KR102872350B1 - 회로기판 - Google Patents

회로기판

Info

Publication number
KR102872350B1
KR102872350B1 KR1020190085102A KR20190085102A KR102872350B1 KR 102872350 B1 KR102872350 B1 KR 102872350B1 KR 1020190085102 A KR1020190085102 A KR 1020190085102A KR 20190085102 A KR20190085102 A KR 20190085102A KR 102872350 B1 KR102872350 B1 KR 102872350B1
Authority
KR
South Korea
Prior art keywords
insulating layer
circuit pattern
circuit board
circuit
pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020190085102A
Other languages
English (en)
Korean (ko)
Other versions
KR20210008671A (ko
Inventor
유도혁
라세웅
명세호
Original Assignee
엘지이노텍 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 엘지이노텍 주식회사 filed Critical 엘지이노텍 주식회사
Priority to KR1020190085102A priority Critical patent/KR102872350B1/ko
Priority to CN202080051614.6A priority patent/CN114128409A/zh
Priority to JP2022502583A priority patent/JP7654628B2/ja
Priority to US17/628,178 priority patent/US20220264750A1/en
Priority to PCT/KR2020/009340 priority patent/WO2021010754A1/ko
Publication of KR20210008671A publication Critical patent/KR20210008671A/ko
Application granted granted Critical
Publication of KR102872350B1 publication Critical patent/KR102872350B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0212—Resin particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1377—Protective layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/465—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits by applying an insulating layer having channels for the next circuit layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
KR1020190085102A 2019-07-15 2019-07-15 회로기판 Active KR102872350B1 (ko)

Priority Applications (5)

Application Number Priority Date Filing Date Title
KR1020190085102A KR102872350B1 (ko) 2019-07-15 2019-07-15 회로기판
CN202080051614.6A CN114128409A (zh) 2019-07-15 2020-07-15 印刷电路板
JP2022502583A JP7654628B2 (ja) 2019-07-15 2020-07-15 プリント回路基板
US17/628,178 US20220264750A1 (en) 2019-07-15 2020-07-15 Printed circuit board
PCT/KR2020/009340 WO2021010754A1 (ko) 2019-07-15 2020-07-15 인쇄회로기판

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020190085102A KR102872350B1 (ko) 2019-07-15 2019-07-15 회로기판

Publications (2)

Publication Number Publication Date
KR20210008671A KR20210008671A (ko) 2021-01-25
KR102872350B1 true KR102872350B1 (ko) 2025-10-17

Family

ID=74210970

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020190085102A Active KR102872350B1 (ko) 2019-07-15 2019-07-15 회로기판

Country Status (5)

Country Link
US (1) US20220264750A1 (https=)
JP (1) JP7654628B2 (https=)
KR (1) KR102872350B1 (https=)
CN (1) CN114128409A (https=)
WO (1) WO2021010754A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20220103965A (ko) * 2019-11-19 2022-07-25 도판 인사츠 가부시키가이샤 포장체의 제조 방법, 포장재용 필름 그리고 이것을 구비하는 적층 필름 및 포장재

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013149810A (ja) * 2012-01-20 2013-08-01 Ngk Spark Plug Co Ltd 多層配線基板の製造方法

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3800405B2 (ja) * 2001-12-26 2006-07-26 富士通株式会社 多層回路基板の製造方法
JP2007180105A (ja) * 2005-12-27 2007-07-12 Sanyo Electric Co Ltd 回路基板、回路基板を用いた回路装置、及び回路基板の製造方法
JP2008047655A (ja) * 2006-08-11 2008-02-28 Mitsui Mining & Smelting Co Ltd 配線基板およびその製造方法
JP2009158593A (ja) * 2007-12-25 2009-07-16 Tessera Interconnect Materials Inc バンプ構造およびその製造方法
KR100999506B1 (ko) * 2008-09-09 2010-12-09 삼성전기주식회사 인쇄회로기판 및 그 제조 방법
US20110299259A1 (en) * 2010-06-04 2011-12-08 Yu-Ling Hsieh Circuit board with conductor post structure
US8755196B2 (en) * 2010-07-09 2014-06-17 Ibiden Co., Ltd. Wiring board and method for manufacturing the same
JP2013149948A (ja) * 2011-12-20 2013-08-01 Ngk Spark Plug Co Ltd 配線基板及びその製造方法
KR101987374B1 (ko) * 2012-10-04 2019-06-11 엘지이노텍 주식회사 인쇄회로기판 및 그의 제조 방법
KR101501902B1 (ko) * 2013-07-16 2015-03-13 주식회사 심텍 금속 포스트를 구비한 인쇄회로기판 및 이의 제조 방법
JP2015041729A (ja) * 2013-08-23 2015-03-02 イビデン株式会社 プリント配線板
JP5795415B1 (ja) * 2014-08-29 2015-10-14 新光電気工業株式会社 配線基板及びその製造方法
JP2015167254A (ja) * 2015-05-21 2015-09-24 株式会社テラプローブ 半導体装置、その実装構造及びその製造方法
KR102333092B1 (ko) * 2015-07-15 2021-12-01 삼성전기주식회사 회로 기판 및 그 제조 방법
KR20170079542A (ko) * 2015-12-30 2017-07-10 삼성전기주식회사 인쇄회로기판
KR102473417B1 (ko) * 2016-04-27 2022-12-02 삼성전기주식회사 인쇄회로기판 및 그 제조방법
CN110612783B (zh) * 2017-05-16 2022-11-01 住友电工印刷电路株式会社 印刷配线板及其制造方法
JP7240909B2 (ja) * 2019-03-13 2023-03-16 新光電気工業株式会社 配線基板及びその製造方法
JP2020188208A (ja) * 2019-05-16 2020-11-19 イビデン株式会社 プリント配線板とプリント配線板の製造方法
JP7387453B2 (ja) * 2020-01-10 2023-11-28 住友電気工業株式会社 フレキシブルプリント配線板及びその製造方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013149810A (ja) * 2012-01-20 2013-08-01 Ngk Spark Plug Co Ltd 多層配線基板の製造方法

Also Published As

Publication number Publication date
US20220264750A1 (en) 2022-08-18
KR20210008671A (ko) 2021-01-25
WO2021010754A1 (ko) 2021-01-21
JP7654628B2 (ja) 2025-04-01
CN114128409A (zh) 2022-03-01
JP2022540683A (ja) 2022-09-16

Similar Documents

Publication Publication Date Title
US8785789B2 (en) Printed circuit board and method for manufacturing the same
KR102942636B1 (ko) 연성 인쇄회로기판, cof 모듈 및 이를 포함하는 전자디바이스
KR102938483B1 (ko) 연성 인쇄회로기판, cof 모듈 및 이를 포함하는 전자디바이스
KR102909754B1 (ko) 인쇄회로기판 및 이의 제조 방법
CN102573278A (zh) 多层布线基板
KR102872348B1 (ko) 인쇄회로기판 및 이의 제조 방법
KR102872350B1 (ko) 회로기판
US20250125269A1 (en) Circuit board
KR102820035B1 (ko) 인쇄회로기판 및 이의 제조 방법
KR20250078881A (ko) 인쇄회로기판 및 이의 제조 방법
KR102901381B1 (ko) 회로 기판
KR102934729B1 (ko) 인쇄회로기판 및 이의 제조 방법
KR102928946B1 (ko) 회로기판 및 이를 포함하는 패키지 기판
US12538423B2 (en) Circuit board
KR102898765B1 (ko) 회로 기판
KR102909759B1 (ko) 회로기판 및 이의 제조 방법
KR102159547B1 (ko) 패키지 기판 및 그의 제조 방법
KR102933098B1 (ko) 인쇄회로기판 및 이의 제조 방법
KR102909757B1 (ko) 회로기판 및 이의 제조 방법
KR102894732B1 (ko) 회로기판 및 이의 제조 방법
JP5184578B2 (ja) プリント配線基板
KR20150115346A (ko) 인쇄회로기판 및 이의 제조 방법
KR20240001552A (ko) 연성 인쇄회로기판, cof 모듈 및 이를 포함하는 전자디바이스
KR20230065808A (ko) 회로기판 및 이를 포함하는 패키지 기판
JPH05335734A (ja) プリント配線板

Legal Events

Date Code Title Description
PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

PN2301 Change of applicant

St.27 status event code: A-3-3-R10-R13-asn-PN2301

St.27 status event code: A-3-3-R10-R11-asn-PN2301

A201 Request for examination
PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

D13-X000 Search requested

St.27 status event code: A-1-2-D10-D13-srh-X000

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

D22 Grant of ip right intended

Free format text: ST27 STATUS EVENT CODE: A-1-2-D10-D22-EXM-PE0701 (AS PROVIDED BY THE NATIONAL OFFICE)

PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

F11 Ip right granted following substantive examination

Free format text: ST27 STATUS EVENT CODE: A-2-4-F10-F11-EXM-PR0701 (AS PROVIDED BY THE NATIONAL OFFICE)

PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U11-oth-PR1002

Fee payment year number: 1

U11 Full renewal or maintenance fee paid

Free format text: ST27 STATUS EVENT CODE: A-2-2-U10-U11-OTH-PR1002 (AS PROVIDED BY THE NATIONAL OFFICE)

Year of fee payment: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

Q13 Ip right document published

Free format text: ST27 STATUS EVENT CODE: A-4-4-Q10-Q13-NAP-PG1601 (AS PROVIDED BY THE NATIONAL OFFICE)