JP2021522410A5 - - Google Patents

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Publication number
JP2021522410A5
JP2021522410A5 JP2020558445A JP2020558445A JP2021522410A5 JP 2021522410 A5 JP2021522410 A5 JP 2021522410A5 JP 2020558445 A JP2020558445 A JP 2020558445A JP 2020558445 A JP2020558445 A JP 2020558445A JP 2021522410 A5 JP2021522410 A5 JP 2021522410A5
Authority
JP
Japan
Prior art keywords
composition according
aqueous composition
substrate
tin
ethylene oxide
Prior art date
Application number
JP2020558445A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2019201753A5 (https=
JP2021522410A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/EP2019/059344 external-priority patent/WO2019201753A1/en
Publication of JP2021522410A publication Critical patent/JP2021522410A/ja
Publication of JP2021522410A5 publication Critical patent/JP2021522410A5/ja
Publication of JPWO2019201753A5 publication Critical patent/JPWO2019201753A5/ja
Withdrawn legal-status Critical Current

Links

JP2020558445A 2018-04-20 2019-04-11 抑制剤を含むスズ又はスズ合金電気メッキのための組成物 Withdrawn JP2021522410A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP18168462 2018-04-20
EP18168462.2 2018-04-20
PCT/EP2019/059344 WO2019201753A1 (en) 2018-04-20 2019-04-11 Composition for tin or tin alloy electroplating comprising suppressing agent

Publications (3)

Publication Number Publication Date
JP2021522410A JP2021522410A (ja) 2021-08-30
JP2021522410A5 true JP2021522410A5 (https=) 2022-04-18
JPWO2019201753A5 JPWO2019201753A5 (https=) 2022-04-18

Family

ID=62044554

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2020558445A Withdrawn JP2021522410A (ja) 2018-04-20 2019-04-11 抑制剤を含むスズ又はスズ合金電気メッキのための組成物

Country Status (9)

Country Link
US (2) US11242606B2 (https=)
EP (1) EP3781729B1 (https=)
JP (1) JP2021522410A (https=)
KR (1) KR102769982B1 (https=)
CN (1) CN112135929B (https=)
IL (1) IL278024A (https=)
SG (1) SG11202009106XA (https=)
TW (1) TWI813670B (https=)
WO (1) WO2019201753A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4437167A1 (en) 2021-11-22 2024-10-02 Basf Se Composition for tin or tin alloy electroplating comprising a pyrazole-type antioxidant
KR102568529B1 (ko) * 2022-11-25 2023-08-22 주식회사 호진플라텍 보이드 생성이 억제되고 두께편차가 개선된 웨이퍼 범프용 주석 전기 도금액
KR20250124510A (ko) * 2024-02-13 2025-08-20 한국생산기술연구원 솔더 범프용 주석 도금액

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JP5583894B2 (ja) 2008-06-12 2014-09-03 ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． 電気錫めっき液および電気錫めっき方法
EP2199315B1 (en) 2008-12-19 2013-12-11 Basf Se Composition for metal electroplating comprising leveling agent
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RU2015121797A (ru) * 2012-11-09 2017-01-10 Басф Се Композиция для электролитического осаждения металла, содержащая выравнивающий агент
JP6133056B2 (ja) * 2012-12-27 2017-05-24 ローム・アンド・ハース電子材料株式会社 スズまたはスズ合金めっき液
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US11926918B2 (en) * 2016-12-20 2024-03-12 Basf Se Composition for metal plating comprising suppressing agent for void free filing
US11535946B2 (en) 2017-06-01 2022-12-27 Basf Se Composition for tin or tin alloy electroplating comprising leveling agent

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