JPWO2024004992A5 - - Google Patents

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Publication number
JPWO2024004992A5
JPWO2024004992A5 JP2024530863A JP2024530863A JPWO2024004992A5 JP WO2024004992 A5 JPWO2024004992 A5 JP WO2024004992A5 JP 2024530863 A JP2024530863 A JP 2024530863A JP 2024530863 A JP2024530863 A JP 2024530863A JP WO2024004992 A5 JPWO2024004992 A5 JP WO2024004992A5
Authority
JP
Japan
Prior art keywords
insulating
region
wiring board
board according
conductor layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2024530863A
Other languages
English (en)
Japanese (ja)
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JPWO2024004992A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2023/023741 external-priority patent/WO2024004992A1/ja
Publication of JPWO2024004992A1 publication Critical patent/JPWO2024004992A1/ja
Publication of JPWO2024004992A5 publication Critical patent/JPWO2024004992A5/ja
Withdrawn legal-status Critical Current

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JP2024530863A 2022-06-29 2023-06-27 Withdrawn JPWO2024004992A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022105078 2022-06-29
PCT/JP2023/023741 WO2024004992A1 (ja) 2022-06-29 2023-06-27 配線基板およびそれを用いた実装構造体

Publications (2)

Publication Number Publication Date
JPWO2024004992A1 JPWO2024004992A1 (https=) 2024-01-04
JPWO2024004992A5 true JPWO2024004992A5 (https=) 2025-02-28

Family

ID=89383123

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024530863A Withdrawn JPWO2024004992A1 (https=) 2022-06-29 2023-06-27

Country Status (7)

Country Link
US (1) US20250386433A1 (https=)
EP (1) EP4550949A1 (https=)
JP (1) JPWO2024004992A1 (https=)
KR (1) KR20250012619A (https=)
CN (1) CN119384873A (https=)
TW (1) TWI878937B (https=)
WO (1) WO2024004992A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2024157988A (ja) * 2023-04-26 2024-11-08 イビデン株式会社 配線基板

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002190671A (ja) * 2000-12-22 2002-07-05 Shinko Electric Ind Co Ltd 配線基板の製造方法
JP2003094560A (ja) * 2001-09-25 2003-04-03 Matsushita Electric Works Ltd 樹脂基板の金属膜形成方法および金属膜形成樹脂基板
WO2020067299A1 (ja) * 2018-09-27 2020-04-02 株式会社村田製作所 モジュールおよびその製造方法
JP7137292B2 (ja) * 2019-03-15 2022-09-14 京セラ株式会社 配線基板およびその製造方法
JP2022030289A (ja) 2020-08-06 2022-02-18 イビデン株式会社 配線基板及び配線基板の製造方法

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