JP2024073648A5 - - Google Patents

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Publication number
JP2024073648A5
JP2024073648A5 JP2024045569A JP2024045569A JP2024073648A5 JP 2024073648 A5 JP2024073648 A5 JP 2024073648A5 JP 2024045569 A JP2024045569 A JP 2024045569A JP 2024045569 A JP2024045569 A JP 2024045569A JP 2024073648 A5 JP2024073648 A5 JP 2024073648A5
Authority
JP
Japan
Prior art keywords
outermost
wiring
insulating layer
wiring board
connection portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024045569A
Other languages
English (en)
Japanese (ja)
Other versions
JP2024073648A (ja
Filing date
Publication date
Priority claimed from JP2019217009A external-priority patent/JP7459492B2/ja
Application filed filed Critical
Priority to JP2024045569A priority Critical patent/JP2024073648A/ja
Publication of JP2024073648A publication Critical patent/JP2024073648A/ja
Publication of JP2024073648A5 publication Critical patent/JP2024073648A5/ja
Pending legal-status Critical Current

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JP2024045569A 2019-11-29 2024-03-21 配線基板 Pending JP2024073648A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2024045569A JP2024073648A (ja) 2019-11-29 2024-03-21 配線基板

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019217009A JP7459492B2 (ja) 2019-11-29 2019-11-29 配線基板
JP2024045569A JP2024073648A (ja) 2019-11-29 2024-03-21 配線基板

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2019217009A Division JP7459492B2 (ja) 2019-11-29 2019-11-29 配線基板

Publications (2)

Publication Number Publication Date
JP2024073648A JP2024073648A (ja) 2024-05-29
JP2024073648A5 true JP2024073648A5 (https=) 2024-07-19

Family

ID=76088488

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2019217009A Active JP7459492B2 (ja) 2019-11-29 2019-11-29 配線基板
JP2024045569A Pending JP2024073648A (ja) 2019-11-29 2024-03-21 配線基板

Family Applications Before (1)

Application Number Title Priority Date Filing Date
JP2019217009A Active JP7459492B2 (ja) 2019-11-29 2019-11-29 配線基板

Country Status (1)

Country Link
JP (2) JP7459492B2 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20250165119A (ko) * 2024-05-17 2025-11-25 엘지이노텍 주식회사 회로기판 및 반도체 패키지

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014236197A (ja) * 2013-06-05 2014-12-15 ルネサスエレクトロニクス株式会社 半導体装置
JP6247032B2 (ja) * 2013-07-01 2017-12-13 新光電気工業株式会社 配線基板、半導体装置及び配線基板の製造方法
JP6594264B2 (ja) * 2016-06-07 2019-10-23 新光電気工業株式会社 配線基板及び半導体装置、並びにそれらの製造方法
JP2018032661A (ja) * 2016-08-22 2018-03-01 イビデン株式会社 プリント配線板およびその製造方法
JP2018082084A (ja) * 2016-11-17 2018-05-24 イビデン株式会社 プリント配線板およびプリント配線板の製造方法
JP7112873B2 (ja) * 2018-04-05 2022-08-04 新光電気工業株式会社 配線基板、半導体パッケージ及び配線基板の製造方法
JP7202784B2 (ja) * 2018-04-27 2023-01-12 新光電気工業株式会社 配線基板、半導体装置及び配線基板の製造方法

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