CN114128409A - 印刷电路板 - Google Patents

印刷电路板 Download PDF

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Publication number
CN114128409A
CN114128409A CN202080051614.6A CN202080051614A CN114128409A CN 114128409 A CN114128409 A CN 114128409A CN 202080051614 A CN202080051614 A CN 202080051614A CN 114128409 A CN114128409 A CN 114128409A
Authority
CN
China
Prior art keywords
insulating layer
circuit pattern
disposed
height
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202080051614.6A
Other languages
English (en)
Chinese (zh)
Inventor
柳到爀
罗世雄
明世镐
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
LG Innotek Co Ltd
Original Assignee
LG Innotek Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by LG Innotek Co Ltd filed Critical LG Innotek Co Ltd
Publication of CN114128409A publication Critical patent/CN114128409A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0212—Resin particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1377—Protective layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/465—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits by applying an insulating layer having channels for the next circuit layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
CN202080051614.6A 2019-07-15 2020-07-15 印刷电路板 Pending CN114128409A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
KR10-2019-0085102 2019-07-15
KR1020190085102A KR102872350B1 (ko) 2019-07-15 2019-07-15 회로기판
PCT/KR2020/009340 WO2021010754A1 (ko) 2019-07-15 2020-07-15 인쇄회로기판

Publications (1)

Publication Number Publication Date
CN114128409A true CN114128409A (zh) 2022-03-01

Family

ID=74210970

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202080051614.6A Pending CN114128409A (zh) 2019-07-15 2020-07-15 印刷电路板

Country Status (5)

Country Link
US (1) US20220264750A1 (https=)
JP (1) JP7654628B2 (https=)
KR (1) KR102872350B1 (https=)
CN (1) CN114128409A (https=)
WO (1) WO2021010754A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20220103965A (ko) * 2019-11-19 2022-07-25 도판 인사츠 가부시키가이샤 포장체의 제조 방법, 포장재용 필름 그리고 이것을 구비하는 적층 필름 및 포장재

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104718802A (zh) * 2012-10-04 2015-06-17 Lg伊诺特有限公司 印刷电路板及其制造方法
US20170019989A1 (en) * 2015-07-15 2017-01-19 Samsung Electro-Mechanics Co., Ltd. Circuit board and manufacturing method of the same
KR20170079542A (ko) * 2015-12-30 2017-07-10 삼성전기주식회사 인쇄회로기판
KR20170122500A (ko) * 2016-04-27 2017-11-06 삼성전기주식회사 인쇄회로기판 및 그 제조방법

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3800405B2 (ja) * 2001-12-26 2006-07-26 富士通株式会社 多層回路基板の製造方法
JP2007180105A (ja) * 2005-12-27 2007-07-12 Sanyo Electric Co Ltd 回路基板、回路基板を用いた回路装置、及び回路基板の製造方法
JP2008047655A (ja) * 2006-08-11 2008-02-28 Mitsui Mining & Smelting Co Ltd 配線基板およびその製造方法
JP2009158593A (ja) * 2007-12-25 2009-07-16 Tessera Interconnect Materials Inc バンプ構造およびその製造方法
KR100999506B1 (ko) * 2008-09-09 2010-12-09 삼성전기주식회사 인쇄회로기판 및 그 제조 방법
US20110299259A1 (en) * 2010-06-04 2011-12-08 Yu-Ling Hsieh Circuit board with conductor post structure
US8755196B2 (en) * 2010-07-09 2014-06-17 Ibiden Co., Ltd. Wiring board and method for manufacturing the same
JP2013149948A (ja) * 2011-12-20 2013-08-01 Ngk Spark Plug Co Ltd 配線基板及びその製造方法
JP2013149810A (ja) * 2012-01-20 2013-08-01 Ngk Spark Plug Co Ltd 多層配線基板の製造方法
KR101501902B1 (ko) * 2013-07-16 2015-03-13 주식회사 심텍 금속 포스트를 구비한 인쇄회로기판 및 이의 제조 방법
JP2015041729A (ja) * 2013-08-23 2015-03-02 イビデン株式会社 プリント配線板
JP5795415B1 (ja) * 2014-08-29 2015-10-14 新光電気工業株式会社 配線基板及びその製造方法
JP2015167254A (ja) * 2015-05-21 2015-09-24 株式会社テラプローブ 半導体装置、その実装構造及びその製造方法
CN110612783B (zh) * 2017-05-16 2022-11-01 住友电工印刷电路株式会社 印刷配线板及其制造方法
JP7240909B2 (ja) * 2019-03-13 2023-03-16 新光電気工業株式会社 配線基板及びその製造方法
JP2020188208A (ja) * 2019-05-16 2020-11-19 イビデン株式会社 プリント配線板とプリント配線板の製造方法
JP7387453B2 (ja) * 2020-01-10 2023-11-28 住友電気工業株式会社 フレキシブルプリント配線板及びその製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104718802A (zh) * 2012-10-04 2015-06-17 Lg伊诺特有限公司 印刷电路板及其制造方法
US20170019989A1 (en) * 2015-07-15 2017-01-19 Samsung Electro-Mechanics Co., Ltd. Circuit board and manufacturing method of the same
KR20170079542A (ko) * 2015-12-30 2017-07-10 삼성전기주식회사 인쇄회로기판
KR20170122500A (ko) * 2016-04-27 2017-11-06 삼성전기주식회사 인쇄회로기판 및 그 제조방법

Also Published As

Publication number Publication date
KR102872350B1 (ko) 2025-10-17
US20220264750A1 (en) 2022-08-18
KR20210008671A (ko) 2021-01-25
WO2021010754A1 (ko) 2021-01-21
JP7654628B2 (ja) 2025-04-01
JP2022540683A (ja) 2022-09-16

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