JPWO2019049747A1 - 半導体製造装置の設置方法、記憶媒体及び半導体製造装置の設置システム - Google Patents

半導体製造装置の設置方法、記憶媒体及び半導体製造装置の設置システム Download PDF

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Publication number
JPWO2019049747A1
JPWO2019049747A1 JP2019540911A JP2019540911A JPWO2019049747A1 JP WO2019049747 A1 JPWO2019049747 A1 JP WO2019049747A1 JP 2019540911 A JP2019540911 A JP 2019540911A JP 2019540911 A JP2019540911 A JP 2019540911A JP WO2019049747 A1 JPWO2019049747 A1 JP WO2019049747A1
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English (en)
Japanese (ja)
Inventor
光 赤田
光 赤田
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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Publication of JPWO2019049747A1 publication Critical patent/JPWO2019049747A1/ja
Priority to JP2021117933A priority Critical patent/JP7229307B2/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H01L21/67225—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one lithography chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP2019540911A 2017-09-06 2018-08-29 半導体製造装置の設置方法、記憶媒体及び半導体製造装置の設置システム Pending JPWO2019049747A1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2021117933A JP7229307B2 (ja) 2017-09-06 2021-07-16 半導体製造装置の設置システム及び設置方法並びに記憶媒体

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2017171284 2017-09-06
JP2017171284 2017-09-06
PCT/JP2018/031940 WO2019049747A1 (ja) 2017-09-06 2018-08-29 半導体製造装置の設置方法、記憶媒体及び半導体製造装置の設置システム

Related Child Applications (1)

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JP2021117933A Division JP7229307B2 (ja) 2017-09-06 2021-07-16 半導体製造装置の設置システム及び設置方法並びに記憶媒体

Publications (1)

Publication Number Publication Date
JPWO2019049747A1 true JPWO2019049747A1 (ja) 2020-10-22

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JP2019540911A Pending JPWO2019049747A1 (ja) 2017-09-06 2018-08-29 半導体製造装置の設置方法、記憶媒体及び半導体製造装置の設置システム
JP2021117933A Active JP7229307B2 (ja) 2017-09-06 2021-07-16 半導体製造装置の設置システム及び設置方法並びに記憶媒体

Family Applications After (1)

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JP2021117933A Active JP7229307B2 (ja) 2017-09-06 2021-07-16 半導体製造装置の設置システム及び設置方法並びに記憶媒体

Country Status (5)

Country Link
JP (2) JPWO2019049747A1 (zh)
KR (1) KR102484275B1 (zh)
CN (1) CN111052305B (zh)
TW (1) TWI750408B (zh)
WO (1) WO2019049747A1 (zh)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60239813A (ja) * 1984-05-14 1985-11-28 Hitachi Zosen Corp 位置調整装置
JPH10261662A (ja) * 1997-03-19 1998-09-29 Apic Yamada Kk 半導体製造装置の着脱機構
JP2009093002A (ja) * 2007-10-10 2009-04-30 Dainippon Screen Mfg Co Ltd 基板処理装置及び基板処理装置を構成するステージの設置方法
JP2016100570A (ja) * 2014-11-26 2016-05-30 株式会社日立ハイテクノロジーズ 処理装置およびその据え付け方法
JP2017073538A (ja) * 2015-10-08 2017-04-13 東京エレクトロン株式会社 水平設置装置及び被設置物の水平設置方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11340299A (ja) * 1998-05-27 1999-12-10 Nikon Corp 基板処理装置
JP2002329654A (ja) 2001-04-27 2002-11-15 Nikon Corp 光源装置の調整方法及び光源装置、露光方法及び露光装置、並びにデバイス製造方法
US7682454B2 (en) 2003-08-07 2010-03-23 Sundew Technologies, Llc Perimeter partition-valve with protected seals and associated small size process chambers and multiple chamber systems
JP4642787B2 (ja) * 2006-05-09 2011-03-02 東京エレクトロン株式会社 基板搬送装置及び縦型熱処理装置
JP5635452B2 (ja) 2010-07-02 2014-12-03 東京エレクトロン株式会社 基板処理システム
KR101528138B1 (ko) * 2011-01-18 2015-06-12 가부시키가이샤 히다치 고쿠사이 덴키 기판 처리 장치, 기판 지지구 및 반도체 장치의 제조 방법
JP2014167996A (ja) * 2013-02-28 2014-09-11 Ebara Corp 研磨装置および研磨方法
JP2015061049A (ja) * 2013-09-20 2015-03-30 日本電産リード株式会社 処理対象物搬送システム、及び基板検査システム
JP6430870B2 (ja) * 2015-03-20 2018-11-28 東京エレクトロン株式会社 クランプ装置及びこれを用いた基板搬入出装置、並びに基板処理装置
US10014196B2 (en) * 2015-10-20 2018-07-03 Lam Research Corporation Wafer transport assembly with integrated buffers

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60239813A (ja) * 1984-05-14 1985-11-28 Hitachi Zosen Corp 位置調整装置
JPH10261662A (ja) * 1997-03-19 1998-09-29 Apic Yamada Kk 半導体製造装置の着脱機構
JP2009093002A (ja) * 2007-10-10 2009-04-30 Dainippon Screen Mfg Co Ltd 基板処理装置及び基板処理装置を構成するステージの設置方法
JP2016100570A (ja) * 2014-11-26 2016-05-30 株式会社日立ハイテクノロジーズ 処理装置およびその据え付け方法
JP2017073538A (ja) * 2015-10-08 2017-04-13 東京エレクトロン株式会社 水平設置装置及び被設置物の水平設置方法

Also Published As

Publication number Publication date
TWI750408B (zh) 2021-12-21
CN111052305A (zh) 2020-04-21
JP2021182631A (ja) 2021-11-25
WO2019049747A1 (ja) 2019-03-14
KR20200044953A (ko) 2020-04-29
KR102484275B1 (ko) 2023-01-03
TW201921435A (zh) 2019-06-01
CN111052305B (zh) 2024-02-02
JP7229307B2 (ja) 2023-02-27

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