JPWO2024225318A1 - - Google Patents
Info
- Publication number
- JPWO2024225318A1 JPWO2024225318A1 JP2025516848A JP2025516848A JPWO2024225318A1 JP WO2024225318 A1 JPWO2024225318 A1 JP WO2024225318A1 JP 2025516848 A JP2025516848 A JP 2025516848A JP 2025516848 A JP2025516848 A JP 2025516848A JP WO2024225318 A1 JPWO2024225318 A1 JP WO2024225318A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023072537 | 2023-04-26 | ||
| PCT/JP2024/016078 WO2024225318A1 (ja) | 2023-04-26 | 2024-04-24 | 配線基板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2024225318A1 true JPWO2024225318A1 (https=) | 2024-10-31 |
| JPWO2024225318A5 JPWO2024225318A5 (https=) | 2026-01-27 |
Family
ID=93256646
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025516848A Pending JPWO2024225318A1 (https=) | 2023-04-26 | 2024-04-24 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPWO2024225318A1 (https=) |
| TW (1) | TWI908043B (https=) |
| WO (1) | WO2024225318A1 (https=) |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4788544B2 (ja) * | 2006-09-22 | 2011-10-05 | 株式会社村田製作所 | 多層セラミック基板およびその製造方法 |
| JP5294835B2 (ja) * | 2008-12-25 | 2013-09-18 | 京セラ株式会社 | 配線基板及び配線基板の製造方法 |
| JP2013157496A (ja) * | 2012-01-31 | 2013-08-15 | Sony Corp | 発光素子およびその製造方法、並びに発光装置 |
| JP2016174084A (ja) * | 2015-03-17 | 2016-09-29 | 京セラ株式会社 | 素子搭載用基板および実装基板 |
| JP6457628B2 (ja) * | 2015-03-25 | 2019-01-23 | 京セラ株式会社 | 電子部品 |
| WO2020022109A1 (ja) * | 2018-07-25 | 2020-01-30 | 株式会社村田製作所 | 複合基板及び複合基板の製造方法 |
| CN209030459U (zh) * | 2018-08-31 | 2019-06-25 | 深圳市瑞博兴源电子有限公司 | 一种耐热型电路板 |
-
2024
- 2024-04-24 JP JP2025516848A patent/JPWO2024225318A1/ja active Pending
- 2024-04-24 WO PCT/JP2024/016078 patent/WO2024225318A1/ja not_active Ceased
- 2024-04-26 TW TW113115619A patent/TWI908043B/zh active
Also Published As
| Publication number | Publication date |
|---|---|
| TW202508375A (zh) | 2025-02-16 |
| TWI908043B (zh) | 2025-12-11 |
| WO2024225318A1 (ja) | 2024-10-31 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20251022 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20251022 |