JP2021160117A5 - - Google Patents
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- Publication number
- JP2021160117A5 JP2021160117A5 JP2020061864A JP2020061864A JP2021160117A5 JP 2021160117 A5 JP2021160117 A5 JP 2021160117A5 JP 2020061864 A JP2020061864 A JP 2020061864A JP 2020061864 A JP2020061864 A JP 2020061864A JP 2021160117 A5 JP2021160117 A5 JP 2021160117A5
- Authority
- JP
- Japan
- Prior art keywords
- laminate
- metal
- plating solution
- laminate according
- metal salt
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002184 metal Substances 0.000 claims 33
- 229910052751 metal Inorganic materials 0.000 claims 33
- 238000007747 plating Methods 0.000 claims 15
- 150000003839 salts Chemical class 0.000 claims 12
- 239000010949 copper Substances 0.000 claims 8
- 229910052802 copper Inorganic materials 0.000 claims 3
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 claims 2
- 229910052787 antimony Inorganic materials 0.000 claims 2
- 229910052797 bismuth Inorganic materials 0.000 claims 2
- 229910052804 chromium Inorganic materials 0.000 claims 2
- 150000001875 compounds Chemical class 0.000 claims 2
- 239000013078 crystal Substances 0.000 claims 2
- 229910052738 indium Inorganic materials 0.000 claims 2
- 238000004519 manufacturing process Methods 0.000 claims 2
- 239000000463 material Substances 0.000 claims 2
- 238000000034 method Methods 0.000 claims 2
- 229910052759 nickel Inorganic materials 0.000 claims 2
- 229910052698 phosphorus Inorganic materials 0.000 claims 2
- 229910052717 sulfur Inorganic materials 0.000 claims 2
- 239000011593 sulfur Substances 0.000 claims 2
- 229910052718 tin Inorganic materials 0.000 claims 2
- 229910052721 tungsten Inorganic materials 0.000 claims 2
- 229910052725 zinc Inorganic materials 0.000 claims 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- ABLZXFCXXLZCGV-UHFFFAOYSA-N Phosphorous acid Chemical compound OP(O)=O ABLZXFCXXLZCGV-UHFFFAOYSA-N 0.000 claims 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims 1
- 239000000654 additive Substances 0.000 claims 1
- 230000000996 additive effect Effects 0.000 claims 1
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 239000008139 complexing agent Substances 0.000 claims 1
- JZCCFEFSEZPSOG-UHFFFAOYSA-L copper(II) sulfate pentahydrate Chemical compound O.O.O.O.O.[Cu+2].[O-]S([O-])(=O)=O JZCCFEFSEZPSOG-UHFFFAOYSA-L 0.000 claims 1
- 230000008021 deposition Effects 0.000 claims 1
- 239000003002 pH adjusting agent Substances 0.000 claims 1
- 239000011574 phosphorus Substances 0.000 claims 1
- CVHZOJJKTDOEJC-UHFFFAOYSA-N saccharin Chemical compound C1=CC=C2C(=O)NS(=O)(=O)C2=C1 CVHZOJJKTDOEJC-UHFFFAOYSA-N 0.000 claims 1
- 229940081974 saccharin Drugs 0.000 claims 1
- 235000019204 saccharin Nutrition 0.000 claims 1
- 239000000901 saccharin and its Na,K and Ca salt Substances 0.000 claims 1
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020061864A JP7520550B2 (ja) | 2020-03-31 | 2020-03-31 | 積層体、金属めっき液、および積層体の製造方法 |
| EP20929210.1A EP4130346A4 (en) | 2020-03-31 | 2020-10-07 | Laminate, metal plating liquid, and laminate manufacturing method |
| US17/915,409 US12371792B2 (en) | 2020-03-31 | 2020-10-07 | Laminate, metal plating solution, and manufacturing process of laminate |
| PCT/JP2020/038064 WO2021199468A1 (ja) | 2020-03-31 | 2020-10-07 | 積層体、金属めっき液、および積層体の製造方法 |
| CN202080099280.XA CN115362060B (zh) | 2020-03-31 | 2020-10-07 | 叠层体、金属镀敷液和叠层体的制造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020061864A JP7520550B2 (ja) | 2020-03-31 | 2020-03-31 | 積層体、金属めっき液、および積層体の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2021160117A JP2021160117A (ja) | 2021-10-11 |
| JP2021160117A5 true JP2021160117A5 (https=) | 2022-10-07 |
| JP7520550B2 JP7520550B2 (ja) | 2024-07-23 |
Family
ID=77927150
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020061864A Active JP7520550B2 (ja) | 2020-03-31 | 2020-03-31 | 積層体、金属めっき液、および積層体の製造方法 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US12371792B2 (https=) |
| EP (1) | EP4130346A4 (https=) |
| JP (1) | JP7520550B2 (https=) |
| CN (1) | CN115362060B (https=) |
| WO (1) | WO2021199468A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024202237A1 (ja) * | 2023-03-30 | 2024-10-03 | Ｊｘ金属株式会社 | 金属材料及び摺動部品 |
Family Cites Families (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3288574A (en) | 1964-04-10 | 1966-11-29 | Harshaw Chem Corp | Metal laminates and method of forming by electroplating |
| US3480522A (en) * | 1966-08-18 | 1969-11-25 | Ibm | Method of making magnetic thin film device |
| JPS5377840A (en) * | 1976-12-21 | 1978-07-10 | Mishima Kosan Co Ltd | Preparation of mold for slab |
| JPS63105990A (ja) | 1986-10-23 | 1988-05-11 | Kawasaki Steel Corp | 多層ニツケル合金めつきおよびその形成方法 |
| US5171417A (en) * | 1989-09-13 | 1992-12-15 | Gould Inc. | Copper foils for printed circuit board applications and procedures and electrolyte bath solutions for electrodepositing the same |
| JP3833892B2 (ja) | 2000-12-20 | 2006-10-18 | 本田技研工業株式会社 | Ｎｉ−Ｃｕ合金メッキ被膜 |
| JP3830758B2 (ja) | 2000-12-20 | 2006-10-11 | 本田技研工業株式会社 | Ｎｉ−Ｃｕ合金複合メッキ液 |
| US7022419B2 (en) * | 2000-12-20 | 2006-04-04 | Honda Giken Kogyo Kabushiki Kaisha | Composite plating film and a process for forming the same |
| KR100735481B1 (ko) * | 2005-12-09 | 2007-07-03 | 동부일렉트로닉스 주식회사 | 구리 배선 구조 및 그 형성 방법 |
| EP2310557A2 (en) * | 2008-07-07 | 2011-04-20 | Modumetal, LLC | Property modulated materials and methods of making the same |
| WO2010144509A2 (en) * | 2009-06-08 | 2010-12-16 | Modumetal Llc | Electrodeposited, nanolaminate coatings and claddings for corrosion protection |
| CN103180136B (zh) * | 2010-09-02 | 2014-07-16 | 新日铁住金株式会社 | 导电性、耐腐蚀性优异的涂装金属板 |
| JP5086485B1 (ja) * | 2011-09-20 | 2012-11-28 | Ｊｘ日鉱日石金属株式会社 | 電子部品用金属材料及びその製造方法 |
| JP2014082350A (ja) | 2012-10-17 | 2014-05-08 | Takamatsu Mekki:Kk | Ｌｅｄ用ウエハおよびその製造方法 |
| MY168618A (en) | 2014-06-23 | 2018-11-14 | Okuno Chem Ind Co | Multilayer plating film and article having multilayer plating film |
| TWI593548B (zh) * | 2015-01-09 | 2017-08-01 | Ｊｘ日鑛日石金屬股份有限公司 | Attached to the metal substrate |
| US10836138B2 (en) * | 2015-05-07 | 2020-11-17 | Hitachi, Ltd. | Laminated body having corrosion-resistant coating, and method for manufacturing same |
| CN104985392B (zh) * | 2015-05-11 | 2017-03-29 | 成都翱岳钣金制造有限公司 | 金属板材覆膜成型的工艺方法 |
| EP3332899B1 (en) * | 2015-08-03 | 2021-11-24 | Tungaloy Corporation | Coated cutting tool |
| KR101693514B1 (ko) | 2015-12-24 | 2017-01-06 | 주식회사 포스코 | 전기강판용 Fe-Ni-P 합금 다층 강판 및 이의 제조방법 |
| JP6781922B2 (ja) | 2016-04-30 | 2020-11-11 | 日本製鉄株式会社 | 鋳型の再生方法 |
| WO2018189901A1 (ja) * | 2017-04-14 | 2018-10-18 | Ykk株式会社 | めっき材及びその製造方法 |
| JP7121881B2 (ja) | 2017-08-08 | 2022-08-19 | 三菱マテリアル株式会社 | 銀皮膜付端子材及び銀皮膜付端子 |
| JP6813692B2 (ja) | 2017-09-27 | 2021-01-13 | 株式会社日立製作所 | 皮膜積層体及びその製造方法 |
-
2020
- 2020-03-31 JP JP2020061864A patent/JP7520550B2/ja active Active
- 2020-10-07 CN CN202080099280.XA patent/CN115362060B/zh active Active
- 2020-10-07 US US17/915,409 patent/US12371792B2/en active Active
- 2020-10-07 WO PCT/JP2020/038064 patent/WO2021199468A1/ja not_active Ceased
- 2020-10-07 EP EP20929210.1A patent/EP4130346A4/en active Pending
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