200920592 九、發明說明： 【發明所屬之技術領域】 尤其係一種帶 本發明涉及一種殼體及表面處理方法 有塗層之殼體及表面處理方法。 【先前技術】 ^者電子產品之快速發展，攜帶式電子裝置（如 電話、MP3播放器、個人數位助理）之使用已非常普遍 且為使攜帶式電子裝置之具有較好之外觀以及手感，卜 式電子裝置常會使用各種各樣之材質來做殼體。心 例如為使攜帶式電子裝置具有金屬外觀，會用金屬材 料來做攜帶式電子裝置之殼體。惟，儘管金屬具有較高之 表面強度’但由於金屬殼體之外|面直接暴露於空氣中， 因此於-段時間制後，其仍容易被刮傷、磨損及氧化。 亚且金屬之硬度較高、柔軟度不足，還容易造成金屬 手感不佳。 為避免金屬殼體被到傷、磨損及氧化及提升金屬殼體 之手感’習知技術中會採用於金屬殼體上塗佈面漆形成外 覆層來保護金屬表面及提升殼體之柔軟度。外覆層可對金 屬表，起到-定保護作用，但使用—段時間後，外覆層本 身部谷易發生脫落、腐蝕，而仍影響產品之外觀。 【發明内容】 鑒於以上内容，有必要提供一種可避免塗層損壞而 響外觀之殼體及表面處理方法。 、 -種殼體，其包括—金屬基材及形成於該金屬基材表 200920592 面之塗層，該塗層包括處於外表面之外覆層，其中該塗層 還包括一黏合層，其位於該外覆層與該金屬基材之間且與 該外覆層相連。 一種表面處理方法，於一金屬基材表面塗佈黏合劑， 形成黏合層；及於該黏合層上塗佈面漆，形成外覆層。 另一種表面處理方法，於一金屬基材表面塗佈底漆， 形成一底層；於該底層沈積一鍍膜層；於該鍍膜層上塗佈 黏合劑，形成一黏合層；及於該黏合層上塗佈面漆，形成 外覆層。 上述殼體之塗層包括黏合層，黏合層可增強外覆層於 金屬基材上之結合力’因此可防止或減少外覆層於使用時 脫落，從而避免該塗層損壞，確保產品具有較好之外觀。 【實施方式】 下面將結合附圖及實施例對殼體及表面處理方法做 進一步詳細說明。 明參閱圖1，所示為本發明較佳實施方式一之殼體 10，其可用於攜帶式電子裝置。殼體10包括金屬基材12 及形成於金屬基材12表面之塗層U。塗層14包括與金屬 基材12表面相連接之鍍膜層142，形成於鍍膜層142上之 黏合層144 ’及形成於黏合層144上且處於外纟面之外覆 層146。其中，鍍膜層142之厚度可為1〇奈米至1〇微米， 黏口層144之厚度可為丄微米至2〇微米，外覆層之厚 度可為10微米至80微米。 金屬基材12之材質可為铭合金、鎮合金、不銹鋼及 200920592 其他金屬之一或其組合物。此外，為確保殼體ίο具有較好 之外觀，金屬基材12與鍍膜層142相接之表面最好較為光 滑。 鍍膜層142可為導電層或電絕緣層，其材質可為錫、 I呂、碎铭合金、鈦、竣化钦、氮化鈦、编、銦、二氧化石夕 及不銹鋼之一或其組合物。 黏合層144之材質可由含氯聚烯烴（如聚氯乙烯，聚 氯丙稀）構成，或由重量比為1%至99%之含氣聚烯烴及其 他材質構成，該其他材質可為羥基聚合物、胺基聚合物、 羧基聚合物及環氧基聚合物之一或其組合。 外覆層146之主要成分可為丙稀酸樹脂。 一種可製備殼體10之表面處理方法包括以下步驟： 步驟一，於金屬基材12之表面真空沈積一鍍膜層 142。沈積之方式可為物理氣相沈積（Physical Vapor Deposition)、絕緣真空鍍膜（Non Conductive Vacuum Metallization)或化學氣相沈積（Chemical Vapor Deposition)。其中當採用物理氣相沈積或絕緣真空鍍膜形 成鍍膜層142時，可用錫、鋁、矽鋁合金、鈦、碳化鈦、 氮化鈦、鎘、銦、二氧化矽及不銹鋼之一或其組合物為靶 材，用磁控濺射、等離子濺鍍或蒸鍍之方式把靶材沈積到 金屬基材12上形成鍍膜層142。需要重點說明：用絕緣真 空鍍膜方法沈積之鍍膜層142可為電絕緣層。 步驟二，於鍍膜層142上塗佈黏合劑，形成一黏合層 144。該步驟可於常溫下進行。該黏合劑可全部由含氯聚烯 200920592 烴構成（如聚氣乙烯，聚氣丙稀）’或由重量比為1%至99% 之含氣聚烯烴及其他物質構成，該其他物質可為羥基聚合 物、胺基聚合物、羧基聚合物、環氧基聚合物之一或其組 合。 步驟三，於黏合層144上塗佈面漆，形成一外覆層 146。其中塗佈方式可為喷塗或手塗。該面漆可以係透明^ 或色漆，一般選用主要成分為丙烯酸樹脂之面漆。將面漆 塗佈於黏合層144上後，可再依次經過流平、固化等步驟 來形成外覆層146。固化方式可為熱固化或光固化，例如 當該面漆為紫外線固化漆時，面漆之固化就採用紫外線固 化。 上述殼體10’由於於鍍膜層142與外覆層146之間形 成有黏合層144，黏合層144可增強鍍膜層142與外覆層 146、之間之結合力，因此可防止或減少外覆層於使用 時脫落，避免鍍膜層142被損壞，從而確保產品具有較好 之外觀。 人斤具體於本實施方式中，黏合層144包括含氯聚烯烴， 含《I聚烯烴之氯可與鍍膜層142中之金屬原子相作用形成 具有較強作用力之化學鍵，且含氯聚烯烴中之有機分子鏈 可與外覆層146之有機分子鏈相互吸引形成較強之結合 力，因此黏合層144可使外覆層146與鍍膜層142之結合 力增強，從而防止外覆層146從金屬基材12上脫落，避免 或減少鍍膜層142被氧化或腐蝕。並且由於黏合層144係 由聚合物材料組成，其還具有一定之彈性，因此會增加處 200920592 於外表面之外覆層146之柔軟度，從而提升殼體10之手感。 另外，於殼體10之表面處理過程中，通過使用不同 之靶材來沈積鑛膜層142或改變面漆之顏色，還易於對殼 體忉之顏色進行變更，從而滿足不同之外觀需求。以及採 用、”G緣真空鏡膜法形成絕緣鍍膜層14.2時，絕緣鍵膜層14 2 可讓電磁信號穿過，因此其不會影響攜帶式電子裝置既定 之射頻（RF)性能與電磁相容（ESD)性能。 請參閱圖2,所示為本發明較佳實施方式二之殼體 20。殼體20與殼體1〇相似，包括金屬基材22與塗層％。 塗層24包括鍍膜層242、黏合層2料及外覆層246，其不 同點在於·塗層24還包括-底層241。底層241形成於金 屬基材22之表面，處於金屬基材22與鍍膜層242之間。 底層241之厚度可為丄微米至3〇微米。表面處理過程係先 於金屬基材22上塗佈底漆，並依次經過流平、固化等步驟 形成底層241’然後再依次於底層241沈積鍍膜層242，塗 佈黏合劑形成黏合層244及塗佈面漆形成外覆層246。其 中底漆之主要成分可為丙烯酸樹脂，固化方式可為熱固化 或光固化。可以理解，於殼體2〇中，由於存在底層241, 因此金属基材22與底㉟241之相接表自即使為粗糖θ面也可 確保殼體20具有較好之外觀。 可以理解，若金屬基材表面外觀較好，且具有一定的 化學活性時，殼體可無需鐘膜層。如目3所示，殼體3〇 包括金屬基材32及形成於金屬基材32表面之塗層％。塗 層34包括與金屬基材32表面直接相連接之黏合^⑽， 200920592 及形成於黏合層344上且處於外表 ^ ϊ® 2Ά ^ 4- A „ 之外覆層346。表面 處理杨錢於金屬基材32上塗佈黏合· 及塗饰面漆形成外覆層346。 /成黏。層344 可以理解，上述表面處理方、、木廿丁阳 私甘、方法並不限於製備殼體，例 -還可用於處理部分表面處於設備外部之零件之表面。 綜上料，本發明符合發料利要件，爰依法提出專 利申請。惟，以上所述者僅為本發明之較佳實施方式， 發明之範圍並不以上述實施方式為限，舉凡熟悉本案技藐 之人士，於援依本案發明精神所作之等效修飾或變化，: 應包含於以下之申請專利範圍内。 白 【圖式簡單說明】 圖1係本發明較佳實施方式一之殼體。 圖2係本發明較佳實施方式二之殼體。 圖3係本發明較佳實施方式三之殼體。 【主要元件符號說明】 殼體 10 、 20 、 30 金屬基材 12、22 ' 32 塗層 14 、 24 > 34 鍍膜層 142 、 242 黏合層 144 、 244 ' 344 外覆層 146 、 246 ' 346 底層 241 11200920592 IX. Description of the invention: [Technical field to which the invention pertains] In particular, the invention relates to a casing and a surface treatment method, a coated casing and a surface treatment method. [Prior Art] The rapid development of electronic products, the use of portable electronic devices (such as telephones, MP3 players, personal digital assistants) has become very common and for portable electronic devices to have a good appearance and feel, Electronic devices often use a variety of materials to make the housing. For example, in order to make the portable electronic device have a metallic appearance, a metal material is used as the housing of the portable electronic device. However, although the metal has a high surface strength', since the surface of the metal casing is directly exposed to the air, it is easily scratched, worn, and oxidized after a period of time. The hardness of the sub-metal is high, the softness is insufficient, and the metal feel is not good. In order to avoid the metal casing being damaged, worn and oxidized and to enhance the feel of the metal casing, the prior art adopts a coating on the metal casing to form an outer coating to protect the metal surface and enhance the softness of the casing. . The outer cover can play a protective role on the metal surface, but after using for a period of time, the outer layer of the outer layer tends to fall off and corrode, and still affect the appearance of the product. SUMMARY OF THE INVENTION In view of the above, it is necessary to provide a housing and a surface treatment method that can avoid the appearance of a damaged coating. a casing comprising: a metal substrate and a coating formed on the surface of the metal substrate table 200920592, the coating comprising a coating on the outer surface, wherein the coating further comprises an adhesive layer located at The outer cover is connected to the metal substrate and to the outer cover. A surface treatment method is characterized in that a surface of a metal substrate is coated with a binder to form an adhesive layer; and a top coat is applied on the adhesive layer to form an outer cover layer. Another surface treatment method is: applying a primer to a surface of a metal substrate to form a bottom layer; depositing a coating layer on the bottom layer; applying a binder on the coating layer to form an adhesive layer; and forming the adhesive layer on the adhesive layer The topcoat is applied to form an outer cover. The coating of the above casing comprises an adhesive layer, and the adhesive layer can enhance the bonding force of the outer coating on the metal substrate. Therefore, the outer coating can be prevented or reduced from falling off during use, thereby avoiding damage of the coating and ensuring that the product has a comparative advantage. Good appearance. [Embodiment] The housing and the surface treatment method will be further described in detail below with reference to the accompanying drawings and embodiments. Referring to Figure 1, there is shown a housing 10 in accordance with a preferred embodiment of the present invention, which can be used in a portable electronic device. The casing 10 includes a metal substrate 12 and a coating U formed on the surface of the metal substrate 12. The coating 14 includes a coating layer 142 attached to the surface of the metal substrate 12, an adhesive layer 144' formed on the coating layer 142, and a coating layer 146 formed on the bonding layer 144 and outside the outer surface. The thickness of the coating layer 142 may be from 1 nanometer to 1 micrometer, the thickness of the adhesive layer 144 may be from 丄 micrometer to 2 micrometers, and the thickness of the outer coating layer may be from 10 micrometers to 80 micrometers. The material of the metal substrate 12 may be one of alloys, alloys, stainless steels and other metals of 200920592 or a combination thereof. Further, in order to ensure a good appearance of the casing ί, the surface of the metal substrate 12 and the coating layer 142 are preferably smooth. The coating layer 142 may be a conductive layer or an electrically insulating layer, and the material thereof may be one of tin, Ilu, sinter alloy, titanium, bismuth, titanium nitride, braid, indium, sulphur dioxide, and stainless steel or a combination thereof. Things. The material of the adhesive layer 144 may be composed of a chlorine-containing polyolefin (such as polyvinyl chloride, polyvinyl chloride), or a gas-containing polyolefin and other materials in a weight ratio of 1% to 99%, and the other material may be a hydroxyl polymerization. One or a combination of an amine, an amine polymer, a carboxyl polymer, and an epoxy polymer. The main component of the outer cover 146 may be an acrylic resin. A surface treatment method for preparing the casing 10 includes the following steps: Step 1: A coating layer 142 is vacuum deposited on the surface of the metal substrate 12. The deposition method may be physical Vapor Deposition, Non Conductive Vacuum Metallization or Chemical Vapor Deposition. Wherein the coating layer 142 is formed by physical vapor deposition or insulating vacuum coating, one of tin, aluminum, bismuth aluminum alloy, titanium, titanium carbide, titanium nitride, cadmium, indium, cerium oxide and stainless steel or a combination thereof may be used. As a target, a target layer is deposited on the metal substrate 12 by magnetron sputtering, plasma sputtering or evaporation to form a plating layer 142. It is important to note that the coating layer 142 deposited by the insulating vacuum coating method may be an electrically insulating layer. In step two, an adhesive is applied to the coating layer 142 to form an adhesive layer 144. This step can be carried out at room temperature. The binder may be composed entirely of chlorinated polyene 200920592 hydrocarbons (eg, polyethylene, polypropylene) or may be composed of a gas-containing polyolefin and other materials in a weight ratio of 1% to 99%, and the other materials may be One or a combination of a hydroxyl polymer, an amine based polymer, a carboxyl polymer, an epoxy polymer. In step three, a top coat is applied to the adhesive layer 144 to form an outer cover 146. The coating method can be spray coating or hand coating. The topcoat can be transparent or painted, and the topcoat is mainly made of acrylic resin. After the topcoat is applied to the adhesive layer 144, the outer cover 146 can be formed by successive steps of leveling, curing, and the like. The curing method may be thermal curing or photocuring, for example, when the topcoat is an ultraviolet curing lacquer, the curing of the topcoat is UV curing. Because the adhesive layer 144 is formed between the coating layer 142 and the outer cover 146, the adhesive layer 144 can enhance the bonding force between the coating layer 142 and the outer cover 146, thereby preventing or reducing the outer cover. The layer is peeled off during use, and the coating layer 142 is prevented from being damaged, thereby ensuring a good appearance of the product. Specifically, in the embodiment, the adhesive layer 144 includes a chlorine-containing polyolefin, and the chlorine containing the I polyolefin can react with the metal atom in the coating layer 142 to form a chemical bond having a strong force, and the chlorine-containing polyolefin. The organic molecular chain can attract the organic molecular chain of the outer cover 146 to form a strong binding force, so the adhesive layer 144 can enhance the bonding force between the outer cover 146 and the coating layer 142, thereby preventing the outer cover 146 from The metal substrate 12 is peeled off to prevent or reduce the oxidation or corrosion of the plating layer 142. And since the adhesive layer 144 is composed of a polymer material, it also has a certain elasticity, so that the softness of the cover layer 146 outside the outer surface of the 200920592 is increased, thereby enhancing the hand feeling of the casing 10. In addition, during the surface treatment of the casing 10, by depositing the mineral film layer 142 or changing the color of the topcoat by using different targets, it is also easy to change the color of the casing to meet different appearance requirements. And when the "G-edge vacuum mirror film method is used to form the insulating coating layer 14.2, the insulating key layer 14 2 allows the electromagnetic signal to pass through, so that it does not affect the established radio frequency (RF) performance and electromagnetic compatibility of the portable electronic device. (ESD) Performance Referring to Figure 2, there is shown a housing 20 in accordance with a preferred embodiment of the present invention. The housing 20 is similar to the housing 1 , and includes a metal substrate 22 and a coating %. The coating 24 includes a coating. The layer 242, the adhesive layer 2 and the outer cover 246 are different in that the coating 24 further includes a bottom layer 241. The bottom layer 241 is formed on the surface of the metal substrate 22 between the metal substrate 22 and the plating layer 242. The thickness of 241 may be from 丄 micron to 3 〇 micron. The surface treatment process is to apply a primer on the metal substrate 22, and then through the steps of leveling, solidification, etc. to form the bottom layer 241' and then deposit the coating layer on the bottom layer 241. 242, the adhesive is applied to form the adhesive layer 244 and the top coat is applied to form the outer cover layer 246. The main component of the primer may be an acrylic resin, and the curing method may be heat curing or photocuring. In the middle, due to the existence of the bottom layer 241, gold The connection between the substrate 22 and the bottom 35241 can ensure that the housing 20 has a good appearance even if it is a coarse sugar θ surface. It can be understood that if the surface of the metal substrate has a good appearance and has a certain chemical activity, the housing The film layer may be omitted. As shown in Fig. 3, the casing 3 includes a metal substrate 32 and a coating % formed on the surface of the metal substrate 32. The coating 34 includes a bonding directly to the surface of the metal substrate 32. (10), 200920592 and a coating 346 formed on the adhesive layer 344 and outside the surface ϊ® 2Ά ^ 4- A „. The surface treatment Yang Qian applies a coating on the metal substrate 32 and a finish coat to form an outer cover 346. / Become sticky. The layer 344 can be understood that the above-mentioned surface treatment method, the method is not limited to the preparation of the casing, and can be used to treat the surface of the part whose surface is outside the apparatus. In summary, the present invention complies with the requirements of the issue of the materials, and the patent application is filed according to law. The above is only the preferred embodiment of the present invention, and the scope of the invention is not limited to the above embodiments, and those skilled in the art will be equivalently modified or changed in the spirit of the invention. : It should be included in the scope of the following patent application. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a casing of a preferred embodiment 1 of the present invention. 2 is a housing of a preferred embodiment 2 of the present invention. Figure 3 is a perspective view of a preferred embodiment of the present invention. [Description of main component symbols] Housing 10, 20, 30 Metal substrate 12, 22' 32 Coating 14, 24 > 34 Coating layer 142, 242 Adhesive layer 144, 244 ' 344 Overlay 146, 246 ' 346 Bottom layer 241 11