KR102484275B1 - Installation method of semiconductor manufacturing equipment, storage medium, and installation system of semiconductor manufacturing equipment - Google Patents

Abstract

A method of installing a semiconductor manufacturing apparatus configured by arranging a plurality of blocks on a floor, the conveying step of conveying a second block to a predetermined area on the floor, located within a predetermined distance from a target position with respect to the first block and a moving device mounting step of mounting a plurality of moving devices having support portions for supporting the predetermined location of the second block at the predetermined location, and based on the information of the position of the second block relative to the target position in the predetermined plane, Based on an in-plane adjustment step of synchronizing and moving the support units of a plurality of moving devices to adjust the position of the second block within a predetermined plane, and information on the position of the second block relative to the target position along the height direction, a plurality of A height adjustment step of adjusting the height of the second block by moving the supports of the moving devices in synchronization with each other, and moving the support portions of the plurality of moving devices separately based on the inclination information of the second block to adjust the height of the second block. It includes a tilt adjustment process for adjusting the slope of .

Description

Installation method of semiconductor manufacturing equipment, storage medium, and installation system of semiconductor manufacturing equipment

(Cross Reference to Related Applications)

This application claims priority based on Japanese Patent Application No. 2017-171284 for which it applied to Japan on September 6, 2017, and uses the content here.

The present invention relates to a method for installing a semiconductor manufacturing apparatus, a storage medium, and an installation system for a semiconductor manufacturing apparatus, and in particular, a plurality of blocks are arranged on the floor of a clean room, and a semiconductor manufacturing apparatus performs a prescribed process on a substrate to be processed. It relates to an installation method of an apparatus, a storage medium, and an installation system of a semiconductor manufacturing apparatus.

[0002] As one of semiconductor manufacturing equipment, there is a coating and developing processing system. The coating and developing processing system performs a coating process of forming a resist film by supplying a coating liquid on a semiconductor wafer (hereinafter referred to as a 'wafer') and a development process of developing a resist film exposed to a predetermined pattern, and the like, By forming a predetermined resist pattern, various processing devices for processing wafers and transport mechanisms for transporting wafers are mounted.

A semiconductor manufacturing apparatus such as such a coating and developing processing system is installed in a clean room with little dust. Also, the semiconductor manufacturing apparatus is composed of a plurality of blocks. For example, the coating and developing processing system includes a cassette station block for carrying wafers in and out of the system in cassette units, a processing station block for performing predetermined processing such as the coating processing, and an exposure device adjacent to the processing station block. It has an interface station block that transfers wafers between them (see Patent Document 1). And the semiconductor manufacturing apparatus is comprised by arranging these some block on the floor surface of a clean room.

The semiconductor manufacturing apparatus as described above is carried into a clean room in a state in which blocks are not connected to each other because of transport on a general road or the like.

And installation of a semiconductor manufacturing apparatus in a clean room was conventionally performed, for example as follows.

First, the block of 1 is conveyed to a predetermined position, and the inclination of the block of 1 is adjusted. As a result, the installation of the block 1 is completed. Next, the other block is conveyed to the vicinity of the block of 1, and then the other block is moved so that the distance between the other block and the block of 1 is appropriate (for example, 5 mm). Adjust the position of the block. Adjustment of the position of the other block is performed by a worker manually sliding or lifting the other block on the floor and moving it, since heavy machinery such as a forklift cannot be brought into the clean room. Subsequently, the inclination of the other block is also adjusted. And, if necessary, the adjustment of the position and the adjustment of the inclination as described above are repeated. This completes the installation of the other block. By performing the processing as described above for all remaining blocks, installation of the entire semiconductor manufacturing apparatus is completed.

Japanese Patent Publication No. 2012-033886

However, each block of the semiconductor manufacturing equipment is very heavy at several tons. For this reason, many workers, such as 6 people, are required to adjust the position of a block, for example. Also, as described above, since each block is very heavy, it is difficult to manually adjust the position of the block in units of millimeters, and the adjustment takes time. Since position adjustment is difficult as described above, there is a case where blocks collide during readjustment, and the position and inclination of blocks whose positions and inclinations have already been adjusted become inappropriate, and the adjusted blocks need to be readjusted. there is. That is, in the conventional method, adjustment of the position and inclination of the block of the semiconductor manufacturing apparatus may take a very long time.

Further, when the distance between the blocks is not made appropriate by adjusting the position of the blocks, there are various problems. For example, when conveying a wafer by a conveying device within the semiconductor manufacturing equipment, a conveying error such as the conveying device colliding with another part occurs, or the pressure state in the semiconductor manufacturing equipment cannot be adjusted as desired. As a result, Particles cannot be discharged, making it impossible to maintain cleanliness in the device. In addition, since it is necessary to set the inside of the semiconductor manufacturing equipment to a positive pressure relative to the outside of the equipment, if the distance between the blocks is larger than an appropriate value, the amount of gas required to set the positive pressure increases as described above, which is not preferable from the viewpoint of energy saving. .

Patent Literature 1 relates to the above-mentioned point, and does not disclose it.

The present invention has been made in view of the above situation, and it is possible to install a semiconductor manufacturing apparatus configured by arranging a plurality of blocks on the floor surface of a clean room and performing a predetermined process on a target substrate with a small number of people and in a short time. .

One aspect of the present invention to solve the above problems is a method for installing a semiconductor manufacturing apparatus configured by arranging a plurality of blocks on a floor surface and performing a predetermined process on a substrate to be processed, wherein a first block is placed on the floor surface an installation step of installing at a location; a conveying step of transporting a second block to a predetermined area on the floor, located within a predetermined distance from a target position based on the first block installed at the predetermined location; 2. A plurality of moving devices each having a support portion supporting a predetermined location and capable of moving the support portion within a predetermined plane parallel to the floor surface and moving the support portion in a height direction perpendicular to the floor surface. Based on the step of attaching the moving device to be attached to the predetermined location and information on the position of the second block relative to the target position within the predetermined plane, the support units of the plurality of moving devices are moved in synchronization with each other, Based on an in-plane adjustment step of adjusting the position of the second block within a predetermined plane, and information on the position of the second block relative to the target position along the height direction, the supporting units of the plurality of moving devices are determined. a height adjustment step of synchronizing movement and adjusting the position of the second block along the height direction; and moving the support portions of the plurality of moving devices separately based on information on the inclination of the second block, and a gradient adjustment process of adjusting the gradient of the second block.

In the semiconductor manufacturing equipment installation method of one aspect of the present invention, since the position of the second block relative to the first block is adjusted and the inclination of the second block is adjusted using the moving device, the number of people is small. In addition, the semiconductor manufacturing equipment can be installed in a short time.

One aspect of the present invention according to another aspect is a readable computer storage medium storing a program operating on a computer of a control unit for controlling the installation system so that the installation method of the semiconductor manufacturing apparatus is executed by the installation system.

One aspect of the present invention according to another aspect is an installation system for a semiconductor manufacturing apparatus configured by arranging a plurality of blocks on a floor surface, in a predetermined plane parallel to the floor surface, a target based on the first block a device for obtaining position information for acquiring position information of a second block relative to a position and information of a position of the second block relative to the target position along a height direction perpendicular to the predetermined plane; It is possible to have a level measuring device for obtaining information of an inclination and a support for supporting a predetermined location of the second block, and to move the support within the predetermined plane and also to move the support in the height direction. A plurality of moving devices mounted at predetermined locations, and the first block is installed at a predetermined position on the floor, and the second block is transported to a predetermined area on the floor, located within a predetermined distance from the target position. and, after the plurality of moving devices are respectively mounted at the predetermined location, the support units of the plurality of moving devices are synchronized based on information on the position of the second block relative to the target position in the predetermined plane. and an in-plane adjustment step of adjusting the position of the second block within the predetermined plane by moving the second block, and the plurality of movements based on information on the position of the second block relative to the target position along the height direction. A height adjustment step of moving the support units of the device in synchronization and adjusting the position of the second block along the height direction; and the support units of the plurality of moving devices based on the inclination information of the second block. and a control device for controlling the device for obtaining location information, the level measuring device, and the plurality of moving devices so that a tilt adjustment process of adjusting the tilt of the second block by moving them separately is executed.

According to one aspect of the present invention, a semiconductor manufacturing apparatus configured by arranging a plurality of blocks on the floor surface of a clean room and performing a predetermined process on a substrate to be processed can be installed with a small number of people and in a short time.

1 is a plan view schematically illustrating the configuration of a coating and developing system according to the present embodiment.
Fig. 2 is a front view showing an outline of the configuration of the coating and developing processing system according to the present embodiment.
Fig. 3 is a rear view schematically illustrating the configuration of the coating and developing system according to the present embodiment.
Fig. 4 is an explanatory diagram schematically illustrating the configuration of an installation system used in the installation method of the coating and developing system according to the first embodiment.
5 is a side view schematically illustrating the configuration of the mobile device.
Fig. 6 is a flowchart showing an example of main steps of the installation method of the coating and developing treatment system according to the first embodiment.
7 is a flowchart showing an example of an in-plane positioning process.
8 is a diagram showing an example of a screen displayed at the time of installation by the installation method of the coating and developing system according to the first embodiment.
9 is a flowchart showing an example of a height adjustment process.
Fig. 10 is a diagram showing another example of a screen displayed at the time of installation by the installation method of the coating and developing system according to the first embodiment.
11 is a flowchart showing an example of a tilt adjustment process.
Fig. 12 is a diagram showing another example of a screen displayed at the time of installation by the installation method of the coating and developing system according to the first embodiment.
13 is a flowchart showing another example of an in-plane positioning process.
14 is a flowchart showing another example of a height adjustment process.
15 is a flowchart showing another example of a tilt adjustment process.
16 is an explanatory diagram of a modified example of the first and second embodiments.

EMBODIMENT OF THE INVENTION Hereinafter, embodiment of this invention is described with reference to drawings. In addition, in this specification and drawings, the same code|symbol is attached|subjected to the element which has substantially the same function structure, and redundant description is abbreviate|omitted.

First, a semiconductor manufacturing apparatus that is installed by the installation method according to the present invention and performs a predetermined process on a wafer will be described.

1 is an explanatory diagram schematically illustrating the internal configuration of a coating and developing processing system 1 as an example of a semiconductor manufacturing apparatus. 2 and 3 are a front view and a rear view respectively schematically illustrating the internal configuration of the coating and developing processing system 1. As shown in FIG.

As shown in Fig. 1, the coating and developing processing system 1 includes, for example, a cassette station block (hereinafter referred to as "CS block") 2 in which a cassette C is carried in and out between the outside and the resist A processing station block (hereinafter referred to as a "PS block") 3 provided with a plurality of various processing devices that perform predetermined processing such as coating processing and PEB, and an exposure device 4 adjacent to the PS block 3 An interface station block (hereinafter referred to as an 'IF block') 5 that transfers the wafer W between the and is arranged on the floor surface of the clean room (see reference numeral (F) in FIG. 5), and is integrally connected and configured. Hereinafter, the direction in which the above-described blocks of the coating and developing system 1 are arranged is referred to as the front-back direction or the Y-direction, and the direction orthogonal to the front-back direction in a predetermined plane parallel to the floor of the clean room is left and right. It is referred to as the direction or X direction, and the direction perpendicular to the predetermined plane is referred to as the height direction or Z direction. In addition, since the predetermined surface parallel to the floor surface is, for example, a horizontal surface, the predetermined surface will be described below as being a horizontal surface.

Further, the coating and developing system 1 has a control unit 6 that controls the coating and developing system 1 .

The CS block 2 is divided into a cassette carry-in/out unit 10 and a wafer transfer unit 11, for example. For example, the cassette carry-in/out unit 10 is provided at the end of the coating and developing system 1 on the Y-direction side (left side in FIG. 1). The cassette loading/unloading unit 10 is provided with a cassette placing table 12 . On the cassette placing table 12, a plurality of placing plates 13 are provided, for example, four pieces. Arrangement plates 13 are arranged in a row in the X direction (vertical direction in FIG. 1 ). Cassettes C can be placed on these mounting plates 13 when the cassettes C are carried in and out of the coating and developing system 1 .

As shown in FIG. 1 , the wafer transport unit 11 is provided with a wafer transport device 21 capable of moving on a transport path 20 extending in the X direction. The wafer transport device 21 is movable in the height direction and around the vertical axis (θ direction), and includes a cassette C on each placing plate 13 and a delivery device of a block G3 of the PS block 3 described later. The wafer W can be transported between.

The PS block 3 is provided with a plurality of, for example, four blocks (G1, G2, G3, G4) equipped with various devices. For example, a block G1 is provided on the front side of the PS block 3 (the negative side in the X direction in FIG. 1), and a block G2 is provided on the back side of the PS block 3 (the positive side in the X direction in FIG. 1). It is provided. Further, a block G3 is provided on the CS block 2 side (Y direction negative side in FIG. 1) of the PS block 3, and a block G3 is provided on the IF block 5 side (Y direction positive side in FIG. 1) of the PS block 3. ) is provided with a block G4.

In the block G1, as shown in FIG. 2, a plurality of liquid processing devices, for example, a developing processing device 30 that develops the wafer W, and a resist liquid applied to the wafer W to form a resist film. The resist coating devices 31 are arranged in this order from the bottom.

For example, three developing apparatuses 30 and three resist coating apparatuses 31 are arranged in a horizontal direction. In addition, the number and arrangement of these developing devices 30 and resist coating devices 31 can be arbitrarily selected.

In these developing apparatuses 30 and resist coating apparatuses 31, spin coating is performed, for example, in which a predetermined processing liquid is applied onto the wafer W. In spin coating, for example, a processing liquid is discharged from a coating nozzle onto the wafer W, and the wafer W is rotated to spread the processing liquid on the surface of the wafer W.

For example, in the block G2, as shown in FIG. 3 , a heat treatment device 40 that performs heat treatment such as heating or cooling the wafer W, and a peripheral exposure device that exposes the outer periphery of the wafer W ( 41) are arranged in the vertical and horizontal directions. The number and arrangement of these heat treatment devices 40 and peripheral exposure devices 41 can also be arbitrarily selected.

A plurality of delivery devices 50 are provided in the block G3. Further, a plurality of delivery devices 60 are provided in the block G4, and a defect inspection device 61 is provided thereon.

As shown in FIG. 1 , a wafer transfer area D is formed in an area surrounded by blocks G1 to G4. In the wafer transport area D, for example, a wafer transport device 70 is disposed.

The wafer transport device 70 has a transfer arm 70a that is movable in, for example, the Y-direction, the front-back direction, the θ-direction, and the vertical direction. The wafer transfer device 70 moves within the wafer transfer area D and transfers the wafer W to predetermined devices in the surrounding blocks G1, G2, G3, and G4. can As shown in FIG. 3, for example, a plurality of wafer transport devices 70 are arranged vertically, and wafers W can be transported by, for example, devices having the same height in each block G1 to G4. there is.

Further, in the wafer transport area D, a shuttle transport device 71 that transports the wafers W linearly between the blocks G3 and G4 is provided.

The shuttle conveyance device 71 can move linearly in the Y direction of FIG. 3, for example. The shuttle conveying device 71 moves in the Y direction while supporting the wafer W, and is between the conveying device 50 of the block G3 and the conveying device 60 of the block G4 having the same height. The wafer (W) can be transported in.

As shown in FIG. 1 , a wafer transport device 72 is provided on the positive side of the block G3 in the X direction. The wafer transport device 72 has a transport arm 72a that is movable in, for example, the front-rear direction, the θ direction, and the vertical direction. The wafer transport device 72 can move up and down while supporting the wafer W, and transport the wafer W to each transfer device 50 in the block G3.

The IF block 5 is provided with a wafer transport device 73 and a delivery device 74 . The wafer transport device 73 has a transport arm 73a that is movable in, for example, the Y direction, the θ direction, and the vertical direction. The wafer transport device 73 supports the wafer W on, for example, the transport arm 73a, and between the respective transport devices 60, the transport device 74, and the exposure device 4 in the block G4. The wafer W can be transported.

Further, on the lower surfaces of the CS block 2, PS block 3 and IF block 5 of the coating and developing system 1, as shown in Figs. 2 and 3, each block is placed on the floor of the clean room. A leg portion 80 for supporting the surface is provided. The leg part 80 is what is called an adjuster foot, and the height is comprised so that adjustment is possible.

The control unit 6 is, for example, a computer, and has a program storage unit (not shown). The program storage unit stores programs for controlling the processing of the wafer W in the coating and developing processing system 1 by controlling the operation of drive systems such as various types of processing devices and conveying devices described above. In addition, the program, for example, a computer-readable storage medium (H) such as a computer-readable hard disk (HD), flexible disk (FD), compact disk (CD), magnet optical disk (MO), memory card, etc. It may have been recorded, and may have been installed in the control unit 6 from the storage medium H.

Next, wafer processing using the coating and developing processing system 1 will be described.

In the wafer processing using the coating and developing processing system 1, first, the wafer W is taken out from the cassette C on the cassette placing table 12 by the wafer transport device 21, and the PS block 3 is transferred. It is returned to the device 50.

Subsequently, the wafer W is transported by the wafer transport device 70 to the heat treatment device 40 of block G2 and subjected to temperature control treatment. Thereafter, the wafer W is transported to the resist coating device 31 of block G1, and a resist film is formed on the wafer W. Thereafter, the wafer W is transported to the thermal processing apparatus 40 and subjected to a pre-applied bake (PAB) process. In addition, the same heat treatment is performed in the pre-bake process, the subsequent PEB process, and the post-bake process. However, the heat treatment devices 40 provided for each heat treatment are different from each other.

Thereafter, the wafer W is transported to the peripheral exposure apparatus 41 and subjected to peripheral exposure processing.

Subsequently, the wafer W is conveyed to the exposure apparatus 4 and subjected to exposure processing in a predetermined pattern.

Subsequently, the wafer W is transported to the thermal processing device 40 and subjected to PEB processing. Thereafter, the wafer W is conveyed to, for example, the developing apparatus 30 and subjected to development. After the development process is finished, the wafer W is transported to the heat treatment device 40 and subjected to a post-bake process. Then, the wafer W is transported to the defect inspection device 61, and the wafer W is inspected for defects. In the defect inspection, an inspection is performed to determine whether or not there are scratches or adhesion of foreign matter. After that, the wafer W is transferred to the cassette C of the placement plate 13, and a series of photolithography processes are completed.

<First Embodiment>

Next, the installation system according to the first embodiment of the present invention will be described. The said installation system is used for the installation method of a coating and developing system.

4 is an explanatory diagram showing an outline of the configuration of the installation system 100 according to the first embodiment.

The installation system 100 is used for the installation method of the coating and developing processing system 1, and is installed at a target position based on the CS block 2 as the 'first block' according to the present invention installed in a predetermined position, for example. , PS block 3 as a 'second block' can be installed. This installation system 100 includes an imaging device 200, a range measuring device 210, a plurality of level gauges 220, a plurality of moving devices 300, and a control device 400.

The imaging device 200 captures an image of a target mark (not shown) formed on the surface of the PS block 3 of the CS block 2, that is, the rear surface 2a. For example, a CMOS (Complementary Metal Oxide Semiconductor) sensor It consists of a used image processing camera and is mounted at a fixed position of the PS block (3). The imaging result of the imaging device 200 is used to obtain information on the position of the PS block 3 relative to the target position along the X and Z directions. In other words, the imaging device 200 is a device for acquiring X-direction position information, which is a device for acquiring information on the X-direction position of the PS block 3 with respect to the target position, and also the PS block 3 with respect to the target position. A device for acquiring Z-direction positional information, which is a device for acquiring Z-direction positional information of .

The target mark imaged by this imaging device 200 is, for example, a circle, and when the PS block 3 is arranged at the target position, the optical axis of the imaging device 200 and the center of the target mark It is formed in the matching position.

The distance measuring device 210 measures the distance from the PS block 3 to the CS block 2, specifically, the surface of the PS block 3 on the CS block 2 side, that is, the distance of the CS block 2 from the front surface 3a. It measures the distance to the back surface 2a, is composed of, for example, a triangulation sensor, and is mounted in a predetermined position of the PS block 3. The result of measurement by the ranging device 210 is used to obtain information on the Y-direction position of the PS block 3 relative to the target position. In other words, the ranging device 210 is a device for acquiring Y-direction positional information, which is a device for acquiring information on the Y-direction position of the PS block 3 relative to the target position. Further, the ranging device 210 may be attached to the CS block 2, or may be provided in multiple numbers so as to use the average value of the ranging results.

The level meter 220 measures the level, that is, the inclination, of the predetermined measurement positions P1A to P1D of the PS block 3, and is configured by, for example, an acceleration sensor, at the measurement positions P1A to P1D. installed in a specified direction. The measurement position P1A is the position on the positive side in the X direction and the negative side in the Y direction of the PS block 3, the measurement position P1B is the position on the positive side in the X direction and the Y direction of the PS block 3, and the measurement position ( P1C) is a position on the X-direction negative side and Y-direction negative side of the PS block 3, and the measurement position P1D is a position on the X-direction negative side and Y-direction positive side of the PS block 3. Hereinafter, the level measuring instruments 220 disposed at the measuring positions P1A to P1D are referred to as level measuring instruments 220A to 220D, respectively.

The moving device 300 moves the PS block 3 and is mounted in a predetermined mounting position P2A to P2D of the PS block 3 in a predetermined direction. The mounting position P2A is the X-direction positive side end of the PS block 3 and the Y-direction negative side position, the mounting position P2B is the X-direction positive side end of the PS block 3 and the Y-direction positive side position, and the mounting position (P2C) is the X-direction negative side end of the PS block 3 and the Y-direction negative side position, and the mounting position (P2D) is the X-direction negative side end of the PS block 3 and the Y-direction positive side position. Hereinafter, the mobile devices 300 disposed at the mounting positions P2A to P2D are referred to as mobile devices 300A to 300D, respectively.

In addition, the number of moving devices 300 and level gauges 220 is not limited to four, and may be three depending on the mounting position. Also, the number of moving devices 300 and the number of level gauges 220 may be different from each other.

5 is a side view showing an outline of the configuration of the mobile device 300A.

As shown in FIG. 5 , the moving device 300A has a support portion 310 that contacts the bottom surface of the PS block 3 and supports the PS block 3 . In addition, the moving device 300A has an XYZ stage 320 that moves the support 310 in the X, Y, and Z directions.

The XYZ stage 320 includes, for example, a Z-direction drive device 321 on which a support portion 310 is supported to move the support portion 310 in the Z direction, and a Z-direction drive device 321 supported to move the support portion 310 in the X direction and the X direction. It has an XY stage 322 that moves the support part 310 in the X and Y directions by moving in the Y direction. The XY stage 322 may move in the X and Y directions by an XY-direction driving device (not shown). In this example, the driving method of the Z-direction drive device 321 and the XY-direction drive device is a method using an electric linear actuator including a ball screw, but other methods such as a method using a hydraulic cylinder may be used.

In this example, the XY stage 322 supports the Z-direction driving device 321 supporting the support portion 310, but the XY stage 322 is configured to support the support portion 310, and this XY stage 322 may be supported by the Z-direction driving device 321 .

The moving device 300A also has a base 330 supporting the XYZ stage 320 on the floor F of the clean room.

In addition, the moving device 300A includes a gripping portion 340 that is gripped when the operator moves the moving device 300A, and wheels (not shown) for facilitating movement of the moving device 300A by the operator. have

The mobile devices 300B to 300D are configured in the same way as the mobile device 300A. However, the moving devices 300A and 300B have the gripping part 340 at the position on the positive side in the X direction in the state of being mounted in the predetermined direction at the predetermined positions (P2A, P2B) of the PS block 3, but the moving device ( 300C, 300D) has a gripping part 340 at a position on the side of the X direction in a state of being mounted in a predetermined direction at predetermined positions (P2C, P2D) of the PS block 3.

Returning to the description of FIG. 4 .

The control device 400 controls the imaging device 200, the ranging device 210, the level measuring devices 220A to 220D, and the moving devices 300A to 300D, and includes the imaging device 200, the ranging device 210, It is communicatively connected with the level instruments 220A-220D and the mobile devices 300A-300D. For the communication, a known wireless communication technology such as wireless LAN or Bluetooth (registered trademark) communication is used.

The control device 400 is composed of, for example, a personal computer, and has a control unit 410, a display unit 420, and an operation unit 430.

The controller 410 is composed of a CPU (Central Processing Unit) or the like and controls the entire control device 400 .

The display unit 420 is composed of, for example, a flat image display panel such as a liquid crystal display or an organic EL display. The display unit 420 may be provided with a touch panel.

The control unit 430 is configured by buttons, direction keys, a touch panel provided on the display unit 420, or a combination thereof.

Next, a method of installing the coating and developing system 1 using the installation system 100 will be described. 6 is a flow chart showing an example of the main steps of this installation method. 8, 10 and 12 are diagrams showing examples of screens displayed on the display unit 420 when the coating and developing system 1 is installed by such an installation method. 7, 9, and 11 are flowcharts showing examples of an in-plane position adjustment process, a height adjustment process, and an inclination adjustment process described later in this installation method, respectively.

First, the CS block 2 is installed in a predetermined location on the floor F of the clean room in a predetermined direction, and the inclination of the CS block 2 is adjusted (step S1).

Subsequently, the PS block 3 is manually transported by a plurality of workers to a predetermined area on the floor F within a predetermined distance from the target position based on the CS block 2 installed at the predetermined location (step (S2)). The predetermined distance is a distance that can be moved by the XY stage 322 of the moving devices 300A to 300D, and is, for example, 10 to 30 mm. In addition, the subsequent processing can be performed by a single operator even if an operator is required.

After step S2, the operator mounts the imaging device 200 and the ranging device 210 at predetermined positions (step S3).

Subsequently, the operator mounts the plurality of moving devices 300 on the PS block 3 (step S4). Specifically, the operator mounts the moving devices 300A to 300D at predetermined positions P2A to P2D of the PS block 3, respectively. At the time of mounting, for example, the moving devices 300A to 300D are moved in a state where the supporting parts 310 of the moving devices 300A to 300D are lowered, and the supporting parts 310 are inserted under the PS block 3. Next, an operator raises the support part 310 and supports the PS block 3 with moving devices 300A to 300D. The lifting of the support part 310 can be performed via the operation part 430 of the control apparatus 400, for example. Thereafter, the operator reduces the height of the leg portion 80 so that the leg portion 80 does not interfere with the floor surface F when adjusting the position and inclination of the PS block 3.

After step S4, the operator mounts the plurality of level measuring instruments 220 on the PS block 3 (step S5). Specifically, the operator mounts the level measuring instruments 220A to 220D at predetermined measurement positions P1A to P1D of the PS block 3 (step S5).

The order of performing the process of step S3, the process of step S4, and the process of step S5 is arbitrary.

Then, the control device 400 calculates positional information of the PS block 3 in the horizontal plane with respect to the target position using the imaging result of the imaging device 200 and the ranging result of the ranging device 210, Based on the information, the support units 310 of the plurality of moving devices 300A to 300D are synchronized and moved to adjust the position of the PS block 3 in the horizontal plane (step S6).

In the horizontal plane position adjustment step of step S6, as shown in Fig. 7, the control device 400 provides information on the position of the PS block 3 in the horizontal plane relative to the target position, that is, the PS relative to the target position. Information on the X-direction position and Y-direction position of block 3 is acquired (step S61). The Y-direction position of the PS block 3 with respect to the target position may be calculated based on the ranging result of the ranging device 210, and specifically, the distance measuring result and the Y coordinate value of the target position (for example, 5 mm). In addition, the X-direction position of the PS block 3 relative to the target position can be calculated based on the distance measurement result of the ranging device 210 and the imaging result of the imaging device 200. Specifically, the distance measurement result and It can be calculated based on the deviation amount of the target mark in the captured image obtained by the imaging device 200 along the X direction from the center of the captured image.

Next, the control device 400 displays, for example, a screen I1 as shown in FIG. 8 on the display unit 420 based on information on the position of the PS block 3 relative to the target position in the horizontal plane. (Step S62). This screen I1 shows the current position of the PS block 3 relative to the target position in the horizontal plane, that is, the current position of the PS block 3 relative to the target position in the X direction, and the PS block 3 relative to the target position. ) indicates the current position in the Y direction. In order to position the PS block 3 at the target position in the horizontal plane from the screen I1 of this example, the operator moves the PS block 3 in the Y-direction forward, that is, in a direction closer to the CS block 2, It can be seen that it is necessary to move the PS block 3 in the positive direction of the X direction.

Based on the screen I1, the operator determines whether the PS block 3 is located at the target position in the horizontal plane (step S63). When positioned at the target position (if YES), the process of adjusting the position in the horizontal plane is ended by the operator pressing and manipulating an end button (not shown). On the other hand, when not located at the target position (case NO), the operator, based on the screen I1, selects the PS block 3 among negative X direction, positive X direction, negative Y direction, and positive Y direction. Select a direction to move, and operate by pressing a corresponding button (step S64). Then, the controller 400 synchronizes and moves the support parts 310 of the moving devices 300A to 300D by the XY stage 322 according to the pressing operation, and moves the PS block 3 a predetermined distance in the selected direction. (step S65). The distance to be moved by pressing the button once, that is, the predetermined distance is stored in advance in a storage unit (not shown).

After this, the steps after step S61 are executed again. Then, in step S63, if it is determined that the PS block 3 is located at the target position in the horizontal plane, the position adjustment process in the horizontal plane ends.

After the process of adjusting the position in the horizontal plane in step S6, the control device 400 uses the imaging result of the imaging device 200 and the ranging result of the ranging device 210 to determine the PS block 3 relative to the target position. Positional information in the height direction (vertical direction in this example) is calculated, and based on the information, the support units 310 of the plurality of moving devices 300A to 300D are synchronously moved, and PS blocks along the height direction ( The position of 3) is adjusted (step S7).

In the height adjustment process of step S7, as shown in Fig. 9, information on the position of the PS block 3 in the height direction relative to the target position, that is, the position of the PS block 3 in the Z direction relative to the target position. Information is acquired (step S71). The Z-direction position of the PS block 3 relative to the target position can be calculated based on the distance measurement result of the ranging device 210 and the imaging result of the imaging device 200, specifically, the distance measurement result and the imaging device It can be calculated based on the deviation amount of the target mark in the captured image obtained in step (200) along the Z direction from the center of the captured image.

Next, the control device 400 displays, for example, a screen I2 as shown in FIG. 10 on the display unit 420 based on the information on the Z-direction position of the PS block 3 relative to the target position (step (S72)). This screen I2 shows the current position of the PS block 3 in the Z direction relative to the target position, that is, the target height, that is, the current height. The operator can see from the screen I2 of this example that it is necessary to move the PS block 3 to the right in the Z direction in order to position the PS block 3 at the target position in the height direction.

Based on the screen I2, the operator determines whether the PS block 3 is located at the target position in the height direction (step S73). When positioned at the target position (if YES), the height adjustment process ends when the operator presses an end button (not shown) or the like. On the other hand, when not located at the target position (NO), the operator selects the direction in which the PS block 3 is to be moved among the Z-direction negative direction and Z-direction forward direction based on the screen I2, and the corresponding The button is pressed and operated (step S74). Subsequently, the control device 400 synchronizes and moves the support portions 310 of the moving devices 300A to 300D by the Z-direction drive mechanism according to the pressing operation, and moves the PS block 3 a predetermined distance in the selected direction. (Step S75). The distance to be moved by pressing the button once, that is, the predetermined distance is stored in advance in a storage unit (not shown).

After this, the steps after step S71 are executed again. Then, in step S73, if it is determined that the PS block 3 is located at the target position in the height direction, the height adjustment process is ended.

After the height adjustment process of step S7, the control device 400 moves the support portions 310 of the moving devices 300A to 300D individually based on the measurement results from the level measuring instruments 220A to 220D, The inclination of the PS block 3 is adjusted (step S8).

In the inclination adjustment process of step S8, as shown in FIG. 11 , information on the inclination at each measurement position P1A to P1D of the PS block 3 is attached to each measurement position P1A to P1D. It is obtained from the level measuring instruments 220A to 220D (step S81).

Next, the control device 400 displays a screen I3 as shown in FIG. 12, for example, on the display unit 420 based on information on the inclination at each measurement position P1A to P1D of the PS block 3. is displayed (step S82). This screen I3 indicates the degree of inclination at each measurement position P1A to P1D in color, for example, a measurement position whose inclination is within an allowable range is displayed in blue (white in the drawing), and the inclination is acceptable. Measurement positions outside of the range but within the specified range are shown in yellow (light gray in the drawing), and measurement positions with an inclination outside the permissible range and outside the specified range are shown in red (dark gray in the drawing). The operator can understand from the screen I3 of this example that it is necessary to adjust the inclination with respect to the measurement positions P1A and P1B.

Based on the screen I3, the operator judges whether the inclinations of all the measurement positions P1A to P1D fall within the allowable range (step S83). When both are within the permissible range (YES), the tilt adjustment process ends when the operator presses an end button (not shown) or the like. On the other hand, if there are items that do not fall within the allowable range (NO), the operator selects which measurement position (P1A to P1D) to adjust the inclination based on the screen I3, and presses a corresponding button. Operate (step S84).

Then, the control device 400, according to the pressing operation, moves the moving device 300 necessary to adjust the inclination of the measurement position P1 selected by the operator, and puts the inclination of the selected measurement position P1 within the allowable range. The amount of Z-direction movement of the support unit 310 required for this purpose is displayed on the display unit 420 (step S85). The amount of movement in the Z direction is represented by, for example, the number of times a button is pressed to move the support portion 310 in the Z direction.

A method for determining the moving device 300 required to adjust the inclination of the measurement position P1 selected by the operator or a method for determining the amount of movement in the Z direction of the support 310 necessary to bring the inclination within the allowable range includes, for example, Japan What was described in Unexamined-Japanese-Patent No. 2017-73538 can be used.

Based on the display result on the display unit 420, the operator operates the operation unit 430, and, for example, presses the corresponding button as many times as the number of presses displayed on the display screen (step S86). Then, the control device 400 adjusts the inclination of the PS block 3 by moving the support 310 of the corresponding moving device 300 in the positive or negative direction in the Z direction according to the pressing operation (step (S87)). In addition, the moving distance of the support part 310 in the Z direction is a distance corresponding to the number of pressings, and a distance corresponding to one pressing is previously stored in a storage unit (not shown).

After this, the steps after step S81 are executed again. In step S83, when it is determined that the slopes of all measurement positions P1A to P1D are within the allowable range, the slope adjustment process is ended.

Subsequently, the operator extends the leg portion 80 of the PS block 3 to the floor surface F of the clean room, lowers the support portion 310 of the moving devices 300A to 300D, and moves the PS block to the leg portion 80. (3) is supported on the floor surface (F) of the clean room. Then, the mobile devices 300A to 300D are separated (step S9). After that, by fixing the CS block 2 and the PS block 3 using bolts and nuts, the installation of the PS block 3 is completed.

Then, the IF block 5 is installed and the inclination of the IF block 5 is adjusted (step S10). In this way, the installation process of the coating and developing system of the present embodiment ends.

According to this embodiment, the adjustment of the position of the PS block 3 or the adjustment of the inclination of the PS block 3 along the X direction, Y direction, and Z direction is performed on the support for supporting the PS block 3 in the X direction. , Since the movement device 300 capable of moving in the Y and Z directions is used, the coating and developing system 1 can be installed with a small number of people and in a short time.

Furthermore, according to the present embodiment, since the moving device 300 is detachably attached to the PS block 3, it can be used even when other coating and developing processing systems are installed.

By making the image pickup device 200, the distance measuring device 210, and the level measuring device 220 detachable, they can also be used when installing other coating and developing processing systems.

By forming the target mark imaged by the imaging device 200 to be detachable, it can also be used when installing other coating and developing processing systems.

In addition, according to the present embodiment, since the degree of inclination of each measurement position P1A to P1D of the PS block 3 is indicated by color, the operator checks whether the inclination of all measurement positions P1A to P1D is within the allowable range. It is possible to intuitively determine whether or not and the measurement positions (P1A to P1D) to adjust the inclination.

<Second Embodiment>

In the first embodiment, the position adjustment, the height adjustment, and the inclination adjustment in the horizontal plane were performed according to the operator's operation, that is, manually. However, in the present embodiment, these adjustments are performed automatically.

In the installation method of the coating and developing system 1 according to the present embodiment, after performing steps S1 to S5 in the installation method of the first embodiment, for example, 'AUTO' displayed on the display unit 420 When the operator presses the ' button, the control device 400 automatically adjusts the position, height, or inclination of the PS block 3 in the horizontal plane. When these adjustments are finished, the control device 400 displays, for example, a message 'FINISH' indicating the end on the display unit 420 in order to notify the operator.

In the installation method according to the present embodiment and the installation method according to the first embodiment, only the position adjustment process in the horizontal plane of step S6, the height adjustment process of step S7, and the inclination adjustment process of step S8 are different. Therefore, only these processes are described. 13 to 15 are flowcharts showing examples of an in-plane position adjustment process, a height adjustment process, and an inclination adjustment process according to the present embodiment, respectively.

In the position adjustment step in the horizontal plane according to the present embodiment, as shown in Fig. 13, information on the position of the PS block 3 relative to the target position in the horizontal plane, that is, the X direction of the PS block 3 relative to the target position. Information on the location and the Y-direction location is obtained (step S101).

Next, the control device 400 determines whether the PS block 3 is located at the target position in the horizontal plane based on the acquired positional information in the horizontal plane (step S102). When located at the target position (case of YES), the control device 400 ends the position adjustment process in the horizontal plane. On the other hand, if it is not located at the target position (case NO), the control device 400, based on the position information of the PS block 3 relative to the target position in the horizontal plane, X-direction negative direction, X-direction Among the forward direction, the Y-direction negative direction, and the Y-direction positive direction, the direction in which the support part 310 is to be moved is selected (step S103). In addition, when the PS block 3 is displaced from the target position in both the X and Y directions, for example, the direction in which the deviation from the target position is greatest is selected as the direction in which the support portion 310 is moved.

And the control device 400 determines the deviation amount of the PS block 3 from the target position in the selected direction, that is, the amount of support 310 required to position the PS block 3 in the target position in the selected direction. The movement amount is calculated (step S104).

Then, the control device 400 moves the supports 310 of all the moving devices 300A to 300D in the horizontal plane based on the selected movement direction and the calculated movement amount of the support 310, that is, all the moving devices ( The support parts 310 of 300A to 300D are moved by the calculated movement amount in the selected movement direction (step S105).

After this, the steps after step S101 are executed again. Then, in step S102, if it is determined that the PS block 3 is located at the target position in the horizontal plane, the controller 400 ends the in-plane positioning process.

In the height adjustment process according to the present embodiment, as shown in FIG. 14 , the control device 400 provides information on the height direction position of the PS block 3 relative to the target position, that is, the PS block 3 relative to the target position. ) is obtained (step S111).

Next, the controller 400 determines whether the PS block 3 is located at the target position in the height direction based on the information on the Z-direction position of the PS block 3 relative to the target position (step S112). . When located at the target position (if YES), the control device 400 ends the height adjustment process. On the other hand, when not located at the target position (NO), the control device 400, based on information on the Z-direction position of the PS block 3 relative to the target position, selects one of the Z-direction negative direction and the Z-direction forward direction. , Select a direction to move the support part 310 (step S113).

And the control device 400 is the displacement amount of the PS block 3 in the Z direction from the target position, that is, the support unit 310 necessary to position the PS block 3 in the Z direction at the target position The movement amount of is calculated (step S114).

Subsequently, the control device 400 moves the support portions 310 of all the moving devices 300A to 300D in the height direction based on the selected moving direction and the calculated movement amount of the supporting portion 310, that is, moving all the moving devices 300A. ~ 300D) is moved by the calculated movement amount in the selected movement direction (step S115).

After this, the steps after step S111 are executed again. Then, in step S112, if it is determined that the PS block 3 is located at the target position in the height direction, the control device 400 ends the height adjustment process.

In addition, in the horizontal plane position adjustment process and height adjustment process according to the present embodiment, the calculated movement amount of the support unit 310 and the actual movement amount of the PS block 3 may not coincide. In this case, moving the support portion 310 in small increments, calculating a correspondence between the calculated movement amount of the support portion 310 and the actual movement amount of the PS block 3, and feeding back the calculation result of this correspondence relationship. , that is, it is preferable to correct the movement amount of the support part 310 based on the calculated correspondence relationship.

In the tilt adjustment process according to the present embodiment, as shown in FIG. 15 , the control device 400 converts information on the inclination at each measurement position P1A to P1D of the PS block 3 to each measurement position ( P1A to P1D) are acquired from the level measuring instruments 220A to 220D (step S121).

Next, the control device 400 determines whether or not the inclination of all the measurement positions P1A to P1D falls within the allowable range based on information on the inclination at each measurement position P1A to P1D of the PS block 3. (Step S122). When all are within the allowable range (case of YES), the control device 400 ends the tilt adjustment process. On the other hand, if there is something that does not fall within the allowable range (NO), the control device 400 determines the measurement position ( A tilt adjustment target is selected from among P1A to P1D (step S123). For example, the control device 400 selects a measurement position whose inclination is the most out of the permissible range as a tilt adjustment target.

Subsequently, the control device 400 determines the moving device 300 necessary for adjusting the inclination of the selected measurement position P1 (step S124). With respect to the support 310 of the moving device 300 determined in the step S124, the movement direction and movement amount required to put the inclination of the selected measurement position P1 within the allowable range are determined (step S125) .

Next, the control device 400 moves the support 310 of the moving device 300 determined in step S124 based on the movement direction and amount of movement of the support 310 determined in step S125, that is, step The support part 310 of the moving device 300 determined in (S124) is moved by the movement amount determined in step S125 in the moving direction of the support part 310 determined in step S125 (step S126).

After this, the steps after step S121 are executed again. Then, in step S122, if it is determined that the slopes of all measurement positions P1A to P1D fall within the allowable range, the control device 400 ends the slope adjustment process.

According to this embodiment, the adjustment of the position of the PS block 3 or the adjustment of the inclination of the PS block 3 along the X direction, Y direction, and Z direction is performed on the support for supporting the PS block 3 in the X direction. , Y-direction and Z-direction movement is performed automatically using the moving device 300, so that the coating and developing system 1 can be installed with a smaller number of people and in a shorter time than in the first embodiment.

<Modifications of the first and second embodiments>

16 is an explanatory view of another example of the transport process of the PS block 3.

In the example described above, in the conveying step of the PS block 3, the PS block 3 was conveyed manually by a plurality of workers. However, the conveying method of the PS block 3 is not limited to this method, and as shown in FIG. 16, it may be conveyed using a plurality of conveying devices 500. The conveying device 500 supports the PS block 3 with an upper surface 500a, and has a traveling mechanism (not shown) made of wheels or the like. The transport device 500 is configured to be able to move on the floor of the clean room in a state where the PS block 3 is mounted by the traveling mechanism under the control of the control device 400 (see FIG. 4 ), there is.

In the case of using this conveying device 500, in the conveying step of the PS block 3 described above, first, the PS block 3 is mounted on a plurality of conveying devices 500. After mounting, an operator operates the control device 400, whereby the PS block 3 is transported to a predetermined position.

According to this example, since the transportation time of the PS block 3 can be shortened, the time required for installation of the coating and developing system 1 can be further shortened. In addition, the number of workers in the conveying process can be reduced.

In addition, it is preferable that the transport device 500 has a lifting mechanism for lifting the upper surface 500a. This is because mounting of the PS block 3 on the transport device 500 can be performed even with a small number of people.

Alternatively, the conveying device 500 and the moving device 300 may be integrated.

In the above description, the height adjustment and the inclination adjustment were performed once each, but they may be alternately performed a plurality of times.

In the above description, position adjustment in the horizontal plane is performed before height adjustment and inclination adjustment, but may be performed after height adjustment and inclination adjustment.

Further, in the above description, position adjustment or height adjustment in the horizontal plane is performed after installation of the level gauge, but installation of the level gauge may be performed after position adjustment or height adjustment in the horizontal plane as long as it is before inclination adjustment.

Also, in the above description, the ranging device 210 is used for acquiring the positional information of the PS block 3. However, prior to the transport process of the PS block 3, the ranger 210 is provided at the corner of the PS block 3, and during transport, if the measurement result by the ranger 210 is below a predetermined value, You may make it inform by a sound etc. at the time. This can prevent the PS block 3 from colliding with a wall or the like during conveyance of the PS block 3 . In particular, when one worker transports the PS block 3 using the transport device 500, it is assumed that the PS block 3 collides during transport because the operator's field of view is limited. However, by adopting the structure as described above, it is possible to prevent the PS block 3 from colliding with a wall or the like even when conveying alone.

In addition, the installation method according to the present embodiment may be applied to the installation and tilt adjustment of the CS block 2 or the IF block 5.

In addition, since the CS block 2 is divided into the cassette loading/unloading section 10 and the wafer transport section 11 as described above, installation and tilt adjustment of the cassette loading/unloading section 10 or the wafer transport section 11 You may apply the installation method concerning this embodiment to this.

As mentioned above, although embodiment of this invention was described, this invention is not limited to these examples. It is clear to those skilled in the art that various examples of change or correction can be conceived within the scope of the technical idea described in the claims, and it is understood that they also naturally fall within the technical scope of the present invention.

For example, in the above embodiment, the semiconductor manufacturing apparatus has been described as a coating and developing system, but the semiconductor manufacturing apparatus to which the present invention is applied is not limited to the coating and developing system.

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Claims (14)

A method of installing a semiconductor manufacturing apparatus configured by arranging a plurality of blocks on a floor surface and performing a predetermined process on a substrate to be processed, comprising:
An installation step of installing a first block at a predetermined position on the floor;
A conveying step of conveying a second block to a predetermined area on the floor, located within a predetermined distance from a target position based on the first block installed at the predetermined position;
A plurality of moving devices having a support portion supporting a predetermined location of the second block, and capable of moving the support portion within a predetermined plane parallel to the floor surface and moving the support portion in a height direction perpendicular to the floor surface. A moving device mounting step of attaching each to the predetermined location;
Based on information on the position of the second block relative to the target position within the predetermined plane, the support units of the plurality of moving devices are synchronously moved to determine the position of the second block within the predetermined plane. An in-plane adjustment step of adjusting;
Adjusting the position of the second block along the height direction by synchronizing and moving the support units of the plurality of moving devices based on information on the position of the second block relative to the target position along the height direction. height adjustment process;
and a tilt adjustment step of adjusting the tilt of the second block by separately moving the support portions of the plurality of moving devices based on information on the tilt of the second block. According to claim 1,
In the in-plane adjustment process,
a step of displaying the position on a display unit based on information on the position of the second block relative to the target position within the determined plane;
A method of installing a semiconductor manufacturing apparatus, comprising a step of moving the support portions of all the moving devices within the predetermined plane in accordance with an operation to the operating portion. According to claim 1,
In the in-plane adjustment process,
a step of determining a movement direction and a movement amount of the support unit within the predetermined plane based on information on the position of the second block with respect to the target position within the predetermined plane;
and a step of moving the support portions of all the moving devices within the predetermined plane based on the determined movement direction and the movement amount of the support portions. According to claim 1,
The height adjustment process,
displaying the position on a display unit based on information on the position of the second block relative to the target position along the height direction;
A method of installing a semiconductor manufacturing apparatus, comprising a step of moving the support portions of all of the moving devices in a height direction in accordance with an operation on the operation portion. According to claim 1,
The height adjustment process,
determining a moving direction and a moving amount of the support unit in the height direction based on information on the position of the second block relative to the target position along the height direction;
and a step of moving the support portions of all the moving devices in the height direction based on the determined movement direction and the movement amount of the support portions. According to claim 1,
The tilt adjustment step includes a tilt display step of displaying information on the tilt on a display unit based on the tilt information of the second block;
A method of installing a semiconductor manufacturing apparatus, comprising a step of moving the support portion of a part of the plurality of moving devices in a height direction in accordance with an operation to the operation unit. According to claim 6,
In the inclination display step, the degree of inclination is indicated by color. According to claim 1,
In the gradient adjustment process,
determining the moving device to be moved in the height direction based on the inclination information, and determining the moving direction and amount of movement of the support of the moving device;
and a step of moving the determined supporting portion of the moving device based on the determined moving direction and moving amount of the supporting portion. According to claim 1,
In the conveying step, the second block is conveyed by placing it on a conveying device that moves on the floor surface. According to claim 1,
Step of installing a device for acquiring information of the position of the second block relative to the target position within the determined plane and information of the position of the second block relative to the target position along the height direction Including, a method for installing a semiconductor manufacturing apparatus. According to claim 1,
A method of installing a semiconductor manufacturing apparatus including a step of mounting a device for obtaining information on the inclination of the second block. According to claim 1,
Further comprising a step of displaying, on a display unit, information about the position of the second block relative to the target position along at least one of a direction orthogonal to a direction in which each block is arranged in the determined plane and the height direction; ,
The process indicated above is
a step of capturing an image of a target mark formed in the first block with an imaging device provided in the second block;
a step of calculating a position of the second block relative to the target position along at least one of the orthogonal direction and the height direction, based on an imaging result in the imaging device;
and a step of displaying on the display unit the calculated position of the second block relative to the target position along at least one of the orthogonal direction and the height direction. On the computer of the control unit that controls the installation system, the installation method of the semiconductor manufacturing apparatus, which is configured by arranging a plurality of blocks on the floor surface and performs a predetermined process on the substrate to be processed, is executed by the installation system of the semiconductor manufacturing apparatus. A readable computer storage medium storing an operating program,
The installation method is
An installation step of installing a first block at a predetermined position on the floor;
A conveying step of conveying a second block to a predetermined area on the floor, located within a predetermined distance from a target position based on the first block installed at the predetermined position;
A plurality of moving devices having a support portion supporting a predetermined location of the second block, and capable of moving the support portion within a predetermined plane parallel to the floor surface and moving the support portion in a height direction perpendicular to the floor surface. A moving device mounting step of attaching each to the predetermined location;
Based on information on the position of the second block relative to the target position within the predetermined plane, the support units of the plurality of moving devices are synchronously moved to determine the position of the second block within the predetermined plane. An in-plane adjustment step of adjusting;
Adjusting the position of the second block along the height direction by synchronizing and moving the support units of the plurality of moving devices based on information on the position of the second block relative to the target position along the height direction. height adjustment process;
and an inclination adjustment step of adjusting the inclination of the second block by separately moving the support units of the plurality of moving devices based on the inclination information of the second block. An installation system for a semiconductor manufacturing apparatus configured by arranging a plurality of blocks on a floor surface,
Information on the position of the second block relative to the target position based on the first block within a predetermined plane parallel to the floor, and the second block relative to the target position along a height direction perpendicular to the predetermined plane a positional information acquisition device for acquiring positional information of
A level measuring device for obtaining information on the slope of the second block;
a plurality of moving devices having a support for supporting a predetermined location of the second block, capable of moving the support within the predetermined plane and moving the support in the height direction, and mounted at the predetermined location;
The first block is installed at a predetermined position on the floor, the second block is conveyed to a predetermined area on the floor, located within a predetermined distance from the target position, and the plurality of moving devices are respectively moved to the predetermined location. After being attached to a location, based on information on the position of the second block with respect to the target position within the predetermined plane, the supporting parts of the plurality of moving devices are moved in synchronization, and the Based on an in-plane adjustment process of adjusting the position of the second block and information on the position of the second block with respect to the target position along the height direction, the support parts of the plurality of moving devices are moved in synchronization, A height adjustment step of adjusting the position of the second block along the height direction, and based on the inclination information of the second block, the supporting parts of the plurality of moving devices are separately moved to determine the inclination of the second block. and a control device for controlling the positional information acquisition device, the level measuring device, and the plurality of moving devices so that a tilt adjustment process for adjusting a height is executed.

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