JP7688631B2 - 回路基板 - Google Patents

回路基板 Download PDF

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Publication number
JP7688631B2
JP7688631B2 JP2022523716A JP2022523716A JP7688631B2 JP 7688631 B2 JP7688631 B2 JP 7688631B2 JP 2022523716 A JP2022523716 A JP 2022523716A JP 2022523716 A JP2022523716 A JP 2022523716A JP 7688631 B2 JP7688631 B2 JP 7688631B2
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JP
Japan
Prior art keywords
insulating layer
cavity
disposed
circuit board
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2022523716A
Other languages
English (en)
Japanese (ja)
Other versions
JP2022553349A (ja
JP2022553349A5 (https=
Inventor
チョン ペ シン
ス ミン イ
チェ フン チョン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
LG Innotek Co Ltd
Original Assignee
LG Innotek Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by LG Innotek Co Ltd filed Critical LG Innotek Co Ltd
Publication of JP2022553349A publication Critical patent/JP2022553349A/ja
Publication of JP2022553349A5 publication Critical patent/JP2022553349A5/ja
Priority to JP2025086443A priority Critical patent/JP2025109988A/ja
Application granted granted Critical
Publication of JP7688631B2 publication Critical patent/JP7688631B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
    • H05K1/183—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC] associated with components mounted in and supported by recessed areas of the PCBs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
    • H05K1/185—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC] associated with components encapsulated in the insulating substrate of the PCBs; associated with components incorporated in internal layers of multilayer circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0041—Etching of the substrate by chemical or physical means by plasma etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4697—Manufacturing multilayer circuits having cavities, e.g. for mounting components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structure Of Printed Boards (AREA)
JP2022523716A 2019-10-21 2020-10-21 回路基板 Active JP7688631B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2025086443A JP2025109988A (ja) 2019-10-21 2025-05-23 回路基板

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
KR10-2019-0130455 2019-10-21
KR1020190130455A KR102710005B1 (ko) 2019-10-21 2019-10-21 회로기판
PCT/KR2020/014386 WO2021080305A1 (ko) 2019-10-21 2020-10-21 인쇄회로기판

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2025086443A Division JP2025109988A (ja) 2019-10-21 2025-05-23 回路基板

Publications (3)

Publication Number Publication Date
JP2022553349A JP2022553349A (ja) 2022-12-22
JP2022553349A5 JP2022553349A5 (https=) 2024-03-28
JP7688631B2 true JP7688631B2 (ja) 2025-06-04

Family

ID=75619445

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2022523716A Active JP7688631B2 (ja) 2019-10-21 2020-10-21 回路基板
JP2025086443A Pending JP2025109988A (ja) 2019-10-21 2025-05-23 回路基板

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2025086443A Pending JP2025109988A (ja) 2019-10-21 2025-05-23 回路基板

Country Status (5)

Country Link
US (2) US12144116B2 (https=)
JP (2) JP7688631B2 (https=)
KR (2) KR102710005B1 (https=)
CN (2) CN114600562B (https=)
WO (1) WO2021080305A1 (https=)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102888075B1 (ko) * 2020-09-18 2025-11-19 엘지이노텍 주식회사 회로기판, 패키지 기판 및 이의 제조 방법
WO2022108386A1 (ko) * 2020-11-20 2022-05-27 엘지이노텍 주식회사 회로 기판
KR20220151431A (ko) * 2021-05-06 2022-11-15 삼성전기주식회사 인쇄회로기판
KR102824545B1 (ko) * 2021-08-10 2025-06-25 엘지이노텍 주식회사 회로 기판 및 이를 포함하는 안테나 패키지 기판
KR20230023492A (ko) * 2021-08-10 2023-02-17 엘지이노텍 주식회사 회로기판 및 이를 포함하는 패키지 기판
JP2024538347A (ja) * 2021-11-05 2024-10-18 エルジー イノテック カンパニー リミテッド 回路基板
EP4443500A4 (en) * 2021-11-29 2025-11-19 Lg Innotek Co Ltd PRINTED ROUTE MAP
KR20230105265A (ko) * 2022-01-03 2023-07-11 엘지이노텍 주식회사 회로 기판 및 이를 포함하는 반도체 패키지
CN118946454A (zh) * 2022-03-31 2024-11-12 三井金属矿业株式会社 带载体的金属箔
JP2025528230A (ja) * 2022-08-18 2025-08-26 エルジー イノテック カンパニー リミテッド 回路基板およびこれを含む半導体パッケージ
KR20250033675A (ko) * 2023-09-01 2025-03-10 삼성전기주식회사 인쇄회로기판
WO2025186425A1 (en) * 2024-03-07 2025-09-12 At&S Austria Technologie & Systemtechnik Aktiengesellschaft Component carrier with resin-embedded component, and manufacturing method
KR20260015585A (ko) * 2024-07-25 2026-02-03 엘지이노텍 주식회사 회로기판 및 반도체 패키지
KR102917261B1 (ko) * 2024-09-06 2026-01-23 엘지이노텍 주식회사 회로기판

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012164952A (ja) 2011-01-20 2012-08-30 Ibiden Co Ltd 電子部品内蔵配線板及びその製造方法
US20140321084A1 (en) 2013-04-26 2014-10-30 Samsung Electro-Mechanics Co., Ltd. Printed circuit board including electronic component embedded therein and method for manufacturing the same
JP2016086024A (ja) 2014-10-23 2016-05-19 イビデン株式会社 プリント配線板
JP2019134138A (ja) 2018-02-02 2019-08-08 新光電気工業株式会社 電子部品内蔵基板及びその製造方法と電子部品装置

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US7056595B2 (en) 2003-01-30 2006-06-06 Metglas, Inc. Magnetic implement using magnetic metal ribbon coated with insulator
JP4669305B2 (ja) 2005-03-09 2011-04-13 日本特殊陶業株式会社 配線基板
US8101868B2 (en) 2005-10-14 2012-01-24 Ibiden Co., Ltd. Multilayered printed circuit board and method for manufacturing the same
KR100659510B1 (ko) 2006-02-16 2006-12-20 삼성전기주식회사 캐비티가 형성된 기판 제조 방법
CN103270819B (zh) * 2010-10-20 2016-12-07 Lg伊诺特有限公司 印刷电路板及其制造方法
CN103703874A (zh) * 2011-07-13 2014-04-02 揖斐电株式会社 电子部件内置电路板及其制造方法
JP2013247216A (ja) 2012-05-25 2013-12-09 Konica Minolta Inc 圧電素子およびそれを備えたインクジェットヘッド
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KR102536256B1 (ko) * 2015-04-03 2023-05-25 엘지이노텍 주식회사 임베디드 인쇄회로기판
US9549468B1 (en) * 2015-07-13 2017-01-17 Advanced Semiconductor Engineering, Inc. Semiconductor substrate, semiconductor module and method for manufacturing the same
US9686866B2 (en) 2015-08-23 2017-06-20 Unimicron Technology Corp. Package structure and manufacturing method thereof
KR101726568B1 (ko) 2016-02-24 2017-04-27 대덕전자 주식회사 회로기판 제조방법
KR102501905B1 (ko) * 2017-11-09 2023-02-21 삼성전기주식회사 인쇄회로기판 및 그 제조방법
KR101912290B1 (ko) * 2017-12-06 2018-10-29 삼성전기 주식회사 팬-아웃 반도체 패키지
JP7016256B2 (ja) 2017-12-28 2022-02-04 京セラ株式会社 印刷配線板の製造方法
US20200053887A1 (en) * 2018-08-09 2020-02-13 At&S Austria Technologie & Systemtechnik Aktiengesellschaft Mechanically Robust Component Carrier With Rigid and Flexible Portions
KR20200051215A (ko) 2018-11-05 2020-05-13 삼성전기주식회사 인쇄회로기판 및 이를 포함하는 패키지 구조물

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012164952A (ja) 2011-01-20 2012-08-30 Ibiden Co Ltd 電子部品内蔵配線板及びその製造方法
US20140321084A1 (en) 2013-04-26 2014-10-30 Samsung Electro-Mechanics Co., Ltd. Printed circuit board including electronic component embedded therein and method for manufacturing the same
JP2016086024A (ja) 2014-10-23 2016-05-19 イビデン株式会社 プリント配線板
JP2019134138A (ja) 2018-02-02 2019-08-08 新光電気工業株式会社 電子部品内蔵基板及びその製造方法と電子部品装置

Also Published As

Publication number Publication date
KR20210046978A (ko) 2021-04-29
CN119545648A (zh) 2025-02-28
CN114600562A (zh) 2022-06-07
JP2022553349A (ja) 2022-12-22
US20250031312A1 (en) 2025-01-23
US20220377902A1 (en) 2022-11-24
WO2021080305A1 (ko) 2021-04-29
KR102915866B1 (ko) 2026-01-21
KR102710005B1 (ko) 2024-09-26
US12144116B2 (en) 2024-11-12
KR20240145925A (ko) 2024-10-07
JP2025109988A (ja) 2025-07-25
CN114600562B (zh) 2024-11-15

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