CN112135929B - 包含抑制剂的用于锡或锡合金电镀的组合物 - Google Patents

包含抑制剂的用于锡或锡合金电镀的组合物 Download PDF

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Publication number
CN112135929B
CN112135929B CN201980033676.1A CN201980033676A CN112135929B CN 112135929 B CN112135929 B CN 112135929B CN 201980033676 A CN201980033676 A CN 201980033676A CN 112135929 B CN112135929 B CN 112135929B
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China
Prior art keywords
tin
aqueous composition
composition according
ethylene oxide
substrate
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Chinese (zh)
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CN112135929A (zh
Inventor
A·弗鲁格尔
M·阿诺德
N·恩格尔哈特
M·P·基恩勒
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BASF SE
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BASF SE
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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/30—Electroplating: Baths therefor from solutions of tin
    • C25D3/32—Electroplating: Baths therefor from solutions of tin characterised by the organic bath constituents used
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/30—Electroplating: Baths therefor from solutions of tin
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
    • H10W72/01231—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps using blanket deposition
    • H10W72/01233—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps using blanket deposition in liquid form, e.g. spin coating, spray coating or immersion coating
    • H10W72/01235—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps using blanket deposition in liquid form, e.g. spin coating, spray coating or immersion coating by plating, e.g. electroless plating or electroplating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/231—Shapes
    • H10W72/232—Plan-view shape, i.e. in top view

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrodes Of Semiconductors (AREA)
CN201980033676.1A 2018-04-20 2019-04-11 包含抑制剂的用于锡或锡合金电镀的组合物 Active CN112135929B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP18168462 2018-04-20
EP18168462.2 2018-04-20
PCT/EP2019/059344 WO2019201753A1 (en) 2018-04-20 2019-04-11 Composition for tin or tin alloy electroplating comprising suppressing agent

Publications (2)

Publication Number Publication Date
CN112135929A CN112135929A (zh) 2020-12-25
CN112135929B true CN112135929B (zh) 2023-12-15

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201980033676.1A Active CN112135929B (zh) 2018-04-20 2019-04-11 包含抑制剂的用于锡或锡合金电镀的组合物

Country Status (9)

Country Link
US (2) US11242606B2 (https=)
EP (1) EP3781729B1 (https=)
JP (1) JP2021522410A (https=)
KR (1) KR102769982B1 (https=)
CN (1) CN112135929B (https=)
IL (1) IL278024A (https=)
SG (1) SG11202009106XA (https=)
TW (1) TWI813670B (https=)
WO (1) WO2019201753A1 (https=)

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Publication number Priority date Publication date Assignee Title
EP4437167A1 (en) 2021-11-22 2024-10-02 Basf Se Composition for tin or tin alloy electroplating comprising a pyrazole-type antioxidant
KR102568529B1 (ko) * 2022-11-25 2023-08-22 주식회사 호진플라텍 보이드 생성이 억제되고 두께편차가 개선된 웨이퍼 범프용 주석 전기 도금액
KR20250124510A (ko) * 2024-02-13 2025-08-20 한국생산기술연구원 솔더 범프용 주석 도금액

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CN1456710A (zh) * 2002-03-05 2003-11-19 希普雷公司 控制锡或锡合金电镀液中氧化作用造成的锡损失的方法
CN101515549A (zh) * 2003-12-31 2009-08-26 微制造公司 在结构的电化学制造期间保持层的平行度和/或实现所期望层厚度的方法和装置
TW201042097A (en) * 2009-04-07 2010-12-01 Basf Se Composition for metal plating comprising suppressing agent for void free submicron feature filling
CN102304218A (zh) * 2010-03-15 2012-01-04 罗门哈斯电子材料有限公司 镀液及镀覆方法
CN102365396A (zh) * 2009-04-07 2012-02-29 巴斯夫欧洲公司 包含抑制剂的无空隙亚微米结构填充用金属电镀组合物
CN103361685A (zh) * 2012-02-09 2013-10-23 罗门哈斯电子材料有限公司 镀液和电镀方法
CN103898570A (zh) * 2012-12-27 2014-07-02 罗门哈斯电子材料有限公司 锡或锡合金电镀液
CN104674311A (zh) * 2013-11-05 2015-06-03 罗门哈斯电子材料有限公司 镀液和镀覆方法
CN104797633A (zh) * 2012-11-09 2015-07-22 巴斯夫欧洲公司 用于金属电镀的包含调平剂的组合物
CN104928730A (zh) * 2014-03-18 2015-09-23 上村工业株式会社 锡或锡合金的电镀浴以及凸点的制备方法
CN106609384A (zh) * 2015-10-27 2017-05-03 罗门哈斯电子材料有限责任公司 从酸性铜电镀浴液向衬底上的通孔中电镀铜的方法

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JP2019503420A (ja) 2016-01-12 2019-02-07 ビーエーエスエフ ソシエタス・ヨーロピアＢａｓｆ Ｓｅ モノアルデヒドを使用しない又はモノアルデヒドをほぼ使用しない高分子イミダゾリウム化合物の製造方法
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Publication number Priority date Publication date Assignee Title
CN1456710A (zh) * 2002-03-05 2003-11-19 希普雷公司 控制锡或锡合金电镀液中氧化作用造成的锡损失的方法
CN101515549A (zh) * 2003-12-31 2009-08-26 微制造公司 在结构的电化学制造期间保持层的平行度和/或实现所期望层厚度的方法和装置
TW201042097A (en) * 2009-04-07 2010-12-01 Basf Se Composition for metal plating comprising suppressing agent for void free submicron feature filling
CN102365396A (zh) * 2009-04-07 2012-02-29 巴斯夫欧洲公司 包含抑制剂的无空隙亚微米结构填充用金属电镀组合物
CN102304218A (zh) * 2010-03-15 2012-01-04 罗门哈斯电子材料有限公司 镀液及镀覆方法
CN103361685A (zh) * 2012-02-09 2013-10-23 罗门哈斯电子材料有限公司 镀液和电镀方法
CN104797633A (zh) * 2012-11-09 2015-07-22 巴斯夫欧洲公司 用于金属电镀的包含调平剂的组合物
CN103898570A (zh) * 2012-12-27 2014-07-02 罗门哈斯电子材料有限公司 锡或锡合金电镀液
CN104674311A (zh) * 2013-11-05 2015-06-03 罗门哈斯电子材料有限公司 镀液和镀覆方法
CN104928730A (zh) * 2014-03-18 2015-09-23 上村工业株式会社 锡或锡合金的电镀浴以及凸点的制备方法
CN106609384A (zh) * 2015-10-27 2017-05-03 罗门哈斯电子材料有限责任公司 从酸性铜电镀浴液向衬底上的通孔中电镀铜的方法

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Publication number Publication date
IL278024A (en) 2020-11-30
KR20210002514A (ko) 2021-01-08
US20210180201A1 (en) 2021-06-17
CN112135929A (zh) 2020-12-25
US20220119972A1 (en) 2022-04-21
EP3781729B1 (en) 2024-09-25
US11242606B2 (en) 2022-02-08
KR102769982B1 (ko) 2025-02-18
JP2021522410A (ja) 2021-08-30
EP3781729A1 (en) 2021-02-24
WO2019201753A1 (en) 2019-10-24
US11840771B2 (en) 2023-12-12
TWI813670B (zh) 2023-09-01
SG11202009106XA (en) 2020-11-27
TW201943895A (zh) 2019-11-16

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