TW202019262A - Housing and method for making the same - Google Patents

Abstract

A housing at least includes a substrate and a ceramic coating. The substrate is a composite. The substrate includes a metal member and a plastic member, and a joint line is formed at a joint of the metal member and the plastic member. The housing further includes a plating layer and an electrophoretic layer. The plating layer is formed on a surface of the substrate. The electrophoretic layer is formed on a surface of the plating layer, and the plating layer is used to improve adhesion between the electrophoretic layer and the substrate. The electrophoretic layer is used for shielding the joint line. The ceramic coating is formed on a surface of the electrophoretic layer. The disclosure further provides a method for making the housing.

Description

Shell and preparation method

The invention relates to a shell and a preparation method thereof.

Most of the electronic devices on the market, such as mobile phones and tablet computers, are designed with one or more plastics. This design is to enable the signals of electronic devices to be sent and received normally through the plastic position. Therefore, for the above-mentioned casing made of a combination of two different materials, in order to make the casing have the appearance effect of uniform appearance color and gloss, it is currently achieved by multi-layer spraying. However, the general coating technique requires spraying a primer and at least two polishing layers to obtain a casing with consistent appearance and gloss. However, there are still the following problems: 1. It can not produce good adhesion on the different materials of the two, and it is difficult to achieve mass production; 2. In mass production, the intermediate grinding layer requires a lot of manpower and equipment to complete, production capacity Extremely limited.

In view of this, it is necessary to provide a housing with a simple structure, which has an integrated appearance effect.

The invention also provides a method for preparing the shell.

A shell includes at least a base material and a ceramic coating. The base material is a composite part including a metal part and a plastic part. A joint line is formed at a joint of the metal part and the plastic part. The shell It also includes a coating layer and an electrophoretic layer, the coating layer is formed on the surface of the substrate, the electrophoretic layer is formed on the surface of the coating layer, the coating layer is used to improve the electrophoretic layer and the substrate The electrophoretic layer is used to shield the bonding line, and the ceramic coating is formed on the surface of the electrophoretic layer.

A method for preparing a shell includes the following steps:

Providing a base material, the base material being a composite part, including a metal part and a plastic part, and a joint line is formed at a joint of the metal part and the plastic part;

Forming a coating layer on the surface of the substrate, the coating layer is used to improve the adhesion of the substrate;

Performing electrophoretic treatment on the substrate on which the coating layer is formed to form an electrophoretic layer on the surface of the coating layer;

A ceramic coating is formed on the surface of the electrophoretic layer.

In summary, a coating layer, an electrophoretic layer, and a ceramic coating layer are sequentially formed on the second surface of the substrate, and then the housing is formed. Among them, the structural arrangement of the casing optimizes the manufacturing process of the casing and reduces the cost. In addition, the electrophoretic layer improves the bonding performance with the substrate through the coating layer, and effectively shields the bonding line of the substrate, and also solves the surface caused by different materials in the substrate The difference in glossiness, shape and color, in turn, makes the shell have an integrated appearance effect.

The technical solutions in the embodiments of the present invention will be described clearly and completely in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, but not all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons with ordinary knowledge in the technical field without making creative work fall within the protection scope of the present invention.

It should be noted that when a component is said to be "fixed" to another component, it can be directly on another component or it can also exist in a centered component. When a component is considered to be "connected" to another component, it can be directly connected to another component or there can be centered components at the same time. When a component is considered to be "set on" another component, it may be set directly on another component or there may be a centered component at the same time.

Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the technical field of the present invention. The terminology used in the description of the present invention herein is for the purpose of describing specific embodiments, and is not intended to limit the present invention. The term "and/or" as used herein includes any and all combinations of one or more related listed items.

Referring to FIG. 1, a preferred embodiment of the present invention provides a housing 10. The casing 10 can be applied to electronic devices such as mobile phones and tablet computers.

The casing 10 includes at least a base material 101, a coating layer 102, an electrophoretic layer 103, and a ceramic coating 104.

The substrate 101 includes a first surface 1011 and a second surface 1013 opposite to the first surface 1011. Wherein, the first surface 1011 can be used as an inner surface of the housing 10 for setting various electronic components, such as antennas, heat dissipation modules, and chips.

In this embodiment, the substrate 101 is a composite part, including a metal part 1012 and a plastic part 1014. A bonding wire 1016 is formed at the junction of the metal part 1012 and the plastic part 1014. The material of the metal piece 1012 may be aluminum alloy, stainless steel, titanium alloy, magnesium alloy, zinc alloy, or other metal materials. The material of the plastic part 1014 may be polybutylene terephthalate, composite material of polybutylene terephthalate and glass fiber, polyamide, composite material of polyamide and glass fiber, poly Phenylene sulfide, polyphenylene sulfide and glass fiber composite materials, polyether ether ketone or other plastics.

The coating layer 102 is formed on the second surface 1013 of the substrate 101 to provide good adhesion to the substrate 101, thereby overcoming the surface adhesion of the substrate 101 due to itself being a composite part Good question. Wherein, the thickness of the plating layer 102 is 10-100 nm.

In this embodiment, the plating layer 102 is an NCVM (Non Conductive Vacuum Metallization, vacuum non-conductive plating) film. The coating layer 102 can be formed on the second surface 1013 of the substrate 101 by vacuum evaporation or vacuum sputtering. Wherein, the plating layer 102 is an aluminum layer, an indium layer, a tin layer, and a mixed plating layer of two or three of aluminum, indium, and tin.

Further, the coating layer 102 is a discontinuous film, so that the communication signal in the electronic device is not affected.

The electrophoretic layer 103 is formed on the surface of the coating layer 102 to fill the height difference between the metal part 1012 and the plastic part 1014 in the substrate, fill the gap of the bonding line 1016 and shield the place The bonding line 1016 is used to solve the difference in surface glossiness, morphology and color caused by different materials in the substrate 101, so that the casing 10 has an integrated appearance effect. The thickness of the electrophoretic layer 103 is 10-30um. Wherein, the plating layer 102 is also used to improve the binding force of the base material 101 and the electrophoretic layer 103.

Specifically, the substrate 101 on which the plating layer 102 is formed is placed in an electrophoresis tank (not shown) with an electrophoresis tank solution, and electrophoresis treatment is performed at a voltage of 30-150V for 20-80 seconds, thereby An electrophoretic layer 103 is formed on the surface of the plating layer 102. In the electrophoretic process, the temperature of the electrodeposition bath is 25-30 ^o C, a conductivity of 400-700us / cm, PH value of 4.0-4.5. In this embodiment, the electrophoresis bath includes 8-12% solid paint and 88-92% distilled water. Wherein, the solid paint includes color filler and resin. The content of the color filler is 50-66g/1L electrophoresis bath.

The ceramic coating 104 is formed on the surface of the electrophoretic layer 103 so that the casing 10 has a ceramic texture. The ceramic coating 104 is used to enhance the hardness and thermal conductivity of the housing 10 and further shield the bonding wire 1016. The thickness of the ceramic coating 104 is 10-70um.

In this embodiment, the ceramic coating 104 is formed by spraying ceramic paint on the surface of the electrophoretic layer 103. The ceramic paint includes 30-60% ceramic paint main agent, 6-30% curing agent and 18-60% thinner. The ceramic paint main agent includes a nano ceramic filler and a solvent. The particle diameter of the nano ceramic filler is 0.01-5um. Wherein, the nano-ceramic filler in the ceramic paint can enhance the hardness of the ceramic coating 104, thereby increasing the hardness of the housing 10. At the same time, the nano-ceramic filler in the ceramic paint can also improve the shielding property of the ceramic coating 104.

In this embodiment, the casing 10 further includes a color layer 105. The specific color of the color layer 105 can be customized according to the needs of users, and can be black, white, blue, etc. The thickness of the color layer 105 is 10-20um.

Further, the casing 10 further includes a protective layer 106. The protective layer 106 has anti-fouling capability and is used to protect the casing 10. In this embodiment, the protective layer 106 is formed by spraying topcoat on the surface of the color layer 105. The top coat includes 40-60% acrylic resin and 40-60% thinner. The thickness of the protective layer 106 is 10-30um.

It can be understood that the protective layer 106 may also be atomized and/or brightened according to the actual needs of the user.

In one embodiment, the protective layer 106 is a transparent layer, so that the color of the color layer 105 can be seen through the protective layer 106, thereby enhancing the appearance and decoration effect of the housing 10.

Furthermore, the casing 10 further includes a pattern layer 107. The pattern layer 107 is formed between the color layer 105 and the protective layer 106. Wherein, the pattern layer 107 may be various graphics, letters, numbers, or trademarks.

The present invention provides a method for preparing a housing 10, which specifically includes the following steps:

Provide a substrate 101. The substrate 101 includes a first surface 1011 and a second surface 1013 opposite to the first surface 1011. Wherein, the first surface 1011 can be used as an inner surface of the housing 10 for setting various electronic components, such as antennas, heat dissipation modules, and chips.

In this embodiment, the substrate 101 is a composite part, including a metal part 1012 and a plastic part 1014. A bonding wire 1016 is formed at the junction of the metal part 1012 and the plastic part 1014. The material of the metal piece 1012 may be aluminum alloy, stainless steel, titanium alloy, magnesium alloy, zinc alloy, or other metal materials. The material of the plastic part 1014 may be polybutylene terephthalate, composite material of polybutylene terephthalate and glass fiber, polyamide, composite material of polyamide and glass fiber, poly Phenylene sulfide, polyphenylene sulfide and glass fiber composite materials, polyether ether ketone or other plastics.

Cleaning substrate 101. In one embodiment, after degreasing the substrate 101 with a degreasing agent, the substrate 101 is washed with pure water to clean the surface of the substrate 101 from dust and oil stains.

A plating layer 102 is formed on the second surface 1013 of the substrate 101. The coating layer 102 provides good adhesion to the substrate 101, and is used to overcome the problem of poor surface adhesion caused by the substrate 101 as a composite part. In this embodiment, the plating layer 102 is an NCVM (Non Conductive Vacuum Metallization, vacuum non-conductive plating) film.

Specifically, a plating film layer 102 is formed on the second surface 1013 of the substrate 101 by vacuum evaporation or vacuum sputtering. The thickness of the plating layer 102 is 10-100 nm. Wherein, the plating layer 102 is an aluminum layer, an indium layer, a tin layer, and a mixed plating layer of two or three of aluminum, indium, and tin.

Further, the coating layer 102 is a discontinuous film, so that the communication signal in the electronic device is not affected.

An electrophoretic layer 103 is formed on the surface of the plating layer 102. The thickness of the electrophoretic layer 103 is 10-30um. Wherein, the electrophoretic layer 103 is used to fill the height difference between the metal part 1012 and the plastic part 1014 in the base material, fill the gap of the bonding wire 1016 and shield the bonding wire 1016 to solve the problem The difference in surface glossiness, morphology and color caused by different materials in the base material 101 makes the casing 10 have an integrated appearance effect. Wherein, the plating layer 102 is also used to improve the binding force of the base material 101 and the electrophoretic layer 103.

Specifically, the substrate 101 on which the plating layer 102 is formed is placed in an electrophoresis tank (not shown) with an electrophoresis tank solution, and electrophoresis treatment is performed at a voltage of 30-150V for 20-80 seconds, thereby An electrophoretic layer 103 is formed on the surface of the plating layer 102. In the electrophoretic process, the temperature of the electrodeposition bath is 25-30 ^o C, a conductivity of 400-700us / cm, PH value of 4.0-4.5. In this embodiment, the electrophoresis bath includes 8-12% solid paint and 88-92% distilled water. Wherein, the solid paint includes color filler and resin. The content of the color filler is 50-66g/1L electrophoresis bath.

The ceramic coating 104 is formed on the surface of the electrophoretic layer 103. The ceramic coating 104 is used to enhance the hardness and thermal conductivity of the housing 10 and further shield the bonding wire 1016. Wherein, the thickness of the ceramic coating 104 is 10-70um.

Specifically, a ceramic paint is sprayed on the surface of the electrophoretic layer 103 to form the ceramic coating 104. The ceramic paint includes 30-60% ceramic paint main agent, 6-30% curing agent and 18-60% thinner. The ceramic paint main agent includes a nano ceramic filler and a solvent. The particle diameter of the nano ceramic filler is 0.01-5um. Wherein, the nano-ceramic filler in the ceramic paint can enhance the hardness of the ceramic coating 104 and improve the shielding property of the ceramic coating 104.

It can be understood that, in order to improve the appearance and decoration effect of the housing 10, a color layer 105 may be formed on the surface of the ceramic coating 104. The thickness of the color layer 105 is 10-20um. The specific color of the color layer 105 can be customized according to the needs of users, and can be black, white, blue, etc.

Further, in order to improve the anti-fouling ability of the casing 10, a protective layer 106 may be further formed on the surface of the color layer 105.

Specifically, a top coat is sprayed on the surface of the color layer 105, irradiated with 600-1200J ultraviolet light, and cured to form the protective layer 106. The top coat includes 40-60% acrylic resin and 40-60% thinner. The thickness of the protective layer 106 is 10-30um.

It can be understood that the protective layer 106 may also be a transparent layer, so that the color of the color layer 105 can be seen through the protective layer 106, thereby enhancing the appearance and decorative effect of the housing 10.

Of course, in order to further improve the appearance and decoration effect of the housing 10, the protective layer 106 may also be atomized and/or brightened.

Furthermore, the pattern layer 107 may be formed between the color layer 105 and the protective layer 106. The pattern layer 107 may be various graphics, letters, numbers, or trademarks.

Perform a boil test on the housing 10:

After the housing 10 is placed in boiling water for a boiling test, it is determined that the surface of the housing 10 is free of defects such as bubbles. From this, it can be seen that the electrophoretic layer 103 has a good bonding performance with the substrate 101 through the plating layer 102.

In summary, the coating layer 102, the electrophoretic layer 103, and the ceramic coating layer 104 are formed on the second surface 1013 of the substrate 101 in sequence, and then the housing 10 is formed. Among them, the structural arrangement of the housing 10 optimizes the manufacturing process of the housing 10 and reduces the cost. In addition, the electrophoretic layer 103 improves the bonding performance with the base material 101 by the coating layer 102, and effectively shields the bonding line 1016 of the base material 101. The difference in surface glossiness, shape and color caused by different materials, so that the casing 10 has an integrated appearance effect.

In summary, the present invention meets the requirements of the invention patent, and the patent application is filed in accordance with the law. However, the above are only preferred embodiments of the present invention. For those who are familiar with the skills of this case, equivalent modifications or changes made in accordance with the spirit of the present invention should be covered by the following patent applications.

10: Shell 101: substrate 1011: first surface 1012: Metal parts 1013: Second surface 1014: Plastic parts 1016: Bonding line 102: coating 103: Electrophoretic layer 104: ceramic coating 105: color layer 106: protective layer 107: pattern layer

FIG. 1 is a schematic cross-sectional view of a housing according to a preferred embodiment of the present invention.

no

10: Shell

101: substrate

1011: first surface

1012: Metal parts

1013: Second surface

1014: Plastic parts

1016: Bonding line

102: coating

103: Electrophoretic layer

104: ceramic coating

105: color layer

106: protective layer

107: pattern layer

Claims (10)

A casing includes at least a base material and a ceramic coating. The improvement is that the base material is a composite part, including a metal part and a plastic part, and a joint line is formed at the junction of the metal part and the plastic part. The casing further includes a plating layer and an electrophoretic layer, the plating layer is formed on the surface of the substrate, the electrophoretic layer is formed on the surface of the plating layer, the plating layer is used to improve the electrophoretic layer and The bonding force of the substrate, the electrophoretic layer is used to shield the bonding wire, and the ceramic coating is formed on the surface of the electrophoretic layer. The casing as described in item 1 of the patent application range, wherein the coating layer is a vacuum non-conductive plating film, and the thickness of the coating layer is 10-100 nm. The casing as described in item 2 of the patent application scope, wherein the coating layer is an aluminum layer, an indium layer, a tin layer, and a mixed plating layer of two or three of aluminum, indium, and tin. The casing as described in item 1 of the patent application scope, wherein the casing further includes a color layer formed on the surface of the ceramic coating, and the thickness of the color layer is 10-20um. The casing as described in item 4 of the patent application scope, wherein the casing further includes a protective layer, the protective layer is formed on the surface of the color layer, and the thickness of the protective layer is 10-30um. A method for manufacturing a casing, the improvement of which includes the following steps: providing a substrate, the substrate is a composite part, including a metal part and a plastic part, a joint of the metal part and the plastic part is formed Bonding wire; forming a coating layer on the surface of the substrate, the coating layer is used to improve the adhesion of the substrate; performing electrophoretic treatment on the substrate with the coating layer formed on the surface of the coating layer Forming an electrophoretic layer; forming a ceramic coating on the surface of the electrophoretic layer. The method for manufacturing a casing as described in item 6 of the patent application range, wherein the coating layer is a vacuum non-conductive plating film, and the thickness of the coating layer is 10-100 nm. The method for manufacturing a casing as described in item 7 of the patent application range, wherein the coating layer is an aluminum layer, an indium layer, a tin layer, and a mixed plating layer of two or three of aluminum, indium, and tin. The method for preparing a casing as described in item 6 of the patent application scope, wherein the electrophoresis treatment refers to placing the substrate on which the coating layer is formed in an electrophoresis bath, and carrying out at a voltage of 30-150V for 20 electrophoresed -80 seconds, thereby forming a plated layer on the surface of the electrophoretic layer, wherein the temperature of the electrodeposition bath is 25-30 ^o C, a conductivity of 400-700us / cm, PH value of 4.0-4.5. The method for preparing a casing as described in item 6 of the patent application range, wherein the ceramic coating is formed by spraying a ceramic paint on the surface of the electrophoretic layer, the ceramic paint including 30-60% of the main ceramic paint Agent, 6-30% curing agent and 18-60% diluent, the ceramic paint main agent includes nano-ceramic filler and solvent, and the particle size of the nano-ceramic filler is 0.01-5um.

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