CN (2) CN119545648A (https=)
WO (1) WO2021080305A1 (https=)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102888075B1 (ko) * 2020-09-18 2025-11-19 엘지이노텍 주식회사 회로기판, 패키지 기판 및 이의 제조 방법
US20230413425A1 (en) * 2020-11-20 2023-12-21 Lg Innotek Co., Ltd. Circuit board
KR20220151431A (ko) * 2021-05-06 2022-11-15 삼성전기주식회사 인쇄회로기판
KR102824545B1 (ko) * 2021-08-10 2025-06-25 엘지이노텍 주식회사 회로 기판 및 이를 포함하는 안테나 패키지 기판
KR20230023492A (ko) * 2021-08-10 2023-02-17 엘지이노텍 주식회사 회로기판 및 이를 포함하는 패키지 기판
KR20230065804A (ko) * 2021-11-05 2023-05-12 엘지이노텍 주식회사 회로기판 및 이를 포함하는 패키지 기판
JP2024544050A (ja) * 2021-11-29 2024-11-27 エルジー イノテック カンパニー リミテッド 回路基板
KR20230105265A (ko) * 2022-01-03 2023-07-11 엘지이노텍 주식회사 회로 기판 및 이를 포함하는 반도체 패키지
WO2023189839A1 (ja) * 2022-03-31 2023-10-05 三井金属鉱業株式会社 キャリア付金属箔
JP2025528230A (ja) * 2022-08-18 2025-08-26 エルジー イノテック カンパニー リミテッド 回路基板およびこれを含む半導体パッケージ
KR20250033675A (ko) * 2023-09-01 2025-03-10 삼성전기주식회사 인쇄회로기판
WO2025186425A1 (en) * 2024-03-07 2025-09-12 At&S Austria Technologie & Systemtechnik Aktiengesellschaft Component carrier with resin-embedded component, and manufacturing method
KR20260015585A (ko) * 2024-07-25 2026-02-03 엘지이노텍 주식회사 회로기판 및 반도체 패키지
KR102917261B1 (ko) * 2024-09-06 2026-01-23 엘지이노텍 주식회사 회로기판

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012164952A (ja) * 2011-01-20 2012-08-30 Ibiden Co Ltd 電子部品内蔵配線板及びその製造方法
KR101613525B1 (ko) * 2014-10-15 2016-04-20 주식회사 심텍 피오피 타입의 인쇄회로기판 및 그 제조 방법

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7056595B2 (en) 2003-01-30 2006-06-06 Metglas, Inc. Magnetic implement using magnetic metal ribbon coated with insulator
JP4669305B2 (ja) 2005-03-09 2011-04-13 日本特殊陶業株式会社 配線基板
US8101868B2 (en) * 2005-10-14 2012-01-24 Ibiden Co., Ltd. Multilayered printed circuit board and method for manufacturing the same
KR100659510B1 (ko) 2006-02-16 2006-12-20 삼성전기주식회사 캐비티가 형성된 기판 제조 방법
US9282626B2 (en) * 2010-10-20 2016-03-08 Lg Innotek Co., Ltd. Printed circuit board and method for manufacturing the same
KR20150024944A (ko) 2011-07-13 2015-03-09 이비덴 가부시키가이샤 전자 부품 내장 배선판 및 그 제조 방법
JP2013247216A (ja) 2012-05-25 2013-12-09 Konica Minolta Inc 圧電素子およびそれを備えたインクジェットヘッド
KR101814113B1 (ko) * 2012-11-02 2018-01-02 삼성전기주식회사 인쇄회로기판의 제조방법
KR101472672B1 (ko) * 2013-04-26 2014-12-12 삼성전기주식회사 전자부품 내장 인쇄회로기판 및 그 제조방법
JP6503687B2 (ja) * 2014-10-23 2019-04-24 イビデン株式会社 プリント配線板
KR102536256B1 (ko) * 2015-04-03 2023-05-25 엘지이노텍 주식회사 임베디드 인쇄회로기판
US9549468B1 (en) * 2015-07-13 2017-01-17 Advanced Semiconductor Engineering, Inc. Semiconductor substrate, semiconductor module and method for manufacturing the same
US9686866B2 (en) * 2015-08-23 2017-06-20 Unimicron Technology Corp. Package structure and manufacturing method thereof
KR101726568B1 (ko) 2016-02-24 2017-04-27 대덕전자 주식회사 회로기판 제조방법
KR102501905B1 (ko) * 2017-11-09 2023-02-21 삼성전기주식회사 인쇄회로기판 및 그 제조방법
KR101912290B1 (ko) * 2017-12-06 2018-10-29 삼성전기 주식회사 팬-아웃 반도체 패키지
JP7016256B2 (ja) * 2017-12-28 2022-02-04 京セラ株式会社 印刷配線板の製造方法
JP6978335B2 (ja) * 2018-02-02 2021-12-08 新光電気工業株式会社 電子部品内蔵基板及びその製造方法と電子部品装置
US20200053887A1 (en) * 2018-08-09 2020-02-13 At&S Austria Technologie & Systemtechnik Aktiengesellschaft Mechanically Robust Component Carrier With Rigid and Flexible Portions
KR20200051215A (ko) 2018-11-05 2020-05-13 삼성전기주식회사 인쇄회로기판 및 이를 포함하는 패키지 구조물

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012164952A (ja) * 2011-01-20 2012-08-30 Ibiden Co Ltd 電子部品内蔵配線板及びその製造方法
KR101613525B1 (ko) * 2014-10-15 2016-04-20 주식회사 심텍 피오피 타입의 인쇄회로기판 및 그 제조 방법

Also Published As

Publication number Publication date
WO2021080305A1 (ko) 2021-04-29
CN114600562B (zh) 2024-11-15
JP2022553349A (ja) 2022-12-22
US20220377902A1 (en) 2022-11-24
US12144116B2 (en) 2024-11-12
US20250031312A1 (en) 2025-01-23
KR20210046978A (ko) 2021-04-29
KR102915866B1 (ko) 2026-01-21
JP7688631B2 (ja) 2025-06-04
KR20240145925A (ko) 2024-10-07
CN114600562A (zh) 2022-06-07
JP2025109988A (ja) 2025-07-25
CN119545648A (zh) 2025-02-28

Similar Documents

Publication Publication Date Title
KR102915866B1 (ko) 회로 기판
KR102723475B1 (ko) 인쇄회로기판, 패키지 기판 및 이의 제조 방법
KR102888075B1 (ko) 회로기판, 패키지 기판 및 이의 제조 방법
KR102933077B1 (ko) 회로 기판
KR20250024013A (ko) 회로기판
KR102807658B1 (ko) 인쇄회로기판 및 이의 제조 방법
US12431419B2 (en) Circuit board
US20240237233A9 (en) Circuit board and package substrate comprising same
KR102820037B1 (ko) 회로기판
CN116982415A (zh) 电路板和包括该电路板的封装基板
KR102933074B1 (ko) 회로기판
JP2024524568A (ja) 回路基板
KR102957668B1 (ko) 인쇄회로기판, 패키지 기판 및 이의 제조 방법
KR102957669B1 (ko) 인쇄회로기판, 패키지 기판 및 이의 제조 방법
KR20220001202A (ko) 인쇄회로기판, 패키지 기판 및 이의 제조 방법
KR20220001183A (ko) 인쇄회로기판, 패키지 기판 및 이의 제조 방법

Legal Events

Date Code Title Description
PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

R15-X000 Change to inventor requested

St.27 status event code: A-3-3-R10-R15-oth-X000

R16-X000 Change to inventor recorded

St.27 status event code: A-3-3-R10-R16-oth-X000

PN2301 Change of applicant

St.27 status event code: A-3-3-R10-R13-asn-PN2301

St.27 status event code: A-3-3-R10-R11-asn-PN2301

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

A201 Request for examination
PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

D13-X000 Search requested

St.27 status event code: A-1-2-D10-D13-srh-X000

D14-X000 Search report completed

St.27 status event code: A-1-2-D10-D14-srh-X000

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

PA0107 Divisional application

St.27 status event code: A-0-1-A10-A18-div-PA0107

St.27 status event code: A-0-1-A10-A16-div-PA0107

PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U11-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601