JP2018123430A5 - - Google Patents
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- Publication number
- JP2018123430A5 JP2018123430A5 JP2018017060A JP2018017060A JP2018123430A5 JP 2018123430 A5 JP2018123430 A5 JP 2018123430A5 JP 2018017060 A JP2018017060 A JP 2018017060A JP 2018017060 A JP2018017060 A JP 2018017060A JP 2018123430 A5 JP2018123430 A5 JP 2018123430A5
- Authority
- JP
- Japan
- Prior art keywords
- layer
- copper foil
- group
- roughened particle
- particle layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000010410 layer Substances 0.000 claims description 63
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 37
- 239000011889 copper foil Substances 0.000 claims description 36
- 239000002245 particle Substances 0.000 claims description 29
- -1 triazole compounds Chemical class 0.000 claims description 22
- 239000011247 coating layer Substances 0.000 claims description 21
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 claims description 12
- 239000006087 Silane Coupling Agent Substances 0.000 claims description 8
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 claims description 8
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 5
- KXDHJXZQYSOELW-UHFFFAOYSA-M Carbamate Chemical group NC([O-])=O KXDHJXZQYSOELW-UHFFFAOYSA-M 0.000 claims description 4
- OFOBLEOULBTSOW-UHFFFAOYSA-L Malonate Chemical group [O-]C(=O)CC([O-])=O OFOBLEOULBTSOW-UHFFFAOYSA-L 0.000 claims description 4
- 125000003668 acetyloxy group Chemical group [H]C([H])([H])C(=O)O[*] 0.000 claims description 4
- 125000003277 amino group Chemical group 0.000 claims description 4
- 125000001951 carbamoylamino group Chemical group C(N)(=O)N* 0.000 claims description 4
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 4
- 125000004093 cyano group Chemical group *C#N 0.000 claims description 4
- 230000008021 deposition Effects 0.000 claims description 4
- 125000004663 dialkyl amino group Chemical group 0.000 claims description 4
- 125000003700 epoxy group Chemical group 0.000 claims description 4
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 4
- 125000000843 phenylene group Chemical group C1(=C(C=CC=C1)*)* 0.000 claims description 4
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 claims description 4
- 125000004076 pyridyl group Chemical group 0.000 claims description 4
- 239000000126 substance Substances 0.000 claims description 4
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims description 4
- 239000002131 composite material Substances 0.000 claims 19
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 claims 6
- 230000003449 preventive effect Effects 0.000 claims 6
- 239000011888 foil Substances 0.000 claims 3
- 229910052751 metal Inorganic materials 0.000 claims 3
- 239000002184 metal Substances 0.000 claims 3
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 claims 2
- 239000012964 benzotriazole Substances 0.000 claims 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical group [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims 1
- 125000000217 alkyl group Chemical group 0.000 claims 1
- 125000003354 benzotriazolyl group Chemical class N1N=NC2=C1C=CC=C2* 0.000 claims 1
- 229910052804 chromium Inorganic materials 0.000 claims 1
- 239000011651 chromium Substances 0.000 claims 1
- 150000001875 compounds Chemical class 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 claims 1
- 239000010949 copper Substances 0.000 claims 1
- 239000000203 mixture Substances 0.000 claims 1
- 238000007788 roughening Methods 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
- 239000002861 polymer material Substances 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 125000003282 alkyl amino group Chemical group 0.000 description 1
- 229920006254 polymer film Polymers 0.000 description 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US15/422,960 | 2017-02-02 | ||
| US15/422,960 US10057984B1 (en) | 2017-02-02 | 2017-02-02 | Composite thin copper foil and carrier |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2018123430A JP2018123430A (ja) | 2018-08-09 |
| JP2018123430A5 true JP2018123430A5 (https=) | 2018-11-22 |
| JP6509392B2 JP6509392B2 (ja) | 2019-05-08 |
Family
ID=62980505
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2018017060A Active JP6509392B2 (ja) | 2017-02-02 | 2018-02-02 | 複合薄い電解銅箔およびそのキャリア層 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US10057984B1 (https=) |
| JP (1) | JP6509392B2 (https=) |
| KR (1) | KR101991618B1 (https=) |
| CN (1) | CN108391372B (https=) |
| TW (1) | TWI658926B (https=) |
Families Citing this family (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI656682B (zh) * | 2018-10-16 | 2019-04-11 | 長春石油化學股份有限公司 | 電解銅箔、包含其的電極、及包含其的鋰離子電池 |
| US11365486B2 (en) | 2018-10-16 | 2022-06-21 | Chang Chun Petrochemical Co., Ltd. | Electrolytic copper foil, electrode comprising the same, and lithium ion battery comprising the same |
| KR102331091B1 (ko) * | 2019-02-01 | 2021-11-25 | 장 춘 페트로케미컬 컴퍼니 리미티드 | 캐리어가 있는 동박 및 동박적층판 |
| US10581081B1 (en) * | 2019-02-01 | 2020-03-03 | Chang Chun Petrochemical Co., Ltd. | Copper foil for negative electrode current collector of lithium ion secondary battery |
| CN110241422B (zh) * | 2019-05-28 | 2021-03-30 | 电子科技大学 | 一种多层高频印制电路板铜箔表面粗化液及其使用方法 |
| US10697082B1 (en) * | 2019-08-12 | 2020-06-30 | Chang Chun Petrochemical Co., Ltd. | Surface-treated copper foil |
| TWI700393B (zh) | 2019-08-27 | 2020-08-01 | 長春石油化學股份有限公司 | 電解銅箔以及包含其之電極與鋰離子電池 |
| CN111424294A (zh) * | 2020-05-15 | 2020-07-17 | 惠州联合铜箔电子材料有限公司 | 反转铜箔生产工艺 |
| CN112226790B (zh) * | 2020-10-19 | 2022-04-22 | 九江德福科技股份有限公司 | 一种超薄高强度电子铜箔的生产方法 |
| TWI746345B (zh) * | 2021-01-08 | 2021-11-11 | 昂筠國際股份有限公司 | 金屬箔結構及其製造方法 |
| CN113388868A (zh) * | 2021-06-21 | 2021-09-14 | 集美大学 | 一种利用离散铬晶核制备自剥离超薄铜箔的方法 |
| CN114539174B (zh) * | 2022-01-11 | 2023-09-26 | 广东省科学院化工研究所 | 一种粘结增强剂及其制备方法和在pcb内层棕化中的应用 |
| KR102511335B1 (ko) * | 2022-05-09 | 2023-03-17 | 와이엠티 주식회사 | 캐리어 부착 금속박용 복합 이형층 및 이를 포함하는 금속박 |
| CN115087198B (zh) * | 2022-08-11 | 2022-12-20 | 广州方邦电子股份有限公司 | 金属箔的支持体、金属箔及其应用 |
| CN116288161B (zh) * | 2023-03-09 | 2024-10-25 | 珠海凯赛奥表面技术有限公司 | 一种极薄可剥离铜的制备方法 |
| TWI892146B (zh) * | 2023-06-01 | 2025-08-01 | 万閎企業有限公司 | 具超薄銅箔層的銅箔基板的製造方法 |
| CN117661046A (zh) * | 2023-11-30 | 2024-03-08 | 九江德福科技股份有限公司 | 一种具备双面疏松结构的电解铜箔及其制法、用途 |
| CN118685827B (zh) * | 2024-08-23 | 2024-12-13 | 安徽华威铜箔科技有限公司 | 一种一体式载体铜箔生产设备 |
| TWI911988B (zh) * | 2024-11-05 | 2026-01-11 | 南亞塑膠工業股份有限公司 | 複合銅箔及其製造方法 |
Family Cites Families (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3998601A (en) * | 1973-12-03 | 1976-12-21 | Yates Industries, Inc. | Thin foil |
| US5262247A (en) | 1989-05-17 | 1993-11-16 | Fukuda Kinzoku Hakufun Kogyo Kabushiki Kaisha | Thin copper foil for printed wiring board |
| JPH0818401B2 (ja) | 1989-05-17 | 1996-02-28 | 福田金属箔粉工業株式会社 | 複合箔とその製法 |
| JP3329572B2 (ja) * | 1994-04-15 | 2002-09-30 | 福田金属箔粉工業株式会社 | 印刷回路用銅箔およびその表面処理方法 |
| US6322904B1 (en) * | 1996-06-17 | 2001-11-27 | Mitsui Mining & Smelting Co., Ltd. | Copper foil for printed circuit boards |
| US6319620B1 (en) | 1998-01-19 | 2001-11-20 | Mitsui Mining & Smelting Co., Ltd. | Making and using an ultra-thin copper foil |
| JP2001089892A (ja) | 1999-09-21 | 2001-04-03 | Mitsui Mining & Smelting Co Ltd | キャリア箔付電解銅箔及びその製造方法並びにそのキャリア箔付電解銅箔を用いた銅張積層板 |
| US6569543B2 (en) | 2001-02-15 | 2003-05-27 | Olin Corporation | Copper foil with low profile bond enahncement |
| US6346335B1 (en) * | 2000-03-10 | 2002-02-12 | Olin Corporation | Copper foil composite including a release layer |
| JP3743702B2 (ja) * | 2000-04-28 | 2006-02-08 | 三井金属鉱業株式会社 | プリント配線板のセミアディティブ製造法 |
| US6660406B2 (en) * | 2000-07-07 | 2003-12-09 | Mitsui Mining & Smelting Co., Ltd. | Method for manufacturing printed wiring board comprising electrodeposited copper foil with carrier and resistor circuit; and printed wiring board comprising resistor circuit |
| JP3812834B2 (ja) | 2002-08-12 | 2006-08-23 | 三井金属鉱業株式会社 | キャリア箔付電解銅箔並びにその製造方法及びそのキャリア箔付電解銅箔を用いた銅張積層板 |
| US7132158B2 (en) * | 2003-10-22 | 2006-11-07 | Olin Corporation | Support layer for thin copper foil |
| US8866018B2 (en) * | 2009-01-12 | 2014-10-21 | Oak-Mitsui Technologies Llc | Passive electrical devices and methods of fabricating passive electrical devices |
| JP5448616B2 (ja) * | 2009-07-14 | 2014-03-19 | 古河電気工業株式会社 | 抵抗層付銅箔、該銅箔の製造方法および積層基板 |
| CN103154327A (zh) * | 2010-10-06 | 2013-06-12 | 古河电气工业株式会社 | 铜箔及其制备方法、带有载体的铜箔及其制备方法、印刷电路板、多层印刷电路板 |
| JP5875350B2 (ja) * | 2011-11-30 | 2016-03-02 | 三井金属鉱業株式会社 | 電解銅合金箔及びキャリア箔付電解銅合金箔 |
| CN104203567B (zh) * | 2012-02-01 | 2016-11-23 | 昭和电工包装株式会社 | 成型用包装材及其制造方法 |
| KR101909352B1 (ko) * | 2013-07-24 | 2018-10-17 | 제이엑스금속주식회사 | 표면 처리 동박, 캐리어가 부착된 동박, 기재, 수지 기재, 프린트 배선판, 구리 피복 적층판 및 프린트 배선판의 제조 방법 |
| JP6190500B2 (ja) * | 2015-08-06 | 2017-08-30 | Ｊｘ金属株式会社 | キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法 |
| CN105357868A (zh) * | 2015-11-19 | 2016-02-24 | 吴祖 | 双面线路板及加工方法 |
-
2017
- 2017-02-02 US US15/422,960 patent/US10057984B1/en active Active
-
2018
- 2018-01-26 TW TW107102898A patent/TWI658926B/zh active
- 2018-02-01 KR KR1020180013094A patent/KR101991618B1/ko active Active
- 2018-02-01 CN CN201810100850.7A patent/CN108391372B/zh active Active
- 2018-02-02 JP JP2018017060A patent/JP6509392B2/ja active Active
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