JP2021522410A - 抑制剤を含むスズ又はスズ合金電気メッキのための組成物 - Google Patents

抑制剤を含むスズ又はスズ合金電気メッキのための組成物 Download PDF

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Publication number
JP2021522410A
JP2021522410A JP2020558445A JP2020558445A JP2021522410A JP 2021522410 A JP2021522410 A JP 2021522410A JP 2020558445 A JP2020558445 A JP 2020558445A JP 2020558445 A JP2020558445 A JP 2020558445A JP 2021522410 A JP2021522410 A JP 2021522410A
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Japan
Prior art keywords
tin
branched
aqueous composition
alkyl
linear
Prior art date
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JP2020558445A
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Japanese (ja)
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JP2021522410A5 (https=
Inventor
フリューゲル，アレクサンダー
アルノルト，マルコ
エンゲルハルト，ナディネ
パトリク キーンレ，マルセル
パトリク キーンレ，マルセル
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BASF SE
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BASF SE
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Publication date
Application filed by BASF SE filed Critical BASF SE
Publication of JP2021522410A publication Critical patent/JP2021522410A/ja
Publication of JP2021522410A5 publication Critical patent/JP2021522410A5/ja
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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/30—Electroplating: Baths therefor from solutions of tin
    • C25D3/32—Electroplating: Baths therefor from solutions of tin characterised by the organic bath constituents used
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/30—Electroplating: Baths therefor from solutions of tin
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
    • H10W72/01231—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps using blanket deposition
    • H10W72/01233—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps using blanket deposition in liquid form, e.g. spin coating, spray coating or immersion coating
    • H10W72/01235—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps using blanket deposition in liquid form, e.g. spin coating, spray coating or immersion coating by plating, e.g. electroless plating or electroplating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/231—Shapes
    • H10W72/232—Plan-view shape, i.e. in top view

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Manufacturing & Machinery (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Electroplating Methods And Accessories (AREA)
JP2020558445A 2018-04-20 2019-04-11 抑制剤を含むスズ又はスズ合金電気メッキのための組成物 Withdrawn JP2021522410A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP18168462 2018-04-20
EP18168462.2 2018-04-20
PCT/EP2019/059344 WO2019201753A1 (en) 2018-04-20 2019-04-11 Composition for tin or tin alloy electroplating comprising suppressing agent

Publications (2)

Publication Number Publication Date
JP2021522410A true JP2021522410A (ja) 2021-08-30
JP2021522410A5 JP2021522410A5 (https=) 2022-04-18

Family

ID=62044554

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2020558445A Withdrawn JP2021522410A (ja) 2018-04-20 2019-04-11 抑制剤を含むスズ又はスズ合金電気メッキのための組成物

Country Status (9)

Country Link
US (2) US11242606B2 (https=)
EP (1) EP3781729B1 (https=)
JP (1) JP2021522410A (https=)
KR (1) KR102769982B1 (https=)
CN (1) CN112135929B (https=)
IL (1) IL278024A (https=)
SG (1) SG11202009106XA (https=)
TW (1) TWI813670B (https=)
WO (1) WO2019201753A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20240113774A (ko) 2021-11-22 2024-07-23 바스프 에스이 피라졸 타입 산화방지제를 포함하는 주석 또는 주석 합금 전기도금을 위한 조성물
KR102568529B1 (ko) * 2022-11-25 2023-08-22 주식회사 호진플라텍 보이드 생성이 억제되고 두께편차가 개선된 웨이퍼 범프용 주석 전기 도금액
KR20250124510A (ko) * 2024-02-13 2025-08-20 한국생산기술연구원 솔더 범프용 주석 도금액

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US4135991A (en) 1977-08-12 1979-01-23 R. O. Hull & Company, Inc. Bath and method for electroplating tin and/or lead
GB1567235A (en) 1978-05-15 1980-05-14 Pmd Chemicals Ltd Electrodeposition of tin or tin/lead alloys
US4871429A (en) 1981-09-11 1989-10-03 Learonal, Inc Limiting tin sludge formation in tin or tin/lead electroplating solutions
US5174887A (en) 1987-12-10 1992-12-29 Learonal, Inc. High speed electroplating of tinplate
JP3301707B2 (ja) 1997-01-20 2002-07-15 ディップソール株式会社 錫−銀合金酸性電気めっき浴
JP4296358B2 (ja) 1998-01-21 2009-07-15 石原薬品株式会社 銀及び銀合金メッキ浴
US7628903B1 (en) 2000-05-02 2009-12-08 Ishihara Chemical Co., Ltd. Silver and silver alloy plating bath
US6818545B2 (en) 2001-03-05 2004-11-16 Megic Corporation Low fabrication cost, fine pitch and high reliability solder bump
TWI245402B (en) 2002-01-07 2005-12-11 Megic Corp Rod soldering structure and manufacturing process thereof
TWI268292B (en) * 2002-03-05 2006-12-11 Shipley Co Llc Limiting the loss of tin through oxidation in tin or tin alloy electroplating bath solutions
TWI353395B (en) * 2003-12-31 2011-12-01 Microfabrica Inc Method and apparatus for maintaining parallelism o
TWI240979B (en) 2004-10-28 2005-10-01 Advanced Semiconductor Eng Bumping process
KR100921919B1 (ko) 2007-11-16 2009-10-16 (주)화백엔지니어링 반도체 칩에 형성되는 구리기둥-주석범프 및 그의 형성방법
JP5583894B2 (ja) 2008-06-12 2014-09-03 ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． 電気錫めっき液および電気錫めっき方法
EP2199315B1 (en) 2008-12-19 2013-12-11 Basf Se Composition for metal electroplating comprising leveling agent
WO2010115756A1 (en) 2009-04-07 2010-10-14 Basf Se Composition for metal plating comprising suppressing agent for void free submicron feature filling
WO2010115757A1 (en) * 2009-04-07 2010-10-14 Basf Se Composition for metal plating comprising suppressing agent for void free submicron feature filling
CN102365396B (zh) * 2009-04-07 2014-12-31 巴斯夫欧洲公司 包含抑制剂的无空隙亚微米结构填充用金属电镀组合物
RU2585184C2 (ru) * 2009-11-27 2016-05-27 Басф Се Композиция для электрического осаждения металла, содержащая выравнивающий агент
US8262895B2 (en) * 2010-03-15 2012-09-11 Rohm And Haas Electronic Materials Llc Plating bath and method
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US8888984B2 (en) * 2012-02-09 2014-11-18 Rohm And Haas Electronic Materials Llc Plating bath and method
US8980077B2 (en) 2012-03-30 2015-03-17 Rohm And Haas Electronic Materials Llc Plating bath and method
MY172822A (en) * 2012-11-09 2019-12-12 Basf Se Composition for metal electroplating comprising leveling agent
JP6133056B2 (ja) * 2012-12-27 2017-05-24 ローム・アンド・ハース電子材料株式会社 スズまたはスズ合金めっき液
US20150122662A1 (en) * 2013-11-05 2015-05-07 Rohm And Haas Electronic Materials Llc Plating bath and method
US20150122661A1 (en) * 2013-11-05 2015-05-07 Rohm And Haas Electronic Materials Llc Plating bath and method
JP2015193916A (ja) * 2014-03-18 2015-11-05 上村工業株式会社 錫または錫合金の電気めっき浴、およびバンプの製造方法
EP3177671A1 (en) 2014-08-06 2017-06-14 Basf Se Improved process for preparing polymeric, ionic imidazolium compounds
JP2018517793A (ja) * 2015-04-28 2018-07-05 ローム アンド ハース エレクトロニック マテリアルズ エルエルシーＲｏｈｍ ａｎｄ Ｈａａｓ Ｅｌｅｃｔｒｏｎｉｃ Ｍａｔｅｒｉａｌｓ ＬＬＣ 電気めっき浴用の添加剤としてのビス無水物及びジアミンの反応生成物
US10988852B2 (en) * 2015-10-27 2021-04-27 Rohm And Haas Electronic Materials Llc Method of electroplating copper into a via on a substrate from an acid copper electroplating bath
US20190016858A1 (en) 2016-01-12 2019-01-17 Basf Se Process for preparing polymeric imidazolium compounds without or with less monoaldehyde
CN110100048B (zh) * 2016-12-20 2022-06-21 巴斯夫欧洲公司 包含用于无空隙填充的抑制试剂的用于金属电镀的组合物
EP3631051B1 (en) 2017-06-01 2021-10-13 Basf Se Composition for tin alloy electroplating comprising leveling agent

Also Published As

Publication number Publication date
CN112135929B (zh) 2023-12-15
KR102769982B1 (ko) 2025-02-18
TW201943895A (zh) 2019-11-16
US11242606B2 (en) 2022-02-08
US11840771B2 (en) 2023-12-12
EP3781729B1 (en) 2024-09-25
KR20210002514A (ko) 2021-01-08
TWI813670B (zh) 2023-09-01
EP3781729A1 (en) 2021-02-24
SG11202009106XA (en) 2020-11-27
WO2019201753A1 (en) 2019-10-24
CN112135929A (zh) 2020-12-25
US20220119972A1 (en) 2022-04-21
IL278024A (en) 2020-11-30
US20210180201A1 (en) 2021-06-17

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