JPWO2023157502A5 - - Google Patents

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Publication number
JPWO2023157502A5
JPWO2023157502A5 JP2024501010A JP2024501010A JPWO2023157502A5 JP WO2023157502 A5 JPWO2023157502 A5 JP WO2023157502A5 JP 2024501010 A JP2024501010 A JP 2024501010A JP 2024501010 A JP2024501010 A JP 2024501010A JP WO2023157502 A5 JPWO2023157502 A5 JP WO2023157502A5
Authority
JP
Japan
Prior art keywords
forming
metal support
insulating coating
coating layer
via hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024501010A
Other languages
English (en)
Japanese (ja)
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JPWO2023157502A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2022/048683 external-priority patent/WO2023157502A1/ja
Publication of JPWO2023157502A1 publication Critical patent/JPWO2023157502A1/ja
Publication of JPWO2023157502A5 publication Critical patent/JPWO2023157502A5/ja
Pending legal-status Critical Current

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JP2024501010A 2022-02-16 2022-12-28 Pending JPWO2023157502A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022022465 2022-02-16
PCT/JP2022/048683 WO2023157502A1 (ja) 2022-02-16 2022-12-28 配線回路基板およびその製造方法

Publications (2)

Publication Number Publication Date
JPWO2023157502A1 JPWO2023157502A1 (https=) 2023-08-24
JPWO2023157502A5 true JPWO2023157502A5 (https=) 2026-01-07

Family

ID=87578067

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024501010A Pending JPWO2023157502A1 (https=) 2022-02-16 2022-12-28

Country Status (5)

Country Link
JP (1) JPWO2023157502A1 (https=)
KR (1) KR20240147692A (https=)
CN (1) CN118715876A (https=)
TW (1) TW202344157A (https=)
WO (1) WO2023157502A1 (https=)

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10135593A (ja) * 1996-10-31 1998-05-22 Shirai Denshi Kogyo Kk プリント回路用基板
JP2004179291A (ja) * 2002-11-26 2004-06-24 Ibiden Co Ltd 配線板および配線板の製造方法
JP2006100631A (ja) * 2004-09-30 2006-04-13 Tdk Corp 配線基板及びその製造方法
JP2008028376A (ja) * 2006-06-20 2008-02-07 Sanyo Electric Co Ltd 回路基板、半導体モジュールおよび回路基板の製造方法
WO2008069260A1 (ja) * 2006-11-30 2008-06-12 Sanyo Electric Co., Ltd. 回路素子実装用の基板、これを用いた回路装置およびエアコンディショナ
KR20120072801A (ko) * 2010-12-24 2012-07-04 삼성전기주식회사 전착도장을 이용한 고방열기판 및 이의 제조방법
US20140048319A1 (en) * 2012-08-14 2014-02-20 Bridge Semiconductor Corporation Wiring board with hybrid core and dual build-up circuitries
US20160192488A1 (en) * 2014-12-30 2016-06-30 Samsung Electro-Mechanics Co., Ltd. Circuit board, multilayered substrate having the circuit board and method of manufacturing the circuit board
KR102435124B1 (ko) * 2015-10-07 2022-08-24 삼성전기주식회사 인쇄회로기판 및 인쇄회로기판의 제조방법

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