TWI813670B - 用於錫或錫合金電鍍之包含抑制劑的組成物 - Google Patents

用於錫或錫合金電鍍之包含抑制劑的組成物 Download PDF

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Publication number
TWI813670B
TWI813670B TW108113573A TW108113573A TWI813670B TW I813670 B TWI813670 B TW I813670B TW 108113573 A TW108113573 A TW 108113573A TW 108113573 A TW108113573 A TW 108113573A TW I813670 B TWI813670 B TW I813670B
Authority
TW
Taiwan
Prior art keywords
tin
aqueous composition
substrate
weight
alkyl
Prior art date
Application number
TW108113573A
Other languages
English (en)
Chinese (zh)
Other versions
TW201943895A (zh
Inventor
亞歷山大 福路格
馬可 亞諾
納迪尼 安傑哈德特
馬塞 派翠克 琴勒
Original Assignee
德商巴斯夫歐洲公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 德商巴斯夫歐洲公司 filed Critical 德商巴斯夫歐洲公司
Publication of TW201943895A publication Critical patent/TW201943895A/zh
Application granted granted Critical
Publication of TWI813670B publication Critical patent/TWI813670B/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/30—Electroplating: Baths therefor from solutions of tin
    • C25D3/32—Electroplating: Baths therefor from solutions of tin characterised by the organic bath constituents used
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/30—Electroplating: Baths therefor from solutions of tin
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
    • H10W72/01231—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps using blanket deposition
    • H10W72/01233—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps using blanket deposition in liquid form, e.g. spin coating, spray coating or immersion coating
    • H10W72/01235—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps using blanket deposition in liquid form, e.g. spin coating, spray coating or immersion coating by plating, e.g. electroless plating or electroplating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/231—Shapes
    • H10W72/232—Plan-view shape, i.e. in top view

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrodes Of Semiconductors (AREA)
TW108113573A 2018-04-20 2019-04-18 用於錫或錫合金電鍍之包含抑制劑的組成物 TWI813670B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP18168462 2018-04-20
EP18168462.2 2018-04-20

Publications (2)

Publication Number Publication Date
TW201943895A TW201943895A (zh) 2019-11-16
TWI813670B true TWI813670B (zh) 2023-09-01

Family

ID=62044554

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108113573A TWI813670B (zh) 2018-04-20 2019-04-18 用於錫或錫合金電鍍之包含抑制劑的組成物

Country Status (9)

Country Link
US (2) US11242606B2 (https=)
EP (1) EP3781729B1 (https=)
JP (1) JP2021522410A (https=)
KR (1) KR102769982B1 (https=)
CN (1) CN112135929B (https=)
IL (1) IL278024A (https=)
SG (1) SG11202009106XA (https=)
TW (1) TWI813670B (https=)
WO (1) WO2019201753A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
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EP4437167A1 (en) 2021-11-22 2024-10-02 Basf Se Composition for tin or tin alloy electroplating comprising a pyrazole-type antioxidant
KR102568529B1 (ko) * 2022-11-25 2023-08-22 주식회사 호진플라텍 보이드 생성이 억제되고 두께편차가 개선된 웨이퍼 범프용 주석 전기 도금액
KR20250124510A (ko) * 2024-02-13 2025-08-20 한국생산기술연구원 솔더 범프용 주석 도금액

Citations (1)

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Also Published As

Publication number Publication date
IL278024A (en) 2020-11-30
KR20210002514A (ko) 2021-01-08
US20210180201A1 (en) 2021-06-17
CN112135929A (zh) 2020-12-25
CN112135929B (zh) 2023-12-15
US20220119972A1 (en) 2022-04-21
EP3781729B1 (en) 2024-09-25
US11242606B2 (en) 2022-02-08
KR102769982B1 (ko) 2025-02-18
JP2021522410A (ja) 2021-08-30
EP3781729A1 (en) 2021-02-24
WO2019201753A1 (en) 2019-10-24
US11840771B2 (en) 2023-12-12
SG11202009106XA (en) 2020-11-27
TW201943895A (zh) 2019-11-16

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