JP7451971B2 - 配線基板 - Google Patents

配線基板 Download PDF

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Publication number
JP7451971B2
JP7451971B2 JP2019216996A JP2019216996A JP7451971B2 JP 7451971 B2 JP7451971 B2 JP 7451971B2 JP 2019216996 A JP2019216996 A JP 2019216996A JP 2019216996 A JP2019216996 A JP 2019216996A JP 7451971 B2 JP7451971 B2 JP 7451971B2
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JP
Japan
Prior art keywords
insulating layer
base material
wiring
outermost
height
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2019216996A
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English (en)
Japanese (ja)
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JP2021086983A (ja
Inventor
敦子 千吉良
祐治 成田
誠治 俵屋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dai Nippon Printing Co Ltd
Original Assignee
Dai Nippon Printing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dai Nippon Printing Co Ltd filed Critical Dai Nippon Printing Co Ltd
Priority to JP2019216996A priority Critical patent/JP7451971B2/ja
Publication of JP2021086983A publication Critical patent/JP2021086983A/ja
Priority to JP2024034967A priority patent/JP7708256B2/ja
Application granted granted Critical
Publication of JP7451971B2 publication Critical patent/JP7451971B2/ja
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  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP2019216996A 2019-11-29 2019-11-29 配線基板 Active JP7451971B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2019216996A JP7451971B2 (ja) 2019-11-29 2019-11-29 配線基板
JP2024034967A JP7708256B2 (ja) 2019-11-29 2024-03-07 配線基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2019216996A JP7451971B2 (ja) 2019-11-29 2019-11-29 配線基板

Related Child Applications (1)

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JP2024034967A Division JP7708256B2 (ja) 2019-11-29 2024-03-07 配線基板

Publications (2)

Publication Number Publication Date
JP2021086983A JP2021086983A (ja) 2021-06-03
JP7451971B2 true JP7451971B2 (ja) 2024-03-19

Family

ID=76088557

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2019216996A Active JP7451971B2 (ja) 2019-11-29 2019-11-29 配線基板
JP2024034967A Active JP7708256B2 (ja) 2019-11-29 2024-03-07 配線基板

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2024034967A Active JP7708256B2 (ja) 2019-11-29 2024-03-07 配線基板

Country Status (1)

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JP (2) JP7451971B2 (https=)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013171964A1 (ja) 2012-05-16 2013-11-21 日本特殊陶業株式会社 配線基板
JP2016143810A (ja) 2015-02-04 2016-08-08 新光電気工業株式会社 配線基板及び電子部品装置とそれらの製造方法
JP2016162770A (ja) 2015-02-26 2016-09-05 イビデン株式会社 プリント配線板
JP2017118067A (ja) 2015-12-25 2017-06-29 新光電気工業株式会社 配線基板、半導体装置及び配線基板の製造方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6473696A (en) * 1987-09-14 1989-03-17 Canon Kk Printed-circuit board
JPH0268474U (https=) * 1988-11-15 1990-05-24
TW448524B (en) * 1997-01-17 2001-08-01 Seiko Epson Corp Electronic component, semiconductor device, manufacturing method therefor, circuit board and electronic equipment
JP2002217329A (ja) * 2001-01-22 2002-08-02 Mitsubishi Electric Corp 半導体装置
JP3983996B2 (ja) * 2001-04-23 2007-09-26 株式会社ルネサステクノロジ 半導体集積回路装置
TWI245597B (en) * 2003-06-30 2005-12-11 Siliconware Precision Industries Co Ltd Printed circuit boards and method for fabricating the same
JP6171829B2 (ja) * 2013-01-30 2017-08-02 株式会社デンソー Ｂｇａ型部品実装用の多層基板の製造方法
JP6185880B2 (ja) * 2014-05-13 2017-08-23 日本特殊陶業株式会社 配線基板の製造方法及び配線基板

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013171964A1 (ja) 2012-05-16 2013-11-21 日本特殊陶業株式会社 配線基板
JP2016143810A (ja) 2015-02-04 2016-08-08 新光電気工業株式会社 配線基板及び電子部品装置とそれらの製造方法
JP2016162770A (ja) 2015-02-26 2016-09-05 イビデン株式会社 プリント配線板
JP2017118067A (ja) 2015-12-25 2017-06-29 新光電気工業株式会社 配線基板、半導体装置及び配線基板の製造方法

Also Published As

Publication number Publication date
JP7708256B2 (ja) 2025-07-15
JP2021086983A (ja) 2021-06-03
JP2024069349A (ja) 2024-05-21

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