KR102484275B1 - 반도체 제조 장치의 설치 방법, 기억 매체 및 반도체 제조 장치의 설치 시스템 - Google Patents

반도체 제조 장치의 설치 방법, 기억 매체 및 반도체 제조 장치의 설치 시스템 Download PDF

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KR102484275B1
KR102484275B1 KR1020207009634A KR20207009634A KR102484275B1 KR 102484275 B1 KR102484275 B1 KR 102484275B1 KR 1020207009634 A KR1020207009634 A KR 1020207009634A KR 20207009634 A KR20207009634 A KR 20207009634A KR 102484275 B1 KR102484275 B1 KR 102484275B1
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South Korea
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block
moving
predetermined
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target position
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KR1020207009634A
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English (en)
Korean (ko)
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KR20200044953A (ko
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히카루 아카다
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도쿄엘렉트론가부시키가이샤
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Publication of KR20200044953A publication Critical patent/KR20200044953A/ko
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H01L21/67225—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one lithography chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
KR1020207009634A 2017-09-06 2018-08-29 반도체 제조 장치의 설치 방법, 기억 매체 및 반도체 제조 장치의 설치 시스템 KR102484275B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2017171284 2017-09-06
JPJP-P-2017-171284 2017-09-06
PCT/JP2018/031940 WO2019049747A1 (ja) 2017-09-06 2018-08-29 半導体製造装置の設置方法、記憶媒体及び半導体製造装置の設置システム

Publications (2)

Publication Number Publication Date
KR20200044953A KR20200044953A (ko) 2020-04-29
KR102484275B1 true KR102484275B1 (ko) 2023-01-03

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Application Number Title Priority Date Filing Date
KR1020207009634A KR102484275B1 (ko) 2017-09-06 2018-08-29 반도체 제조 장치의 설치 방법, 기억 매체 및 반도체 제조 장치의 설치 시스템

Country Status (5)

Country Link
JP (2) JPWO2019049747A1 (zh)
KR (1) KR102484275B1 (zh)
CN (1) CN111052305B (zh)
TW (1) TWI750408B (zh)
WO (1) WO2019049747A1 (zh)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005015613A2 (en) 2003-08-07 2005-02-17 Sundew Technologies, Llc Perimeter partition-valve with protected seals

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60239813A (ja) * 1984-05-14 1985-11-28 Hitachi Zosen Corp 位置調整装置
JP3618191B2 (ja) * 1997-03-19 2005-02-09 アピックヤマダ株式会社 半導体製造装置の着脱機構
JPH11340299A (ja) * 1998-05-27 1999-12-10 Nikon Corp 基板処理装置
JP2002329654A (ja) 2001-04-27 2002-11-15 Nikon Corp 光源装置の調整方法及び光源装置、露光方法及び露光装置、並びにデバイス製造方法
JP4642787B2 (ja) * 2006-05-09 2011-03-02 東京エレクトロン株式会社 基板搬送装置及び縦型熱処理装置
JP2009093002A (ja) * 2007-10-10 2009-04-30 Dainippon Screen Mfg Co Ltd 基板処理装置及び基板処理装置を構成するステージの設置方法
JP5635452B2 (ja) 2010-07-02 2014-12-03 東京エレクトロン株式会社 基板処理システム
KR101528138B1 (ko) * 2011-01-18 2015-06-12 가부시키가이샤 히다치 고쿠사이 덴키 기판 처리 장치, 기판 지지구 및 반도체 장치의 제조 방법
JP2014167996A (ja) * 2013-02-28 2014-09-11 Ebara Corp 研磨装置および研磨方法
JP2015061049A (ja) * 2013-09-20 2015-03-30 日本電産リード株式会社 処理対象物搬送システム、及び基板検査システム
JP6412782B2 (ja) * 2014-11-26 2018-10-24 株式会社日立ハイテクノロジーズ 処理装置およびその据え付け方法
JP6430870B2 (ja) * 2015-03-20 2018-11-28 東京エレクトロン株式会社 クランプ装置及びこれを用いた基板搬入出装置、並びに基板処理装置
JP6724622B2 (ja) * 2015-10-08 2020-07-15 東京エレクトロン株式会社 水平設置装置及び被設置物の水平設置方法
US10014196B2 (en) * 2015-10-20 2018-07-03 Lam Research Corporation Wafer transport assembly with integrated buffers

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005015613A2 (en) 2003-08-07 2005-02-17 Sundew Technologies, Llc Perimeter partition-valve with protected seals

Also Published As

Publication number Publication date
TWI750408B (zh) 2021-12-21
CN111052305A (zh) 2020-04-21
JP2021182631A (ja) 2021-11-25
WO2019049747A1 (ja) 2019-03-14
KR20200044953A (ko) 2020-04-29
JPWO2019049747A1 (ja) 2020-10-22
TW201921435A (zh) 2019-06-01
CN111052305B (zh) 2024-02-02
JP7229307B2 (ja) 2023-02-27

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