JP2024069349A5 - - Google Patents

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Publication number
JP2024069349A5
JP2024069349A5 JP2024034967A JP2024034967A JP2024069349A5 JP 2024069349 A5 JP2024069349 A5 JP 2024069349A5 JP 2024034967 A JP2024034967 A JP 2024034967A JP 2024034967 A JP2024034967 A JP 2024034967A JP 2024069349 A5 JP2024069349 A5 JP 2024069349A5
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JP
Japan
Prior art keywords
outermost
wiring
base material
insulating layer
height
Prior art date
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Application number
JP2024034967A
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English (en)
Japanese (ja)
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JP7708256B2 (ja
JP2024069349A (ja
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Priority claimed from JP2019216996A external-priority patent/JP7451971B2/ja
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Priority to JP2024034967A priority Critical patent/JP7708256B2/ja
Publication of JP2024069349A publication Critical patent/JP2024069349A/ja
Publication of JP2024069349A5 publication Critical patent/JP2024069349A5/ja
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Publication of JP7708256B2 publication Critical patent/JP7708256B2/ja
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JP2024034967A 2019-11-29 2024-03-07 配線基板 Active JP7708256B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2024034967A JP7708256B2 (ja) 2019-11-29 2024-03-07 配線基板

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019216996A JP7451971B2 (ja) 2019-11-29 2019-11-29 配線基板
JP2024034967A JP7708256B2 (ja) 2019-11-29 2024-03-07 配線基板

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2019216996A Division JP7451971B2 (ja) 2019-11-29 2019-11-29 配線基板

Publications (3)

Publication Number Publication Date
JP2024069349A JP2024069349A (ja) 2024-05-21
JP2024069349A5 true JP2024069349A5 (https=) 2024-08-01
JP7708256B2 JP7708256B2 (ja) 2025-07-15

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ID=76088557

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2019216996A Active JP7451971B2 (ja) 2019-11-29 2019-11-29 配線基板
JP2024034967A Active JP7708256B2 (ja) 2019-11-29 2024-03-07 配線基板

Family Applications Before (1)

Application Number Title Priority Date Filing Date
JP2019216996A Active JP7451971B2 (ja) 2019-11-29 2019-11-29 配線基板

Country Status (1)

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JP (2) JP7451971B2 (https=)

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6473696A (en) * 1987-09-14 1989-03-17 Canon Kk Printed-circuit board
JPH0268474U (https=) * 1988-11-15 1990-05-24
TW448524B (en) * 1997-01-17 2001-08-01 Seiko Epson Corp Electronic component, semiconductor device, manufacturing method therefor, circuit board and electronic equipment
JP2002217329A (ja) * 2001-01-22 2002-08-02 Mitsubishi Electric Corp 半導体装置
JP3983996B2 (ja) * 2001-04-23 2007-09-26 株式会社ルネサステクノロジ 半導体集積回路装置
TWI245597B (en) * 2003-06-30 2005-12-11 Siliconware Precision Industries Co Ltd Printed circuit boards and method for fabricating the same
JP5341227B1 (ja) 2012-05-16 2013-11-13 日本特殊陶業株式会社 配線基板
JP6171829B2 (ja) * 2013-01-30 2017-08-02 株式会社デンソー Ｂｇａ型部品実装用の多層基板の製造方法
JP6185880B2 (ja) * 2014-05-13 2017-08-23 日本特殊陶業株式会社 配線基板の製造方法及び配線基板
JP6434328B2 (ja) 2015-02-04 2018-12-05 新光電気工業株式会社 配線基板及び電子部品装置とそれらの製造方法
JP2016162770A (ja) 2015-02-26 2016-09-05 イビデン株式会社 プリント配線板
JP6608108B2 (ja) 2015-12-25 2019-11-20 新光電気工業株式会社 配線基板、半導体装置及び配線基板の製造方法

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