JPWO2024204006A1 - - Google Patents

Info

Publication number
JPWO2024204006A1
JPWO2024204006A1 JP2025510815A JP2025510815A JPWO2024204006A1 JP WO2024204006 A1 JPWO2024204006 A1 JP WO2024204006A1 JP 2025510815 A JP2025510815 A JP 2025510815A JP 2025510815 A JP2025510815 A JP 2025510815A JP WO2024204006 A1 JPWO2024204006 A1 JP WO2024204006A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2025510815A
Other languages
Japanese (ja)
Other versions
JPWO2024204006A5 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2024204006A1 publication Critical patent/JPWO2024204006A1/ja
Publication of JPWO2024204006A5 publication Critical patent/JPWO2024204006A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/024—Dielectric details, e.g. changing the dielectric material around a transmission line
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/036—Multilayers with layers of different types
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/015—Fluoropolymer, e.g. polytetrafluoroethylene [PTFE]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP2025510815A 2023-03-30 2024-03-25 Pending JPWO2024204006A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023055639 2023-03-30
PCT/JP2024/011580 WO2024204006A1 (ja) 2023-03-30 2024-03-25 プリント配線板

Publications (2)

Publication Number Publication Date
JPWO2024204006A1 true JPWO2024204006A1 (https=) 2024-10-03
JPWO2024204006A5 JPWO2024204006A5 (https=) 2026-01-06

Family

ID=92905354

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2025510815A Pending JPWO2024204006A1 (https=) 2023-03-30 2024-03-25

Country Status (4)

Country Link
JP (1) JPWO2024204006A1 (https=)
CN (1) CN120937505A (https=)
DE (1) DE112024001474T5 (https=)
WO (1) WO2024204006A1 (https=)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002344100A (ja) * 2001-05-21 2002-11-29 Sumitomo Electric Ind Ltd 基板用誘電体材料及びその製造方法
KR102566108B1 (ko) * 2017-02-22 2023-08-11 나믹스 가부시끼가이샤 접착층용 필름, 다층 배선 기판, 및 반도체 장치
JP7514157B2 (ja) * 2020-10-12 2024-07-10 日本メクトロン株式会社 スルーホール形成方法およびフレキシブルプリント配線板用基板

Also Published As

Publication number Publication date
DE112024001474T5 (de) 2026-03-05
WO2024204006A1 (ja) 2024-10-03
CN120937505A (zh) 2025-11-11

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Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20250820