DE112024001474T5 - Gedruckte Leiterplatte - Google Patents

Gedruckte Leiterplatte

Info

Publication number
DE112024001474T5
DE112024001474T5 DE112024001474.7T DE112024001474T DE112024001474T5 DE 112024001474 T5 DE112024001474 T5 DE 112024001474T5 DE 112024001474 T DE112024001474 T DE 112024001474T DE 112024001474 T5 DE112024001474 T5 DE 112024001474T5
Authority
DE
Germany
Prior art keywords
layer
circuit board
dielectric layer
main surface
conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE112024001474.7T
Other languages
German (de)
English (en)
Inventor
Satoshi KIYA
Hiroshi Ueda
Shingo Kaimori
Takayuki Yonezawa
Hideki Kashihara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Industries Ltd
Sumitomo Electric Printed Circuits Inc
Original Assignee
Sumitomo Electric Industries Ltd
Sumitomo Electric Printed Circuits Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries Ltd, Sumitomo Electric Printed Circuits Inc filed Critical Sumitomo Electric Industries Ltd
Publication of DE112024001474T5 publication Critical patent/DE112024001474T5/de
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/024—Dielectric details, e.g. changing the dielectric material around a transmission line
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/036—Multilayers with layers of different types
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/015—Fluoropolymer, e.g. polytetrafluoroethylene [PTFE]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
DE112024001474.7T 2023-03-30 2024-03-25 Gedruckte Leiterplatte Pending DE112024001474T5 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2023055639 2023-03-30
JP2023-055639 2023-03-30
PCT/JP2024/011580 WO2024204006A1 (ja) 2023-03-30 2024-03-25 プリント配線板

Publications (1)

Publication Number Publication Date
DE112024001474T5 true DE112024001474T5 (de) 2026-03-05

Family

ID=92905354

Family Applications (1)

Application Number Title Priority Date Filing Date
DE112024001474.7T Pending DE112024001474T5 (de) 2023-03-30 2024-03-25 Gedruckte Leiterplatte

Country Status (4)

Country Link
JP (1) JPWO2024204006A1 (https=)
CN (1) CN120937505A (https=)
DE (1) DE112024001474T5 (https=)
WO (1) WO2024204006A1 (https=)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002344100A (ja) * 2001-05-21 2002-11-29 Sumitomo Electric Ind Ltd 基板用誘電体材料及びその製造方法
KR102566108B1 (ko) * 2017-02-22 2023-08-11 나믹스 가부시끼가이샤 접착층용 필름, 다층 배선 기판, 및 반도체 장치
JP7514157B2 (ja) * 2020-10-12 2024-07-10 日本メクトロン株式会社 スルーホール形成方法およびフレキシブルプリント配線板用基板

Also Published As

Publication number Publication date
JPWO2024204006A1 (https=) 2024-10-03
WO2024204006A1 (ja) 2024-10-03
CN120937505A (zh) 2025-11-11

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