JPWO2024204006A5 - - Google Patents

Info

Publication number
JPWO2024204006A5
JPWO2024204006A5 JP2025510815A JP2025510815A JPWO2024204006A5 JP WO2024204006 A5 JPWO2024204006 A5 JP WO2024204006A5 JP 2025510815 A JP2025510815 A JP 2025510815A JP 2025510815 A JP2025510815 A JP 2025510815A JP WO2024204006 A5 JPWO2024204006 A5 JP WO2024204006A5
Authority
JP
Japan
Prior art keywords
layer
wiring board
printed wiring
adhesive layer
less
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2025510815A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2024204006A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2024/011580 external-priority patent/WO2024204006A1/ja
Publication of JPWO2024204006A1 publication Critical patent/JPWO2024204006A1/ja
Publication of JPWO2024204006A5 publication Critical patent/JPWO2024204006A5/ja
Pending legal-status Critical Current

Links

JP2025510815A 2023-03-30 2024-03-25 Pending JPWO2024204006A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023055639 2023-03-30
PCT/JP2024/011580 WO2024204006A1 (ja) 2023-03-30 2024-03-25 プリント配線板

Publications (2)

Publication Number Publication Date
JPWO2024204006A1 JPWO2024204006A1 (https=) 2024-10-03
JPWO2024204006A5 true JPWO2024204006A5 (https=) 2026-01-06

Family

ID=92905354

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2025510815A Pending JPWO2024204006A1 (https=) 2023-03-30 2024-03-25

Country Status (4)

Country Link
JP (1) JPWO2024204006A1 (https=)
CN (1) CN120937505A (https=)
DE (1) DE112024001474T5 (https=)
WO (1) WO2024204006A1 (https=)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002344100A (ja) * 2001-05-21 2002-11-29 Sumitomo Electric Ind Ltd 基板用誘電体材料及びその製造方法
KR102566108B1 (ko) * 2017-02-22 2023-08-11 나믹스 가부시끼가이샤 접착층용 필름, 다층 배선 기판, 및 반도체 장치
JP7514157B2 (ja) * 2020-10-12 2024-07-10 日本メクトロン株式会社 スルーホール形成方法およびフレキシブルプリント配線板用基板

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