JPWO2024075456A1 - - Google Patents

Info

Publication number
JPWO2024075456A1
JPWO2024075456A1 JP2024555671A JP2024555671A JPWO2024075456A1 JP WO2024075456 A1 JPWO2024075456 A1 JP WO2024075456A1 JP 2024555671 A JP2024555671 A JP 2024555671A JP 2024555671 A JP2024555671 A JP 2024555671A JP WO2024075456 A1 JPWO2024075456 A1 JP WO2024075456A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024555671A
Other languages
Japanese (ja)
Other versions
JPWO2024075456A5 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2024075456A1 publication Critical patent/JPWO2024075456A1/ja
Publication of JPWO2024075456A5 publication Critical patent/JPWO2024075456A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
    • H05K3/4655—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern by using a laminate characterized by the insulating layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/015—Fluoropolymer, e.g. polytetrafluoroethylene [PTFE]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/0959—Plated through-holes or plated blind vias filled with insulating material

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
JP2024555671A 2022-10-07 2023-09-04 Pending JPWO2024075456A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022162209 2022-10-07
PCT/JP2023/032203 WO2024075456A1 (ja) 2022-10-07 2023-09-04 回路基板および回路基板の製造方法

Publications (2)

Publication Number Publication Date
JPWO2024075456A1 true JPWO2024075456A1 (https=) 2024-04-11
JPWO2024075456A5 JPWO2024075456A5 (https=) 2025-06-18

Family

ID=90607792

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024555671A Pending JPWO2024075456A1 (https=) 2022-10-07 2023-09-04

Country Status (4)

Country Link
JP (1) JPWO2024075456A1 (https=)
CN (1) CN119999341A (https=)
DE (1) DE112023004212T5 (https=)
WO (1) WO2024075456A1 (https=)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2678940B1 (fr) * 1991-05-24 1996-10-18 Rogers Corp Film composite charge de particules et procede pour sa fabrication.
JP2690032B2 (ja) * 1991-10-03 1997-12-10 ダイキン工業株式会社 フッ素樹脂積層体およびその製造法
JP2002001886A (ja) * 2000-06-09 2002-01-08 Three M Innovative Properties Co 被接着可能フッ素系材料シート、接着性フッ素系材料シート、フッ素系材料シートの接着方法および接着構造
JP4938199B2 (ja) * 2000-06-14 2012-05-23 出光興産株式会社 ポリオレフィン系ホットメルト接着剤用樹脂
JP7608450B2 (ja) * 2020-05-18 2025-01-06 住友電気工業株式会社 誘電体シートの製造方法、高周波プリント配線板用基板の製造方法、誘電体シート、及び高周波プリント配線板用基板
JP7514157B2 (ja) * 2020-10-12 2024-07-10 日本メクトロン株式会社 スルーホール形成方法およびフレキシブルプリント配線板用基板
JP6981522B1 (ja) * 2020-12-15 2021-12-15 東洋インキＳｃホールディングス株式会社 熱硬化性樹脂組成物、およびその利用

Also Published As

Publication number Publication date
DE112023004212T5 (de) 2025-08-07
WO2024075456A1 (ja) 2024-04-11
CN119999341A (zh) 2025-05-13

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Legal Events

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Effective date: 20250220

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Effective date: 20260421