JP7654628B2 - プリント回路基板 - Google Patents

プリント回路基板 Download PDF

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Publication number
JP7654628B2
JP7654628B2 JP2022502583A JP2022502583A JP7654628B2 JP 7654628 B2 JP7654628 B2 JP 7654628B2 JP 2022502583 A JP2022502583 A JP 2022502583A JP 2022502583 A JP2022502583 A JP 2022502583A JP 7654628 B2 JP7654628 B2 JP 7654628B2
Authority
JP
Japan
Prior art keywords
insulating layer
circuit pattern
circuit board
circuit
disposed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2022502583A
Other languages
English (en)
Japanese (ja)
Other versions
JP2022540683A5 (https=
JP2022540683A (ja
JPWO2021010754A5 (https=
Inventor
ト ヒョク ユ
セ ウン ナ
セ ホ ミョン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
LG Innotek Co Ltd
Original Assignee
LG Innotek Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by LG Innotek Co Ltd filed Critical LG Innotek Co Ltd
Publication of JP2022540683A publication Critical patent/JP2022540683A/ja
Publication of JP2022540683A5 publication Critical patent/JP2022540683A5/ja
Publication of JPWO2021010754A5 publication Critical patent/JPWO2021010754A5/ja
Application granted granted Critical
Publication of JP7654628B2 publication Critical patent/JP7654628B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0212—Resin particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1377—Protective layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/465—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits by applying an insulating layer having channels for the next circuit layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP2022502583A 2019-07-15 2020-07-15 プリント回路基板 Active JP7654628B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
KR10-2019-0085102 2019-07-15
KR1020190085102A KR102872350B1 (ko) 2019-07-15 2019-07-15 회로기판
PCT/KR2020/009340 WO2021010754A1 (ko) 2019-07-15 2020-07-15 인쇄회로기판

Publications (4)

Publication Number Publication Date
JP2022540683A JP2022540683A (ja) 2022-09-16
JP2022540683A5 JP2022540683A5 (https=) 2024-03-12
JPWO2021010754A5 JPWO2021010754A5 (https=) 2024-03-12
JP7654628B2 true JP7654628B2 (ja) 2025-04-01

Family

ID=74210970

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022502583A Active JP7654628B2 (ja) 2019-07-15 2020-07-15 プリント回路基板

Country Status (5)

Country Link
US (1) US20220264750A1 (https=)
JP (1) JP7654628B2 (https=)
KR (1) KR102872350B1 (https=)
CN (1) CN114128409A (https=)
WO (1) WO2021010754A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20220103965A (ko) * 2019-11-19 2022-07-25 도판 인사츠 가부시키가이샤 포장체의 제조 방법, 포장재용 필름 그리고 이것을 구비하는 적층 필름 및 포장재

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008047655A (ja) 2006-08-11 2008-02-28 Mitsui Mining & Smelting Co Ltd 配線基板およびその製造方法
US20110299259A1 (en) 2010-06-04 2011-12-08 Yu-Ling Hsieh Circuit board with conductor post structure
JP2015167254A (ja) 2015-05-21 2015-09-24 株式会社テラプローブ 半導体装置、その実装構造及びその製造方法

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3800405B2 (ja) * 2001-12-26 2006-07-26 富士通株式会社 多層回路基板の製造方法
JP2007180105A (ja) * 2005-12-27 2007-07-12 Sanyo Electric Co Ltd 回路基板、回路基板を用いた回路装置、及び回路基板の製造方法
JP2009158593A (ja) * 2007-12-25 2009-07-16 Tessera Interconnect Materials Inc バンプ構造およびその製造方法
KR100999506B1 (ko) * 2008-09-09 2010-12-09 삼성전기주식회사 인쇄회로기판 및 그 제조 방법
US8755196B2 (en) * 2010-07-09 2014-06-17 Ibiden Co., Ltd. Wiring board and method for manufacturing the same
JP2013149948A (ja) * 2011-12-20 2013-08-01 Ngk Spark Plug Co Ltd 配線基板及びその製造方法
JP2013149810A (ja) * 2012-01-20 2013-08-01 Ngk Spark Plug Co Ltd 多層配線基板の製造方法
KR101987374B1 (ko) * 2012-10-04 2019-06-11 엘지이노텍 주식회사 인쇄회로기판 및 그의 제조 방법
KR101501902B1 (ko) * 2013-07-16 2015-03-13 주식회사 심텍 금속 포스트를 구비한 인쇄회로기판 및 이의 제조 방법
JP2015041729A (ja) * 2013-08-23 2015-03-02 イビデン株式会社 プリント配線板
JP5795415B1 (ja) * 2014-08-29 2015-10-14 新光電気工業株式会社 配線基板及びその製造方法
KR102333092B1 (ko) * 2015-07-15 2021-12-01 삼성전기주식회사 회로 기판 및 그 제조 방법
KR20170079542A (ko) * 2015-12-30 2017-07-10 삼성전기주식회사 인쇄회로기판
KR102473417B1 (ko) * 2016-04-27 2022-12-02 삼성전기주식회사 인쇄회로기판 및 그 제조방법
CN110612783B (zh) * 2017-05-16 2022-11-01 住友电工印刷电路株式会社 印刷配线板及其制造方法
JP7240909B2 (ja) * 2019-03-13 2023-03-16 新光電気工業株式会社 配線基板及びその製造方法
JP2020188208A (ja) * 2019-05-16 2020-11-19 イビデン株式会社 プリント配線板とプリント配線板の製造方法
JP7387453B2 (ja) * 2020-01-10 2023-11-28 住友電気工業株式会社 フレキシブルプリント配線板及びその製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008047655A (ja) 2006-08-11 2008-02-28 Mitsui Mining & Smelting Co Ltd 配線基板およびその製造方法
US20110299259A1 (en) 2010-06-04 2011-12-08 Yu-Ling Hsieh Circuit board with conductor post structure
JP2015167254A (ja) 2015-05-21 2015-09-24 株式会社テラプローブ 半導体装置、その実装構造及びその製造方法

Also Published As

Publication number Publication date
KR102872350B1 (ko) 2025-10-17
US20220264750A1 (en) 2022-08-18
KR20210008671A (ko) 2021-01-25
WO2021010754A1 (ko) 2021-01-21
CN114128409A (zh) 2022-03-01
JP2022540683A (ja) 2022-09-16

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