JPWO2023157502A1 - - Google Patents

Info

Publication number
JPWO2023157502A1
JPWO2023157502A1 JP2024501010A JP2024501010A JPWO2023157502A1 JP WO2023157502 A1 JPWO2023157502 A1 JP WO2023157502A1 JP 2024501010 A JP2024501010 A JP 2024501010A JP 2024501010 A JP2024501010 A JP 2024501010A JP WO2023157502 A1 JPWO2023157502 A1 JP WO2023157502A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024501010A
Other languages
Japanese (ja)
Other versions
JPWO2023157502A5 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023157502A1 publication Critical patent/JPWO2023157502A1/ja
Publication of JPWO2023157502A5 publication Critical patent/JPWO2023157502A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0207—Cooling of mounted components using internal conductor planes parallel to the surface for thermal conduction, e.g. power planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
    • H05K3/445—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits having insulated holes or insulated via connections through the metal core
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP2024501010A 2022-02-16 2022-12-28 Pending JPWO2023157502A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022022465 2022-02-16
PCT/JP2022/048683 WO2023157502A1 (ja) 2022-02-16 2022-12-28 配線回路基板およびその製造方法

Publications (2)

Publication Number Publication Date
JPWO2023157502A1 true JPWO2023157502A1 (https=) 2023-08-24
JPWO2023157502A5 JPWO2023157502A5 (https=) 2026-01-07

Family

ID=87578067

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024501010A Pending JPWO2023157502A1 (https=) 2022-02-16 2022-12-28

Country Status (5)

Country Link
JP (1) JPWO2023157502A1 (https=)
KR (1) KR20240147692A (https=)
CN (1) CN118715876A (https=)
TW (1) TW202344157A (https=)
WO (1) WO2023157502A1 (https=)

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10135593A (ja) * 1996-10-31 1998-05-22 Shirai Denshi Kogyo Kk プリント回路用基板
JP2004179291A (ja) * 2002-11-26 2004-06-24 Ibiden Co Ltd 配線板および配線板の製造方法
JP2006100631A (ja) * 2004-09-30 2006-04-13 Tdk Corp 配線基板及びその製造方法
JP2008028376A (ja) * 2006-06-20 2008-02-07 Sanyo Electric Co Ltd 回路基板、半導体モジュールおよび回路基板の製造方法
WO2008069260A1 (ja) * 2006-11-30 2008-06-12 Sanyo Electric Co., Ltd. 回路素子実装用の基板、これを用いた回路装置およびエアコンディショナ
KR20120072801A (ko) * 2010-12-24 2012-07-04 삼성전기주식회사 전착도장을 이용한 고방열기판 및 이의 제조방법
US20140048319A1 (en) * 2012-08-14 2014-02-20 Bridge Semiconductor Corporation Wiring board with hybrid core and dual build-up circuitries
US20160192488A1 (en) * 2014-12-30 2016-06-30 Samsung Electro-Mechanics Co., Ltd. Circuit board, multilayered substrate having the circuit board and method of manufacturing the circuit board
KR102435124B1 (ko) * 2015-10-07 2022-08-24 삼성전기주식회사 인쇄회로기판 및 인쇄회로기판의 제조방법

Also Published As

Publication number Publication date
KR20240147692A (ko) 2024-10-08
CN118715876A (zh) 2024-09-27
TW202344157A (zh) 2023-11-01
WO2023157502A1 (ja) 2023-08-24

Similar Documents

Publication Publication Date Title
BR102023014872A2 (https=)
BR102023012440A2 (https=)
BR102023010976A2 (https=)
BR102023009641A2 (https=)
BR102023008688A2 (https=)
BR102023007252A2 (https=)
BR102023005164A2 (https=)
BR102023001987A2 (https=)
BR102023000289A2 (https=)
BR102022026909A2 (https=)
JPWO2023157502A1 (https=)
BR202022009269U2 (https=)
BR202022005961U2 (https=)
BR202022001779U2 (https=)
BR202022000931U2 (https=)
BY13164U (https=)
CN307048256S (https=)
CN307044510S (https=)
CN307044225S (https=)
BY23992C1 (https=)
BY13168U (https=)
BY13166U (https=)
BY13165U (https=)
BY13153U (https=)
BY13163U (https=)

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20240704

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20251223

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20251223