JPWO2024225318A5 - - Google Patents

Info

Publication number
JPWO2024225318A5
JPWO2024225318A5 JP2025516848A JP2025516848A JPWO2024225318A5 JP WO2024225318 A5 JPWO2024225318 A5 JP WO2024225318A5 JP 2025516848 A JP2025516848 A JP 2025516848A JP 2025516848 A JP2025516848 A JP 2025516848A JP WO2024225318 A5 JPWO2024225318 A5 JP WO2024225318A5
Authority
JP
Japan
Prior art keywords
coating film
wiring board
board according
insulating base
insulating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2025516848A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2024225318A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2024/016078 external-priority patent/WO2024225318A1/ja
Publication of JPWO2024225318A1 publication Critical patent/JPWO2024225318A1/ja
Publication of JPWO2024225318A5 publication Critical patent/JPWO2024225318A5/ja
Pending legal-status Critical Current

Links

JP2025516848A 2023-04-26 2024-04-24 Pending JPWO2024225318A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023072537 2023-04-26
PCT/JP2024/016078 WO2024225318A1 (ja) 2023-04-26 2024-04-24 配線基板

Publications (2)

Publication Number Publication Date
JPWO2024225318A1 JPWO2024225318A1 (https=) 2024-10-31
JPWO2024225318A5 true JPWO2024225318A5 (https=) 2026-01-27

Family

ID=93256646

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2025516848A Pending JPWO2024225318A1 (https=) 2023-04-26 2024-04-24

Country Status (3)

Country Link
JP (1) JPWO2024225318A1 (https=)
TW (1) TWI908043B (https=)
WO (1) WO2024225318A1 (https=)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4788544B2 (ja) * 2006-09-22 2011-10-05 株式会社村田製作所 多層セラミック基板およびその製造方法
JP5294835B2 (ja) * 2008-12-25 2013-09-18 京セラ株式会社 配線基板及び配線基板の製造方法
JP2013157496A (ja) * 2012-01-31 2013-08-15 Sony Corp 発光素子およびその製造方法、並びに発光装置
JP2016174084A (ja) * 2015-03-17 2016-09-29 京セラ株式会社 素子搭載用基板および実装基板
JP6457628B2 (ja) * 2015-03-25 2019-01-23 京セラ株式会社 電子部品
WO2020022109A1 (ja) * 2018-07-25 2020-01-30 株式会社村田製作所 複合基板及び複合基板の製造方法
CN209030459U (zh) * 2018-08-31 2019-06-25 深圳市瑞博兴源电子有限公司 一种耐热型电路板

Similar Documents

Publication Publication Date Title
CN109742133B (zh) 显示面板及其制备方法和显示装置
US20080180878A1 (en) Package structure with embedded capacitor, fabricating process thereof and applications of the same
JP2011003578A5 (https=)
EP1581035A3 (en) Multilayer ceramic substrate and its production method
CN102404935A (zh) 多层导通孔叠层结构
JPWO2024225318A5 (https=)
JP2019110250A (ja) 配線基板及びその製造方法
CN115915570B (zh) 防翘曲电路板及其制造方法、电子装置
TW202404450A (zh) 電路板及其散熱片
JPWO2022230900A5 (https=)
JPWO2024257347A5 (https=)
JPWO2024070592A5 (https=)
JPWO2023127725A5 (https=)
JPWO2024070518A5 (https=)
JPH061795B2 (ja) 多層配線構造体
JPH07283541A (ja) 積層セラミック部品
TWI875365B (zh) 包覆堆疊式石墨烯散熱片
WO2011147284A1 (zh) 陶瓷印刷电路板结构
JP7733554B2 (ja) 電子部品内蔵基板
JP3348523B2 (ja) 積層セラミック部品
JPWO2024204006A5 (https=)
JP2621579B2 (ja) セラミック基板
JP2011009288A (ja) 基板内蔵用チップ抵抗器およびその製造方法
JPWO2023238562A5 (https=)
JPWO2024214573A5 (https=)