JP7459492B2 - 配線基板 - Google Patents

配線基板 Download PDF

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Publication number
JP7459492B2
JP7459492B2 JP2019217009A JP2019217009A JP7459492B2 JP 7459492 B2 JP7459492 B2 JP 7459492B2 JP 2019217009 A JP2019217009 A JP 2019217009A JP 2019217009 A JP2019217009 A JP 2019217009A JP 7459492 B2 JP7459492 B2 JP 7459492B2
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JP
Japan
Prior art keywords
wiring
outermost
insulating layer
opening
wiring board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2019217009A
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English (en)
Japanese (ja)
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JP2021086984A (ja
Inventor
敦子 千吉良
祐治 成田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dai Nippon Printing Co Ltd
Original Assignee
Dai Nippon Printing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Dai Nippon Printing Co Ltd filed Critical Dai Nippon Printing Co Ltd
Priority to JP2019217009A priority Critical patent/JP7459492B2/ja
Publication of JP2021086984A publication Critical patent/JP2021086984A/ja
Priority to JP2024045569A priority patent/JP2024073648A/ja
Application granted granted Critical
Publication of JP7459492B2 publication Critical patent/JP7459492B2/ja
Active legal-status Critical Current
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  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)
JP2019217009A 2019-11-29 2019-11-29 配線基板 Active JP7459492B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2019217009A JP7459492B2 (ja) 2019-11-29 2019-11-29 配線基板
JP2024045569A JP2024073648A (ja) 2019-11-29 2024-03-21 配線基板

Applications Claiming Priority (1)

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JP2019217009A JP7459492B2 (ja) 2019-11-29 2019-11-29 配線基板

Related Child Applications (1)

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JP2024045569A Division JP2024073648A (ja) 2019-11-29 2024-03-21 配線基板

Publications (2)

Publication Number Publication Date
JP2021086984A JP2021086984A (ja) 2021-06-03
JP7459492B2 true JP7459492B2 (ja) 2024-04-02

Family

ID=76088488

Family Applications (2)

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JP2019217009A Active JP7459492B2 (ja) 2019-11-29 2019-11-29 配線基板
JP2024045569A Pending JP2024073648A (ja) 2019-11-29 2024-03-21 配線基板

Family Applications After (1)

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JP2024045569A Pending JP2024073648A (ja) 2019-11-29 2024-03-21 配線基板

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JP (2) JP7459492B2 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025239580A1 (ko) * 2024-05-17 2025-11-20 엘지이노텍 주식회사 회로기판 및 반도체 패키지

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014236197A (ja) 2013-06-05 2014-12-15 ルネサスエレクトロニクス株式会社 半導体装置
JP2017220543A (ja) 2016-06-07 2017-12-14 新光電気工業株式会社 配線基板及び半導体装置、並びにそれらの製造方法
JP2018032661A (ja) 2016-08-22 2018-03-01 イビデン株式会社 プリント配線板およびその製造方法
JP2018082084A (ja) 2016-11-17 2018-05-24 イビデン株式会社 プリント配線板およびプリント配線板の製造方法
JP2019186330A (ja) 2018-04-05 2019-10-24 新光電気工業株式会社 配線基板、半導体パッケージ及び配線基板の製造方法
JP2019192885A (ja) 2018-04-27 2019-10-31 新光電気工業株式会社 配線基板、半導体装置及び配線基板の製造方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6247032B2 (ja) * 2013-07-01 2017-12-13 新光電気工業株式会社 配線基板、半導体装置及び配線基板の製造方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014236197A (ja) 2013-06-05 2014-12-15 ルネサスエレクトロニクス株式会社 半導体装置
JP2017220543A (ja) 2016-06-07 2017-12-14 新光電気工業株式会社 配線基板及び半導体装置、並びにそれらの製造方法
JP2018032661A (ja) 2016-08-22 2018-03-01 イビデン株式会社 プリント配線板およびその製造方法
JP2018082084A (ja) 2016-11-17 2018-05-24 イビデン株式会社 プリント配線板およびプリント配線板の製造方法
JP2019186330A (ja) 2018-04-05 2019-10-24 新光電気工業株式会社 配線基板、半導体パッケージ及び配線基板の製造方法
JP2019192885A (ja) 2018-04-27 2019-10-31 新光電気工業株式会社 配線基板、半導体装置及び配線基板の製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025239580A1 (ko) * 2024-05-17 2025-11-20 엘지이노텍 주식회사 회로기판 및 반도체 패키지

Also Published As

Publication number Publication date
JP2024073648A (ja) 2024-05-29
JP2021086984A (ja) 2021-06-03

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