JP4480431B2 - 多層配線基板 - Google Patents
多層配線基板 Download PDFInfo
- Publication number
- JP4480431B2 JP4480431B2 JP2004078491A JP2004078491A JP4480431B2 JP 4480431 B2 JP4480431 B2 JP 4480431B2 JP 2004078491 A JP2004078491 A JP 2004078491A JP 2004078491 A JP2004078491 A JP 2004078491A JP 4480431 B2 JP4480431 B2 JP 4480431B2
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- JP
- Japan
- Prior art keywords
- layer
- conductor
- insulating layer
- wiring board
- insulating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Production Of Multi-Layered Print Wiring Board (AREA)
Description
2・・・・絶縁層
3・・・・配線導体層
4・・・・絶縁フィルム層
5・・・・絶縁性接着剤層
6・・・・貫通導体
7・・・・貫通孔
Claims (1)
- 樹脂から成る絶縁層と配線導体層とが交互に複数層積層されるとともに上下に位置する前記配線導体層同士がそれらの間の前記絶縁層に形成された貫通導体を介して電気的に接続されて成る多層配線基板において、前記貫通導体は、最上層の前記絶縁層に形成された前記貫通導体にその下層側の前記貫通導体が上下方向に連続するように積み重ねられているとともに、最上層の前記絶縁層に形成された前記貫通導体の上端部が前記絶縁層から突出しており、最表層の前記配線導体層の前記貫通導体の上端部との接続部の周囲における下面が前記絶縁層の表面から離れていることを特徴とする多層配線基板。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004078491A JP4480431B2 (ja) | 2004-03-18 | 2004-03-18 | 多層配線基板 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004078491A JP4480431B2 (ja) | 2004-03-18 | 2004-03-18 | 多層配線基板 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005268517A JP2005268517A (ja) | 2005-09-29 |
JP4480431B2 true JP4480431B2 (ja) | 2010-06-16 |
Family
ID=35092750
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004078491A Expired - Fee Related JP4480431B2 (ja) | 2004-03-18 | 2004-03-18 | 多層配線基板 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4480431B2 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5383448B2 (ja) * | 2009-11-20 | 2014-01-08 | 京セラ株式会社 | 配線基板およびプローブカードならびに電子装置 |
JP5383447B2 (ja) * | 2009-11-20 | 2014-01-08 | 京セラ株式会社 | 配線基板およびプローブカードならびに電子装置 |
JP6619294B2 (ja) * | 2016-05-24 | 2019-12-11 | 新光電気工業株式会社 | 配線基板及びその製造方法と電子部品装置 |
-
2004
- 2004-03-18 JP JP2004078491A patent/JP4480431B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
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JP2005268517A (ja) | 2005-09-29 |
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