JPWO2021010754A5 - - Google Patents

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Publication number
JPWO2021010754A5
JPWO2021010754A5 JP2022502583A JP2022502583A JPWO2021010754A5 JP WO2021010754 A5 JPWO2021010754 A5 JP WO2021010754A5 JP 2022502583 A JP2022502583 A JP 2022502583A JP 2022502583 A JP2022502583 A JP 2022502583A JP WO2021010754 A5 JPWO2021010754 A5 JP WO2021010754A5
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JP
Japan
Prior art keywords
circuit pattern
insulating layer
circuit board
board according
width
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022502583A
Other languages
English (en)
Japanese (ja)
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JP2022540683A5 (https=
JP7654628B2 (ja
JP2022540683A (ja
Publication date
Priority claimed from KR1020190085102A external-priority patent/KR102872350B1/ko
Application filed filed Critical
Publication of JP2022540683A publication Critical patent/JP2022540683A/ja
Publication of JP2022540683A5 publication Critical patent/JP2022540683A5/ja
Publication of JPWO2021010754A5 publication Critical patent/JPWO2021010754A5/ja
Application granted granted Critical
Publication of JP7654628B2 publication Critical patent/JP7654628B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2022502583A 2019-07-15 2020-07-15 プリント回路基板 Active JP7654628B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
KR10-2019-0085102 2019-07-15
KR1020190085102A KR102872350B1 (ko) 2019-07-15 2019-07-15 회로기판
PCT/KR2020/009340 WO2021010754A1 (ko) 2019-07-15 2020-07-15 인쇄회로기판

Publications (4)

Publication Number Publication Date
JP2022540683A JP2022540683A (ja) 2022-09-16
JP2022540683A5 JP2022540683A5 (https=) 2024-03-12
JPWO2021010754A5 true JPWO2021010754A5 (https=) 2024-03-12
JP7654628B2 JP7654628B2 (ja) 2025-04-01

Family

ID=74210970

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022502583A Active JP7654628B2 (ja) 2019-07-15 2020-07-15 プリント回路基板

Country Status (5)

Country Link
US (1) US20220264750A1 (https=)
JP (1) JP7654628B2 (https=)
KR (1) KR102872350B1 (https=)
CN (1) CN114128409A (https=)
WO (1) WO2021010754A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20220103965A (ko) * 2019-11-19 2022-07-25 도판 인사츠 가부시키가이샤 포장체의 제조 방법, 포장재용 필름 그리고 이것을 구비하는 적층 필름 및 포장재

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3800405B2 (ja) * 2001-12-26 2006-07-26 富士通株式会社 多層回路基板の製造方法
JP2007180105A (ja) * 2005-12-27 2007-07-12 Sanyo Electric Co Ltd 回路基板、回路基板を用いた回路装置、及び回路基板の製造方法
JP2008047655A (ja) * 2006-08-11 2008-02-28 Mitsui Mining & Smelting Co Ltd 配線基板およびその製造方法
JP2009158593A (ja) * 2007-12-25 2009-07-16 Tessera Interconnect Materials Inc バンプ構造およびその製造方法
KR100999506B1 (ko) * 2008-09-09 2010-12-09 삼성전기주식회사 인쇄회로기판 및 그 제조 방법
US20110299259A1 (en) * 2010-06-04 2011-12-08 Yu-Ling Hsieh Circuit board with conductor post structure
US8755196B2 (en) * 2010-07-09 2014-06-17 Ibiden Co., Ltd. Wiring board and method for manufacturing the same
JP2013149948A (ja) * 2011-12-20 2013-08-01 Ngk Spark Plug Co Ltd 配線基板及びその製造方法
JP2013149810A (ja) * 2012-01-20 2013-08-01 Ngk Spark Plug Co Ltd 多層配線基板の製造方法
KR101987374B1 (ko) * 2012-10-04 2019-06-11 엘지이노텍 주식회사 인쇄회로기판 및 그의 제조 방법
KR101501902B1 (ko) * 2013-07-16 2015-03-13 주식회사 심텍 금속 포스트를 구비한 인쇄회로기판 및 이의 제조 방법
JP2015041729A (ja) * 2013-08-23 2015-03-02 イビデン株式会社 プリント配線板
JP5795415B1 (ja) * 2014-08-29 2015-10-14 新光電気工業株式会社 配線基板及びその製造方法
JP2015167254A (ja) * 2015-05-21 2015-09-24 株式会社テラプローブ 半導体装置、その実装構造及びその製造方法
KR102333092B1 (ko) * 2015-07-15 2021-12-01 삼성전기주식회사 회로 기판 및 그 제조 방법
KR20170079542A (ko) * 2015-12-30 2017-07-10 삼성전기주식회사 인쇄회로기판
KR102473417B1 (ko) * 2016-04-27 2022-12-02 삼성전기주식회사 인쇄회로기판 및 그 제조방법
CN110612783B (zh) * 2017-05-16 2022-11-01 住友电工印刷电路株式会社 印刷配线板及其制造方法
JP7240909B2 (ja) * 2019-03-13 2023-03-16 新光電気工業株式会社 配線基板及びその製造方法
JP2020188208A (ja) * 2019-05-16 2020-11-19 イビデン株式会社 プリント配線板とプリント配線板の製造方法
JP7387453B2 (ja) * 2020-01-10 2023-11-28 住友電気工業株式会社 フレキシブルプリント配線板及びその製造方法

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