CN120937505A - 印刷布线板 - Google Patents

印刷布线板

Info

Publication number
CN120937505A
CN120937505A CN202480021733.5A CN202480021733A CN120937505A CN 120937505 A CN120937505 A CN 120937505A CN 202480021733 A CN202480021733 A CN 202480021733A CN 120937505 A CN120937505 A CN 120937505A
Authority
CN
China
Prior art keywords
layer
dielectric layer
wiring board
printed wiring
main surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202480021733.5A
Other languages
English (en)
Chinese (zh)
Inventor
木谷聪志
上田宏
改森信吾
米泽隆幸
柏原秀树
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Industries Ltd
Sumitomo Electric Printed Circuits Inc
Original Assignee
Sumitomo Electric Industries Ltd
Sumitomo Electric Printed Circuits Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries Ltd, Sumitomo Electric Printed Circuits Inc filed Critical Sumitomo Electric Industries Ltd
Publication of CN120937505A publication Critical patent/CN120937505A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/024—Dielectric details, e.g. changing the dielectric material around a transmission line
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/036—Multilayers with layers of different types
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/015—Fluoropolymer, e.g. polytetrafluoroethylene [PTFE]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
CN202480021733.5A 2023-03-30 2024-03-25 印刷布线板 Pending CN120937505A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2023055639 2023-03-30
JP2023-055639 2023-03-30
PCT/JP2024/011580 WO2024204006A1 (ja) 2023-03-30 2024-03-25 プリント配線板

Publications (1)

Publication Number Publication Date
CN120937505A true CN120937505A (zh) 2025-11-11

Family

ID=92905354

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202480021733.5A Pending CN120937505A (zh) 2023-03-30 2024-03-25 印刷布线板

Country Status (4)

Country Link
JP (1) JPWO2024204006A1 (https=)
CN (1) CN120937505A (https=)
DE (1) DE112024001474T5 (https=)
WO (1) WO2024204006A1 (https=)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002344100A (ja) * 2001-05-21 2002-11-29 Sumitomo Electric Ind Ltd 基板用誘電体材料及びその製造方法
KR102566108B1 (ko) * 2017-02-22 2023-08-11 나믹스 가부시끼가이샤 접착층용 필름, 다층 배선 기판, 및 반도체 장치
JP7514157B2 (ja) * 2020-10-12 2024-07-10 日本メクトロン株式会社 スルーホール形成方法およびフレキシブルプリント配線板用基板

Also Published As

Publication number Publication date
JPWO2024204006A1 (https=) 2024-10-03
DE112024001474T5 (de) 2026-03-05
WO2024204006A1 (ja) 2024-10-03

Similar Documents

Publication Publication Date Title
US7002080B2 (en) Multilayer wiring board
CN101765295B (zh) 线路板及其制造方法
US20100224397A1 (en) Wiring board and method for manufacturing the same
US8129623B2 (en) Resin film, adhesive sheet, circuit board, and electronic apparatus
US20080128911A1 (en) Semiconductor package and method for manufacturing the same
KR20070086645A (ko) 전자 모듈 제조 방법
US8134085B2 (en) Printed interconnection board having a core including carbon fiber reinforced plastic
US20200365418A1 (en) Printed wiring board and method for manufacturing printed wiring board
KR20090096809A (ko) 반도체 부품 내장형 인쇄회로기판 제조 방법
US6524889B2 (en) Method of transcribing a wiring pattern from an original substrate to a substrate with closely matched thermal expansion coefficients between both substrates for dimensional control of the transcribed pattern
CN120937505A (zh) 印刷布线板
JP2004179647A (ja) 配線基板、半導体パッケージ、基体絶縁膜及び配線基板の製造方法
JP3071764B2 (ja) 金属箔付きフィルム及びそれを用いた配線基板の製造方法
US6853065B2 (en) Tab tape, method of making same and semiconductor device
WO2004043121A1 (ja) プリント配線板とその製造方法
JP2002252436A (ja) 両面積層板およびその製造方法
CN110521292A (zh) 印刷电路板及其制造方法
JP2005268259A (ja) 多層配線基板
US7955485B2 (en) Planar laminate substrate and method for fabricating organic laminate substrate PCBS, semiconductors, semiconductor wafers and semiconductor devices having miniaturized electrical pathways
JP4812287B2 (ja) 多層配線基板及びその製造方法
JP2006012921A (ja) 多層配線基板
KR101969643B1 (ko) 리지드 플렉시블 회로기판 제조방법
US20240276650A1 (en) Circuit board and manufacturing method thereof
KR20220065014A (ko) 배선 기판
JP4480431B2 (ja) 多層配線基板

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination