JPWO2019201753A5 - - Google Patents
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- Publication number
- JPWO2019201753A5 JPWO2019201753A5 JP2020558445A JP2020558445A JPWO2019201753A5 JP WO2019201753 A5 JPWO2019201753 A5 JP WO2019201753A5 JP 2020558445 A JP2020558445 A JP 2020558445A JP 2020558445 A JP2020558445 A JP 2020558445A JP WO2019201753 A5 JPWO2019201753 A5 JP WO2019201753A5
- Authority
- JP
- Japan
- Prior art keywords
- composition according
- aqueous composition
- tin
- ethylene oxide
- mass
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000203 mixture Substances 0.000 claims 13
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 claims 5
- 238000000034 method Methods 0.000 claims 4
- 239000000758 substrate Substances 0.000 claims 4
- 229910001128 Sn alloy Inorganic materials 0.000 claims 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims 3
- 229920001577 copolymer Polymers 0.000 claims 3
- -1 ethanediyl Chemical group 0.000 claims 3
- 125000003118 aryl group Chemical group 0.000 claims 2
- 238000000151 deposition Methods 0.000 claims 2
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 claims 1
- 125000000217 alkyl group Chemical group 0.000 claims 1
- 125000002947 alkylene group Chemical group 0.000 claims 1
- 125000002619 bicyclic group Chemical group 0.000 claims 1
- 150000001875 compounds Chemical class 0.000 claims 1
- 230000008021 deposition Effects 0.000 claims 1
- 238000009713 electroplating Methods 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 125000001570 methylene group Chemical group [H]C([H])([*:1])[*:2] 0.000 claims 1
- 229910052709 silver Inorganic materials 0.000 claims 1
- 239000004332 silver Substances 0.000 claims 1
- 229910001432 tin ion Inorganic materials 0.000 claims 1
- PJANXHGTPQOBST-VAWYXSNFSA-N trans-stilbene Chemical group C=1C=CC=CC=1/C=C/C1=CC=CC=C1 PJANXHGTPQOBST-VAWYXSNFSA-N 0.000 claims 1
- 125000006839 xylylene group Chemical group 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP18168462 | 2018-04-20 | ||
| EP18168462.2 | 2018-04-20 | ||
| PCT/EP2019/059344 WO2019201753A1 (en) | 2018-04-20 | 2019-04-11 | Composition for tin or tin alloy electroplating comprising suppressing agent |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2021522410A JP2021522410A (ja) | 2021-08-30 |
| JP2021522410A5 JP2021522410A5 (https=) | 2022-04-18 |
| JPWO2019201753A5 true JPWO2019201753A5 (https=) | 2022-04-18 |
Family
ID=62044554
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020558445A Withdrawn JP2021522410A (ja) | 2018-04-20 | 2019-04-11 | 抑制剤を含むスズ又はスズ合金電気メッキのための組成物 |
Country Status (9)
| Country | Link |
|---|---|
| US (2) | US11242606B2 (https=) |
| EP (1) | EP3781729B1 (https=) |
| JP (1) | JP2021522410A (https=) |
| KR (1) | KR102769982B1 (https=) |
| CN (1) | CN112135929B (https=) |
| IL (1) | IL278024A (https=) |
| SG (1) | SG11202009106XA (https=) |
| TW (1) | TWI813670B (https=) |
| WO (1) | WO2019201753A1 (https=) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP4437167A1 (en) | 2021-11-22 | 2024-10-02 | Basf Se | Composition for tin or tin alloy electroplating comprising a pyrazole-type antioxidant |
| KR102568529B1 (ko) * | 2022-11-25 | 2023-08-22 | 주식회사 호진플라텍 | 보이드 생성이 억제되고 두께편차가 개선된 웨이퍼 범프용 주석 전기 도금액 |
| KR20250124510A (ko) * | 2024-02-13 | 2025-08-20 | 한국생산기술연구원 | 솔더 범프용 주석 도금액 |
Family Cites Families (34)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4135991A (en) | 1977-08-12 | 1979-01-23 | R. O. Hull & Company, Inc. | Bath and method for electroplating tin and/or lead |
| GB1567235A (en) | 1978-05-15 | 1980-05-14 | Pmd Chemicals Ltd | Electrodeposition of tin or tin/lead alloys |
| US4871429A (en) | 1981-09-11 | 1989-10-03 | Learonal, Inc | Limiting tin sludge formation in tin or tin/lead electroplating solutions |
| US5174887A (en) | 1987-12-10 | 1992-12-29 | Learonal, Inc. | High speed electroplating of tinplate |
| JP3301707B2 (ja) | 1997-01-20 | 2002-07-15 | ディップソール株式会社 | 錫−銀合金酸性電気めっき浴 |
| JP4296358B2 (ja) | 1998-01-21 | 2009-07-15 | 石原薬品株式会社 | 銀及び銀合金メッキ浴 |
| US7628903B1 (en) | 2000-05-02 | 2009-12-08 | Ishihara Chemical Co., Ltd. | Silver and silver alloy plating bath |
| US6818545B2 (en) | 2001-03-05 | 2004-11-16 | Megic Corporation | Low fabrication cost, fine pitch and high reliability solder bump |
| TWI245402B (en) | 2002-01-07 | 2005-12-11 | Megic Corp | Rod soldering structure and manufacturing process thereof |
| EP1342817A3 (en) * | 2002-03-05 | 2006-05-24 | Shipley Co. L.L.C. | Limiting the loss of tin through oxidation in tin or tin alloy electroplating bath solutions |
| TWI353395B (en) * | 2003-12-31 | 2011-12-01 | Microfabrica Inc | Method and apparatus for maintaining parallelism o |
| TWI240979B (en) | 2004-10-28 | 2005-10-01 | Advanced Semiconductor Eng | Bumping process |
| KR100921919B1 (ko) | 2007-11-16 | 2009-10-16 | (주)화백엔지니어링 | 반도체 칩에 형성되는 구리기둥-주석범프 및 그의 형성방법 |
| JP5583894B2 (ja) | 2008-06-12 | 2014-09-03 | ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． | 電気錫めっき液および電気錫めっき方法 |
| EP2199315B1 (en) | 2008-12-19 | 2013-12-11 | Basf Se | Composition for metal electroplating comprising leveling agent |
| RU2529607C2 (ru) * | 2009-04-07 | 2014-09-27 | Басф Се | Композиция для нанесения металлического покрытия, содержащая подавляющий агент, для беспустотного заполнения субмикронных элементов |
| WO2010115757A1 (en) * | 2009-04-07 | 2010-10-14 | Basf Se | Composition for metal plating comprising suppressing agent for void free submicron feature filling |
| CN104195602B (zh) * | 2009-04-07 | 2017-05-31 | 巴斯夫欧洲公司 | 包含抑制剂的无空隙亚微米结构填充用金属电镀组合物 |
| EP2504396B1 (en) * | 2009-11-27 | 2021-02-24 | Basf Se | Composition for copper electroplating comprising leveling agent |
| US8262895B2 (en) * | 2010-03-15 | 2012-09-11 | Rohm And Haas Electronic Materials Llc | Plating bath and method |
| EP2655457B1 (en) * | 2010-12-21 | 2019-04-10 | Basf Se | Composition for metal electroplating comprising leveling agent |
| US8888984B2 (en) * | 2012-02-09 | 2014-11-18 | Rohm And Haas Electronic Materials Llc | Plating bath and method |
| US8980077B2 (en) | 2012-03-30 | 2015-03-17 | Rohm And Haas Electronic Materials Llc | Plating bath and method |
| RU2015121797A (ru) * | 2012-11-09 | 2017-01-10 | Басф Се | Композиция для электролитического осаждения металла, содержащая выравнивающий агент |
| JP6133056B2 (ja) * | 2012-12-27 | 2017-05-24 | ローム・アンド・ハース電子材料株式会社 | スズまたはスズ合金めっき液 |
| US20150122662A1 (en) * | 2013-11-05 | 2015-05-07 | Rohm And Haas Electronic Materials Llc | Plating bath and method |
| US20150122661A1 (en) * | 2013-11-05 | 2015-05-07 | Rohm And Haas Electronic Materials Llc | Plating bath and method |
| JP2015193916A (ja) * | 2014-03-18 | 2015-11-05 | 上村工業株式会社 | 錫または錫合金の電気めっき浴、およびバンプの製造方法 |
| EP3177671A1 (en) | 2014-08-06 | 2017-06-14 | Basf Se | Improved process for preparing polymeric, ionic imidazolium compounds |
| CN107531859B (zh) * | 2015-04-28 | 2020-02-14 | 罗门哈斯电子材料有限责任公司 | 作为电镀浴添加剂的双酸酐与二胺的反应产物 |
| US10988852B2 (en) * | 2015-10-27 | 2021-04-27 | Rohm And Haas Electronic Materials Llc | Method of electroplating copper into a via on a substrate from an acid copper electroplating bath |
| JP2019503420A (ja) | 2016-01-12 | 2019-02-07 | ビーエーエスエフ ソシエタス・ヨーロピアＢａｓｆ Ｓｅ | モノアルデヒドを使用しない又はモノアルデヒドをほぼ使用しない高分子イミダゾリウム化合物の製造方法 |
| US11926918B2 (en) * | 2016-12-20 | 2024-03-12 | Basf Se | Composition for metal plating comprising suppressing agent for void free filing |
| US11535946B2 (en) | 2017-06-01 | 2022-12-27 | Basf Se | Composition for tin or tin alloy electroplating comprising leveling agent |
-
2019
- 2019-04-11 EP EP19715960.1A patent/EP3781729B1/en active Active
- 2019-04-11 KR KR1020207031530A patent/KR102769982B1/ko active Active
- 2019-04-11 CN CN201980033676.1A patent/CN112135929B/zh active Active
- 2019-04-11 JP JP2020558445A patent/JP2021522410A/ja not_active Withdrawn
- 2019-04-11 SG SG11202009106XA patent/SG11202009106XA/en unknown
- 2019-04-11 US US17/048,770 patent/US11242606B2/en active Active
- 2019-04-11 WO PCT/EP2019/059344 patent/WO2019201753A1/en not_active Ceased
- 2019-04-18 TW TW108113573A patent/TWI813670B/zh active
-
2020
- 2020-10-13 IL IL278024A patent/IL278024A/en unknown
-
2021
- 2021-12-30 US US17/566,426 patent/US11840771B2/en active Active
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