JP7520550B2 - 積層体、金属めっき液、および積層体の製造方法 - Google Patents

積層体、金属めっき液、および積層体の製造方法 Download PDF

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Publication number
JP7520550B2
JP7520550B2 JP2020061864A JP2020061864A JP7520550B2 JP 7520550 B2 JP7520550 B2 JP 7520550B2 JP 2020061864 A JP2020061864 A JP 2020061864A JP 2020061864 A JP2020061864 A JP 2020061864A JP 7520550 B2 JP7520550 B2 JP 7520550B2
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Japan
Prior art keywords
laminate
metal
metal element
interface layer
plating solution
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JP2020061864A
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English (en)
Japanese (ja)
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JP2021160117A (ja
JP2021160117A5 (https=
Inventor
拓也 青柳
大 兼元
富生 岩崎
利則 川村
斉 鈴木
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Hitachi Ltd
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Hitachi Ltd
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Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP2020061864A priority Critical patent/JP7520550B2/ja
Priority to EP20929210.1A priority patent/EP4130346A4/en
Priority to US17/915,409 priority patent/US12371792B2/en
Priority to PCT/JP2020/038064 priority patent/WO2021199468A1/ja
Priority to CN202080099280.XA priority patent/CN115362060B/zh
Publication of JP2021160117A publication Critical patent/JP2021160117A/ja
Publication of JP2021160117A5 publication Critical patent/JP2021160117A5/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
    • C23C22/05—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
    • C23C22/06—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6
    • C23C22/48—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6 not containing phosphates, hexavalent chromium compounds, fluorides or complex fluorides, molybdates, tungstates, vanadates or oxalates
    • C23C22/52—Treatment of copper or alloys based thereon
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
    • C23C22/73—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals characterised by the process
    • C23C22/77—Controlling or regulating of the coating process
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/562—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of iron or nickel or cobalt
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
    • C25D5/14—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium two or more layers being of nickel or chromium, e.g. duplex or triplex layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/615—Microstructure of the layers, e.g. mixed structure
    • C25D5/617—Crystalline layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • C25D5/50—After-treatment of electroplated surfaces by heat-treatment

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Electrochemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
JP2020061864A 2020-03-31 2020-03-31 積層体、金属めっき液、および積層体の製造方法 Active JP7520550B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2020061864A JP7520550B2 (ja) 2020-03-31 2020-03-31 積層体、金属めっき液、および積層体の製造方法
EP20929210.1A EP4130346A4 (en) 2020-03-31 2020-10-07 Laminate, metal plating liquid, and laminate manufacturing method
US17/915,409 US12371792B2 (en) 2020-03-31 2020-10-07 Laminate, metal plating solution, and manufacturing process of laminate
PCT/JP2020/038064 WO2021199468A1 (ja) 2020-03-31 2020-10-07 積層体、金属めっき液、および積層体の製造方法
CN202080099280.XA CN115362060B (zh) 2020-03-31 2020-10-07 叠层体、金属镀敷液和叠层体的制造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2020061864A JP7520550B2 (ja) 2020-03-31 2020-03-31 積層体、金属めっき液、および積層体の製造方法

Publications (3)

Publication Number Publication Date
JP2021160117A JP2021160117A (ja) 2021-10-11
JP2021160117A5 JP2021160117A5 (https=) 2022-10-07
JP7520550B2 true JP7520550B2 (ja) 2024-07-23

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JP2020061864A Active JP7520550B2 (ja) 2020-03-31 2020-03-31 積層体、金属めっき液、および積層体の製造方法

Country Status (5)

Country Link
US (1) US12371792B2 (https=)
EP (1) EP4130346A4 (https=)
JP (1) JP7520550B2 (https=)
CN (1) CN115362060B (https=)
WO (1) WO2021199468A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024202237A1 (ja) * 2023-03-30 2024-10-03 Ｊｘ金属株式会社 金属材料及び摺動部品

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002180297A (ja) 2000-12-20 2002-06-26 Honda Motor Co Ltd Ｎｉ−Ｃｕ合金複合メッキ液
JP2002180284A (ja) 2000-12-20 2002-06-26 Honda Motor Co Ltd Ｎｉ−Ｃｕ合金メッキ被膜
WO2019064672A1 (ja) 2017-09-27 2019-04-04 株式会社日立製作所 皮膜積層体及びその製造方法

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US3288574A (en) 1964-04-10 1966-11-29 Harshaw Chem Corp Metal laminates and method of forming by electroplating
US3480522A (en) * 1966-08-18 1969-11-25 Ibm Method of making magnetic thin film device
JPS5377840A (en) * 1976-12-21 1978-07-10 Mishima Kosan Co Ltd Preparation of mold for slab
JPS63105990A (ja) 1986-10-23 1988-05-11 Kawasaki Steel Corp 多層ニツケル合金めつきおよびその形成方法
US5171417A (en) * 1989-09-13 1992-12-15 Gould Inc. Copper foils for printed circuit board applications and procedures and electrolyte bath solutions for electrodepositing the same
US7022419B2 (en) * 2000-12-20 2006-04-04 Honda Giken Kogyo Kabushiki Kaisha Composite plating film and a process for forming the same
KR100735481B1 (ko) * 2005-12-09 2007-07-03 동부일렉트로닉스 주식회사 구리 배선 구조 및 그 형성 방법
EP2310557A2 (en) * 2008-07-07 2011-04-20 Modumetal, LLC Property modulated materials and methods of making the same
WO2010144509A2 (en) * 2009-06-08 2010-12-16 Modumetal Llc Electrodeposited, nanolaminate coatings and claddings for corrosion protection
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JP5086485B1 (ja) * 2011-09-20 2012-11-28 Ｊｘ日鉱日石金属株式会社 電子部品用金属材料及びその製造方法
JP2014082350A (ja) 2012-10-17 2014-05-08 Takamatsu Mekki:Kk Ｌｅｄ用ウエハおよびその製造方法
MY168618A (en) 2014-06-23 2018-11-14 Okuno Chem Ind Co Multilayer plating film and article having multilayer plating film
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JP2002180284A (ja) 2000-12-20 2002-06-26 Honda Motor Co Ltd Ｎｉ−Ｃｕ合金メッキ被膜
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Also Published As

Publication number Publication date
US20230143193A1 (en) 2023-05-11
CN115362060A (zh) 2022-11-18
US12371792B2 (en) 2025-07-29
WO2021199468A1 (ja) 2021-10-07
JP2021160117A (ja) 2021-10-11
EP4130346A1 (en) 2023-02-08
CN115362060B (zh) 2024-06-18
EP4130346A4 (en) 2023-12-20

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