TWI878937B - 配線基板及使用該配線基板之安裝構造體 - Google Patents

配線基板及使用該配線基板之安裝構造體 Download PDF

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Publication number
TWI878937B
TWI878937B TW112124108A TW112124108A TWI878937B TW I878937 B TWI878937 B TW I878937B TW 112124108 A TW112124108 A TW 112124108A TW 112124108 A TW112124108 A TW 112124108A TW I878937 B TWI878937 B TW I878937B
Authority
TW
Taiwan
Prior art keywords
insulating
region
layer
wiring substrate
conductive layer
Prior art date
Application number
TW112124108A
Other languages
English (en)
Chinese (zh)
Other versions
TW202420900A (zh
Inventor
Hidetoshi Yugawa
Original Assignee
日商京瓷股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商京瓷股份有限公司 filed Critical 日商京瓷股份有限公司
Publication of TW202420900A publication Critical patent/TW202420900A/zh
Application granted granted Critical
Publication of TWI878937B publication Critical patent/TWI878937B/zh

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0263—Details about a collection of particles
    • H05K2201/0266—Size distribution
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
    • H05K2203/0796—Oxidant in aqueous solution, e.g. permanganate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/09—Treatments involving charged particles
    • H05K2203/095—Plasma, e.g. for treating a substrate to improve adhesion with a conductor or for cleaning holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structure Of Printed Boards (AREA)
TW112124108A 2022-06-29 2023-06-28 配線基板及使用該配線基板之安裝構造體 TWI878937B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022105078 2022-06-29
JP2022-105078 2022-06-29

Publications (2)

Publication Number Publication Date
TW202420900A TW202420900A (zh) 2024-05-16
TWI878937B true TWI878937B (zh) 2025-04-01

Family

ID=89383123

Family Applications (1)

Application Number Title Priority Date Filing Date
TW112124108A TWI878937B (zh) 2022-06-29 2023-06-28 配線基板及使用該配線基板之安裝構造體

Country Status (7)

Country Link
US (1) US20250386433A1 (https=)
EP (1) EP4550949A1 (https=)
JP (1) JPWO2024004992A1 (https=)
KR (1) KR20250012619A (https=)
CN (1) CN119384873A (https=)
TW (1) TWI878937B (https=)
WO (1) WO2024004992A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2024157988A (ja) * 2023-04-26 2024-11-08 イビデン株式会社 配線基板

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002190671A (ja) * 2000-12-22 2002-07-05 Shinko Electric Ind Co Ltd 配線基板の製造方法
JP2003094560A (ja) * 2001-09-25 2003-04-03 Matsushita Electric Works Ltd 樹脂基板の金属膜形成方法および金属膜形成樹脂基板
WO2020188923A1 (ja) * 2019-03-15 2020-09-24 京セラ株式会社 配線基板およびその製造方法
TW202216868A (zh) * 2020-09-18 2022-05-01 日商昭和電工材料股份有限公司 製造半導體封裝用基板材料之方法、預浸體及半導體封裝用基板材料

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020067299A1 (ja) * 2018-09-27 2020-04-02 株式会社村田製作所 モジュールおよびその製造方法
JP2022030289A (ja) 2020-08-06 2022-02-18 イビデン株式会社 配線基板及び配線基板の製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002190671A (ja) * 2000-12-22 2002-07-05 Shinko Electric Ind Co Ltd 配線基板の製造方法
JP2003094560A (ja) * 2001-09-25 2003-04-03 Matsushita Electric Works Ltd 樹脂基板の金属膜形成方法および金属膜形成樹脂基板
WO2020188923A1 (ja) * 2019-03-15 2020-09-24 京セラ株式会社 配線基板およびその製造方法
TW202216868A (zh) * 2020-09-18 2022-05-01 日商昭和電工材料股份有限公司 製造半導體封裝用基板材料之方法、預浸體及半導體封裝用基板材料

Also Published As

Publication number Publication date
CN119384873A (zh) 2025-01-28
JPWO2024004992A1 (https=) 2024-01-04
WO2024004992A1 (ja) 2024-01-04
TW202420900A (zh) 2024-05-16
EP4550949A1 (en) 2025-05-07
KR20250012619A (ko) 2025-01-24
US20250386433A1 (en) 2025-12-18

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