CN101417522A - 壳体及表面处理方法 - Google Patents
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Abstract
本发明涉及一种壳体,其包括一金属基材及形成于该金属基材表面的涂层,该涂层包括处于外表面的外覆层,其中该涂层还包括一粘合层,其位于该外覆层与该金属基材之间且与该外覆层相连。另外,本发明还提供一种表面处理方法。上述壳体具有可避免涂层损坏而影响外观的优点。
Description
技术领域
本发明是涉及一种壳体及表面处理方法,尤其是一种带有涂层的壳体及表面处理方法。
背景技术
随着电子产品之快速发展,便携式电子装置(如手机、MP3播放器、个人数字助理)之使用已非常普遍。并且为使便携式电子装置的具有较好的外观以及手感,便携式电子装置常会使用各种各样的材质来做壳体。
例如为使便携式电子装置具有金属外观,会用金属材料来做便携式电子装置的壳体。然而,尽管金属具有较高的表面强度,但由于金属壳体的外表面直接暴露在空气中,因此在一段时间使用后,其仍容易被刮伤、磨损及氧化。并且金属的硬度较高、柔软度不足,还容易造成金属壳体手感不佳。
为避免金属壳体被刮伤、磨损及氧化及提升金属壳体的手感,现有技术中会采用在金属壳体上涂布面漆形成外覆层来保护金属表面及提升壳体的柔软度。外覆层可对金属表面起到一定的保护作用,但在使用一段时间后,外覆层本身却容易发生脱落、腐蚀,仍会影响产品的外观。
发明内容
鉴于以上内容,有必要提供一种可避免涂层损坏而影响外观的壳体及表面处理方法。
一种壳体,其包括一金属基材及形成于该金属基材表面的涂层,该涂层包括处于外表面的外覆层,其中该涂层还包括一粘合层,其位于该外覆层与该金属基材之间且与该外覆层相连。
一种表面处理方法,在一金属基材表面涂布粘合剂,形成粘合层;及在该粘合层上涂布面漆,形成外覆层。
另一种表面处理方法,在一金属基材表面涂布底漆,形成一层底层;在该底层沉积一层镀膜层;在该镀膜层上涂布粘合剂,形成一层粘合层;及在该粘合层上涂布面漆,形成外覆层。
上述壳体的涂层包括粘合层,粘合层可增强外覆层在金属基材上的结合力,因此可防止或减少外覆层在使用时脱落,从而避免该涂层损坏,确保产品具有较好的外观。
附图说明
图1是本发明较佳实施方式一的壳体。
图2是本发明较佳实施方式二的壳体。
图3是本发明较佳实施方式三的壳体。
具体实施方式
下面将结合附图及实施例对壳体及表面处理方法做进一步详细说明。
请参见图1,所示为本发明较佳实施方式一的壳体10,其可用于便携式电子装置。壳体10包括金属基材12及形成于金属基材12表面的涂层14。涂层14包括与金属基材12表面相连接的镀膜层142,形成于镀膜层142上的粘合层144,及形成于粘合层144上且处于外表面的外覆层146。其中,镀膜层142的厚度可为10纳米至10微米,粘合层144的厚度可为1微米至20微米,外覆层146的厚度可为10微米至80微米。
金属基材12的材质可为铝合金、镁合金、不锈钢及其他金属之一或其组合物。此外,为确保壳体10具有较好的外观,金属基材12与镀膜层142相接的表面最好较为光滑。
镀膜层142可为导电层或电绝缘层,其材质可为锡、铝、硅铝合金、钛、碳化钛、氮化钛、镉、铟、二氧化硅及不锈钢之一或其组合物。
粘合层144的材质可由含氯聚烯烃(如聚氯乙烯,聚氯丙稀)构成,或由1%至99%的含氯聚烯烃及其他材质构成,该其他材质可为羟基聚合物、胺基聚合物、羧基聚合物及环氧基聚合物之一或其组合。
一种可制备壳体10的表面处理方法包括以下步骤:
步骤一,在金属基材12的表面真空沉积一层镀膜层142。沉积的方式可为物理气相沉积(Physical Vapor Deposition)、绝缘真空镀膜(Non Conductive Vacuum Metallization)或化学气相沉积(Chemical Vapor Deposition)。其中当采用物理气相沉积或绝缘真空镀膜形成镀膜层142时,可用锡、铝、硅铝合金、钛、碳化钛、氮化钛、镉、铟、二氧化硅及不锈钢之一或其组合物为靶材,用磁控溅射、等离子溅镀或蒸镀的方式把靶材沉积到金属基材12上形成镀膜层142。需要重点说明的是,用绝缘真空镀膜方法沉积的镀膜层142可为电绝缘层。
步骤二,在镀膜层142上涂布粘合剂,形成一层粘合层144。该步骤可在常温下进行。该粘合剂可全部由含氯聚烯烃构成(如聚氯乙烯,聚氯丙稀),或由1%至99%的含氯聚烯烃及其他物质构成,该其他物质可为羟基聚合物、胺基聚合物、羧基聚合物、环氧基聚合物之一或其组合。
步骤三,在粘合层144上涂布面漆,形成一层外覆层146。其中涂布方式可为喷涂或手涂。该面漆可以是透明漆或色漆,一般选用主要成分为丙烯酸树脂的面漆。将面漆涂布在粘合层144上后,可再依次经过流平、固化等步骤来形成外覆层146。固化方式可为热固化或光固化,例如当该面漆为紫外线固化漆时,面漆的固化就采用紫外线固化。
上述壳体10,由于在镀膜层142与外覆层146之间形成有粘合层144,粘合层144可增强镀膜层142与外覆层146之间的结合力,因此可防止或减少外覆层146在使用时脱落,避免镀膜层142被损坏,从而确保产品具有较好的外观。
具体在本实施方式中,粘合层144包括含氯聚烯烃,含氯聚烯烃的氯可与镀膜层142中的金属原子相作用形成具有较强作用力的化学键,且含氯聚烯烃中的有机分子链可与外覆层146的有机分子链相互吸引形成较强的结合力,因此粘合层144可使外覆层146与镀膜层142的结合力增强,从而防止外覆层146从金属基材12上脱落,避免或减少镀膜层142被氧化或腐蚀。并且由于粘合层144是由聚合物材料组成,其还具有一定的弹性,因此会增加处于外表面的外覆层146的柔软度,从而提升壳体10的手感。
另外,在壳体10的表面处理过程中,通过使用不同的靶材来沉积镀膜层142或改变面漆的颜色,还易于对壳体10的颜色进行变更,从而满足不同的外观需求。以及采用绝缘真空镀膜法形成绝缘镀膜层142时,绝缘镀膜层142可让电磁信号穿过,因此其不会影响便携式电子装置的既定的射频(RF)性能与电磁相容(ESD)性能。
请参见图2,所示为本发明较佳实施方式二的壳体20。壳体20与壳体10相似,包括金属基材22与涂层24,涂层24包括镀膜层242、粘合层244及外覆层246,其不同点在于:涂层24还包括一底层241。底层241形成在金属基材22的表面,处于金属基材22与镀膜层242之间。底层241的厚度可为1微米至30微米。表面处理过程是先在金属基材22上涂布底漆,并依次经过流平、固化等步骤形成底层241,然后再依次在底层241沉积镀膜层242,涂布粘合剂形成粘合层244及涂布面漆形成外覆层246。其中底漆的主要成份可为丙烯酸树脂,固化方式可为热固化或光固化。可以理解,在壳体20中,由于存在底层241,因此金属基材22与底层241的相接表面即使为粗糙面也可确保壳体20具有较好的外观。
可以理解,若金属基材表面外观较好,且具有一定的化学活性时,壳体可无需镀膜层。如图3所示,壳体30包括金属基材32及形成于金属基材32表面的涂层34。涂层34包括与金属基材32表面直接相连接的粘合层344,及形成于粘合层344上且处于外表面的外覆层346。表面处理过程是先在金属基材32上涂布粘合剂形成粘合层344及涂布面漆形成外覆层346。
可以理解,上述表面处理方法并不限于制备壳体,例如其还可用于处理部分表面处于设备外部的零件的表面。
另外,本领域技术人员还可在本发明精神内做其他变化,当然,这些依据本发明精神所做的变化,都应包含在本发明所要求保护的范围内。
Claims (10)
- 【权利要求1】一种壳体,其包括一金属基材及形成于该金属基材表面的涂层,该涂层包括处于外表面的外覆层,其特征在于:该涂层还包括一粘合层,其位于该外覆层与该金属基材之间且与该外覆层相连。
- 【权利要求2】如权利要求1所述的壳体,其特征在于:该粘合层的材质包括含氯聚烯烃。
- 【权利要求3】如权利要求2所述的壳体,其特征在于:该粘合层的材质还包括羟基聚合物、胺基聚合物、羧基聚合物及环氧基聚合物之一或其组合。
- 【权利要求4】如权利要求1所述的壳体,其特征在于:该涂层还包括一与该基材表面相连的底层。
- 【权利要求5】如权利要求4所述的壳体,其特征在于:该涂层还包括一位于该底层与该粘合层之间的镀膜层。
- 【权利要求6】如权利要求5所述的壳体,其特征在于:该镀膜层的材质为锡、铝、硅铝合金、钛、碳化钛、氮化钛、镉、铟、二氧化硅及不锈钢之一或其组合物。
- 【权利要求7】如权利要求1所述的壳体,其特征在于:该金属基材的材质为镁合金、铝合金及不锈钢之一或其组合物。
- 【权利要求8】一种表面处理方法,其包括以下步骤:在一金属基材表面涂布粘合剂,形成粘合层;及在该粘合层上涂布面漆,形成外覆层。
- 【权利要求9】如权利要求8所述的表面处理方法,其特征在于:该沉积为物理气相沉积或绝缘真空镀膜。
- 【权利要求10】一种表面处理方法,其包括以下步骤:在一金属基材表面涂布底漆,形成一层底层;在该底层沉积一层镀膜层;在该镀膜层上涂布粘合剂,形成一层粘合层;及在该粘合层上涂布面漆,形成外覆层。
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CN102958310A (zh) * | 2011-08-31 | 2013-03-06 | 光宝移动有限公司 | 制造电子装置的盖部件的方法 |
CN103660430A (zh) * | 2012-09-17 | 2014-03-26 | 曾凯熙 | 防信号阻隔金属镀膜编织布的加工方法 |
CN104626679A (zh) * | 2015-02-15 | 2015-05-20 | 珠海拾比佰彩图板股份有限公司 | 一种覆膜铝板及其制备方法 |
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CN101730409A (zh) * | 2008-10-17 | 2010-06-09 | 深圳富泰宏精密工业有限公司 | 壳体及其制造方法 |
CN101730413A (zh) * | 2008-10-27 | 2010-06-09 | 深圳富泰宏精密工业有限公司 | 壳体及其制作方法 |
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DE69634527D1 (de) * | 1995-10-26 | 2005-05-04 | Arkema Puteaux | Mit Polymeren beschichtete Metalloberflächen |
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TW393397B (en) | 1997-01-11 | 2000-06-11 | Siefried Lanitz | Polymer coated multilayer material and its production processes |
JP2001315162A (ja) * | 2000-05-10 | 2001-11-13 | Hitachi Ltd | 電子機器筐体の製造方法 |
US6548192B2 (en) | 2001-04-05 | 2003-04-15 | Vapor Technologies, Inc. | Coated article having the appearance of stainless steel |
JP2004134722A (ja) * | 2002-08-09 | 2004-04-30 | Nisshin Steel Co Ltd | 冷却能の高い電気・電子機器用筐体 |
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CN2714767Y (zh) * | 2004-07-27 | 2005-08-03 | 天津通广三星电子有限公司 | 无需窗帘的调光窗户 |
JP2007138257A (ja) * | 2005-11-18 | 2007-06-07 | Hitachi Metals Ltd | マグネシウム合金材の製造方法、マグネシウム合金材、これを用いて製造された筐体。 |
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US20110305832A1 (en) | 2011-12-15 |
US20090110853A1 (en) | 2009-04-30 |
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