TWI750408B - Method of installing semiconductor manufacturing device, program, computer storage medium, and installation system - Google Patents

Abstract

An object of the invention is to install a semiconductor manufacturing device by a small number of people in a short period of time. The installation method of the invention includes: a transport step of transporting a PS block 3 to a predetermined region on a floor surface where a CS block 2 has been installed, a movement device mounting step of mounting a plurality of movement devices 300 which have support sections that support the PS block 3 to predetermined locations on the PS block 3, an in-plane adjustment step of adjusting the position of the PS block 3 in the horizontal plane by moving the support sections of the plurality of movement devices 300 in a synchronized manner based on information about the position of the PS block 3 relative to a target position in the horizontal plane, a height adjustment step of adjusting the height of the PS block 3 by moving the support sections of the plurality of movement devices 300 in a synchronized manner based on information about the position of the PS block 3 relative to a target position in the height direction, and a tilt adjustment step of adjusting the tilt of the PS block 3 by moving the support sections of the plurality of movement devices 300 individually based on information about the tilt of the PS block 3.

Description

Installation method, program, computer recording medium, and installation system of semiconductor manufacturing apparatus

The present invention relates to a method for setting up a semiconductor manufacturing apparatus and a system for setting up a semiconductor manufacturing apparatus, and more particularly, to the setting of a semiconductor manufacturing apparatus consisting of a plurality of blocks arranged side by side on the floor of a clean room to perform predetermined processing on a substrate to be processed. Method, program, computer recording medium and setting system.

Existing coating and developing processing systems are used as one type of semiconductor manufacturing equipment. The coating and developing processing system performs coating processing of forming a photoresist film by supplying a coating liquid on a semiconductor wafer (hereinafter referred to as a wafer), or performing a development processing of developing a photoresist film exposed to a predetermined pattern, etc. A predetermined photoresist pattern is formed on the wafer, and various processing devices for processing the wafer or a transport mechanism for transporting the wafer are mounted.

A semiconductor manufacturing apparatus such as this coating and developing processing system is installed in a clean room with less dust. In addition, the semiconductor manufacturing apparatus is composed of a plurality of blocks. For example, the above-mentioned coating and developing processing system includes: a cassette station block for feeding wafers into and out of the system in cassette units, a processing station block for performing predetermined processes such as the above-mentioned coating process, and the adjacent processing station block. An interface station block for transferring wafers between exposure apparatuses (refer to Patent Document 1). A semiconductor manufacturing apparatus is constructed by arranging these plural blocks on the floor of a clean room.

As the above-mentioned semiconductor manufacturing apparatus is transported on a general road, the blocks are transported into a clean room without being connected to each other. Installation in a clean room of a semiconductor manufacturing apparatus has conventionally been performed, for example, in the following manner. First, one block is transported to a predetermined position, and the inclination of the one block is adjusted. Thereby, the setting of the 1 block is completed. Next, transport another block to the vicinity of the above-mentioned block 1, and then move the above-mentioned other block to adjust the position of the other block, so that the distance between the above-mentioned other block and the above-mentioned block 1 is appropriate (eg 5mm). The position adjustment of the above-mentioned other block is carried out by the operator to move or lift the other block with bare hands because it is impossible to carry a large apparatus such as a crane into the clean room. Next, the inclination of the other block is also adjusted. And according to the needs, repeat the above-mentioned position adjustment and inclination adjustment. Thereby, the setting of the above-mentioned other block is completed. The same process as above is performed on all the remaining blocks, thereby completing the overall arrangement of the semiconductor manufacturing apparatus. [Prior Art Documents] [Patent Documents]

Patent Document 1: Japanese Patent Laid-Open No. 2012-33886

[Problems to be Solved by Invention]

However, each block of a semiconductor manufacturing facility weighs several tons. Therefore, for the position adjustment of the blocks, a large number of workers, such as 6 people, are required. In addition, since each block is very heavy as described above, it is difficult to adjust the position of the block in centimeter units by freehand operation, and the adjustment is time-consuming. As mentioned above, it is difficult to adjust the position, so during the re-adjustment, the blocks collide with each other, so that the position or the inclination of the block whose position or inclination has been adjusted becomes uncertain, and the adjusted block needs to be adjusted again. That is, in the conventional method, the adjustment of the position or the inclination of the blocks of the semiconductor manufacturing apparatus is very time-consuming, and there is such a situation.

In addition, due to the above-mentioned position adjustment of the blocks, the distance between the blocks becomes inappropriate, and various problems arise in this situation. For example, when a wafer is transported by a transport device in a semiconductor manufacturing device, the transport device collides with other parts, a transport error occurs, and the pressure state in the semiconductor manufacturing device cannot be set as expected. As a result, particles cannot be discharged and cannot be maintained. cleanliness within the unit. In addition, it is necessary to make the inside of the semiconductor manufacturing apparatus a positive pressure with respect to the outside of the apparatus. If the distance between the blocks is larger than an appropriate value, the amount of gas necessary to make the positive pressure as described above increases, which is not suitable from the viewpoint of energy saving.

Patent Document 1 does not disclose any of the above-mentioned points.

The present invention is made in view of the above-mentioned reasons, and its object is to make a semiconductor manufacturing apparatus which is composed of a plurality of blocks arranged side by side on the floor of a clean room, and performs predetermined processing on a substrate to be processed, with a small number of people and a short time. time setting. [Technical means to solve the problem]

The present invention solves the above-mentioned problems and provides a method for setting up a semiconductor manufacturing apparatus. The semiconductor manufacturing apparatus is constituted by arranging a plurality of blocks on the ground to perform predetermined processing on a substrate to be processed. The setting method for the semiconductor manufacturing apparatus is characterized by: To include: a setting procedure for setting the first block at a predetermined position on the ground; a transport procedure for transporting the second block to a target position based on the first block set at the predetermined position, a predetermined area on the ground within a predetermined distance; a mobile device installation program, the mobile devices are plural, and have a support part that supports the predetermined position of the second block, so that the support part can be placed on a predetermined plane parallel to the ground in-plane movement, and the support part is moved in a height direction perpendicular to the ground, and the plurality of mobile devices are respectively installed in the predetermined position; the in-plane adjustment procedure is based on the second block in the predetermined plane relative to the The information of the position of the target position enables the supporting parts of the plurality of mobile devices to move synchronously to adjust the position of the second block in the predetermined plane; the height adjustment program, according to the height of the second block relative to the height The information of the position of the target position in the direction makes the support parts of the plurality of mobile devices move synchronously to adjust the position of the second block in the height direction; and the inclination adjustment program is based on the second block The inclination information of the plurality of mobile devices makes the supporting parts of the plurality of mobile devices move individually to adjust the inclination of the second block.

In the installation method of the semiconductor manufacturing apparatus of the present invention, the above-mentioned moving device is used to perform the position adjustment of the second block or the inclination adjustment of the second block based on the first block, so that a small number of people can be used. And the semiconductor manufacturing equipment is installed in a short time.

The in-plane adjustment procedure may also include the following procedures: displaying the position on the display part according to the information of the position of the second block relative to the target position in the predetermined plane; The support portion of the mobile device moves within the predetermined plane.

The in-plane adjustment procedure may also include the following procedure: according to the information of the position of the second block relative to the target position in the predetermined plane, to determine the moving direction and the moving amount of the support portion in the predetermined plane; The determined moving direction and the moving amount of the supporting portion allow the supporting portions of all the mobile devices to move within the predetermined plane.

The height adjustment program may also include the following program: display the position on the display part according to the information of the position of the second block relative to the target position in the height direction; The support part of the mobile device moves in the height direction.

The height adjustment procedure may also include the following procedure: according to the position information of the second block relative to the target position in the height direction, to determine the movement direction and movement amount of the support part in the height direction; The moving direction and the moving amount of the support part are determined, so that the support parts of all the mobile devices move in the height direction.

The inclination adjustment program may also include: an inclination display program, which displays the inclination-related information on the display part according to the inclination information of the second block; in response to an operation on the operation part, the plurality of moving parts are moved. The support part of a part of the device moves in the height direction.

The inclination display program can also display the inclination degree in color.

The inclination adjustment procedure may also include the following procedure: according to the inclination information, to determine the mobile device to move the support part in the height direction, and to determine the movement direction and movement of the determined support part of the mobile device amount; according to the determined moving direction and the moving amount of the supporting portion, the determined supporting portion of the mobile device is moved.

In the transport process, the second block may be mounted on a transport device that moves on the ground, and transported.

A device installation program may also be included; the device is used to obtain: the information of the position of the second block relative to the target position in the predetermined plane, and the information of the second block relative to the target position in the height direction location information.

A device installation program may also be included; the device is used to obtain: information on the inclination of the second block.

In another aspect, according to the present invention, there is provided a program for causing a setting system to execute the setting method of the semiconductor manufacturing apparatus, and then running on a computer that controls a control unit of the setting system.

In addition, according to this invention from another viewpoint, the computer recording medium which can read and store this program is provided.

In addition, in another aspect, the present invention is an installation system of a semiconductor manufacturing apparatus; the installation system of the semiconductor manufacturing apparatus constituted by arranging a plurality of blocks on the ground, characterized by comprising: an apparatus for obtaining position information for obtaining Information on the position of the second block in a predetermined plane parallel to the ground relative to the target position based on the first block, and the second block in the height direction perpendicular to the predetermined plane relative to the target information on the position of the position; a level measuring device for obtaining information on the inclination of the second block; a plurality of mobile devices having a support part supporting a predetermined position of the second block, so that the support part can be Move within the predetermined plane, and move the support portion in the height direction, the plurality of moving devices are respectively installed at the predetermined position; and a control device for controlling the position information acquisition device, the level measuring device, and the plurality of A mobile device is made to perform the following procedures: an in-plane adjustment procedure, setting the first block at a predetermined position on the ground, and transporting the second block to the target position within a predetermined distance from the target position In a predetermined area on the ground, after the plurality of mobile devices are respectively installed at the predetermined place, according to the information of the position of the second block relative to the target position in the predetermined plane, make the support parts of the plurality of mobile devices moving synchronously to adjust the position of the second block in the predetermined plane; a height adjustment program, according to the position information of the second block relative to the target position in the height direction, to make the plurality of mobile devices the supporting part moves synchronously to adjust the position of the second block in the height direction; and the inclination adjustment program, according to the information of the inclination of the second block, makes the supporting parts of the plurality of mobile devices individually Move to adjust the inclination of the second block. [Inventive effect]

According to the present invention, the semiconductor manufacturing apparatus, which consists of a plurality of blocks arranged side by side on the floor of the clean room, performs predetermined processing on the substrate to be processed, and can be installed with a small number of people and in a short period of time.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. In addition, in this specification and drawings, the same code|symbol is attached|subjected to the element which has substantially the same functional structure, and a repeated description is abbreviate|omitted.

First, a description will be given of a semiconductor manufacturing apparatus that is installed by the installation method of the present invention and that performs predetermined processing on a wafer. FIG. 1 is an explanatory diagram showing an outline of the internal configuration of a coating and developing processing system 1 which is an example of a semiconductor manufacturing apparatus. 2 and 3 are a front view and a rear view showing an outline of the internal structure of each coating and developing treatment system 1 .

A coating and developing processing system 1, as shown in FIG. 1, for example, is a cassette station block (hereinafter referred to as a CS block) 2 for sending the cassettes C in and out between the outside and the outside. A processing station block (hereinafter referred to as a PS block) 3 of a plurality of various processing apparatuses for predetermined processing, an interface station block (hereinafter referred to as an interface station block for transferring wafer W between the PS block 3 and an adjacent exposure apparatus 4) It is an IF block) 5, which are arranged side by side on the floor of the clean room (refer to the symbol F in FIG. 5), and are constituted by integral connection. Furthermore, hereinafter, the connecting direction of the above-mentioned blocks of the coating and developing processing system 1 is referred to as the front-rear direction or the Y direction, and the direction perpendicular to the front-rear direction in a predetermined plane parallel to the floor of the clean room is referred to as the left-right direction or the left-right direction. In the X direction, the vertical direction of the predetermined plane is referred to as the height direction or the Z direction. In addition, the predetermined surface parallel to the said ground surface means, for example, a horizontal surface, and therefore, the said predetermined surface is demonstrated below as a horizontal surface. Further, the coating and developing processing system 1 includes a control unit 6 that controls the coating and developing processing system 1 .

The CS block 2 is divided into, for example, a cassette feeding and feeding section 10 and a wafer transport section 11 . For example, the cassette feeding and feeding part 10 is provided at the end of the coating and developing processing system 1 on the negative side in the Y direction (the left side in FIG. 1 ). The cassette feeding-out section 10 is provided with a cassette mounting table 12 . On the cassette mounting table 12, a plurality of, for example, four mounting plates 13 are provided. The mounting plates 13 are arranged in a row in the X direction (the vertical direction in FIG. 1 ). These placing plates 13 can place the cassettes C when the cassettes C are sent in and out to the outside of the coating and developing processing system 1 .

As shown in FIG. 1 , the wafer conveyance unit 11 is provided with a wafer conveyance device 21 that freely moves on the conveyance path 20 extending in the X direction. The wafer transfer device 21 is also freely movable in the height direction and around the vertical axis (theta direction), and can transfer the cassette C on each mounting plate 13 and the transfer device of the block G3 of the PS block 3 to be described later. Wafer W.

The PS block 3 includes a plurality of, for example, four blocks G1, G2, G3, and G4 including various devices. For example, the front side of the PS block 3 (the negative side in the X direction in FIG. 1 ) is provided with the block G1 ; the back side of the PS block 3 (the positive side in the X direction in FIG. 1 ) is provided with the block G2 . In addition, the CS block 2 side of the PS block 3 (the negative side in the Y direction in FIG. 1 ) is provided with a block G3; the IF block 5 side of the PS block 3 (the positive side in the Y direction in FIG. 1 ) is provided with Block G4.

The block G1, as shown in FIG. 2, is sequentially configured with: a plurality of liquid processing devices, such as the developing processing device 30 for developing the wafer W, and coating the wafer W with a photoresist solution to form a photoresist film The photoresist coating device 31 .

For example, three developing treatment devices 30 and photoresist coating devices 31 are arranged in parallel in the horizontal direction. Furthermore, the number and arrangement of these developing treatment devices 30 and photoresist coating devices 31 can be arbitrarily selected.

These development processing apparatuses 30 and photoresist coating apparatuses 31 perform, for example, a spin coating method of coating a predetermined processing liquid on the wafer W. In the spin coating method, for example, a process liquid is sprayed onto the wafer W from a coating nozzle, and the wafer W is rotated to spread the process liquid on the surface of the wafer W. In addition, the structure of the photoresist coating apparatus 31 is mentioned later.

For example, the block G2, as shown in FIG. 3, is provided with a heat treatment device 40 for performing heat treatment such as heating or cooling the wafer W, or a peripheral exposure device 41 for exposing the outer peripheral portion of the wafer W in parallel in the vertical and horizontal directions. . The number and arrangement of these heat treatment devices 40 and peripheral exposure devices 41 can be arbitrarily selected.

The block G3 is provided with a plurality of transmission devices 50 . In addition, in the block G4, a plurality of transfer devices 60 are provided, and a defect inspection device 61 is provided thereon. In addition, the structure of the defect inspection apparatus 61 is mentioned later.

As shown in FIG. 1 , a wafer transfer area D is formed in the area surrounded by the blocks G1 to G4 . In the wafer transfer area D, for example, a wafer transfer device 70 is arranged.

The wafer transfer device 70 has, for example, a transfer arm 70a that is freely movable in the Y direction, the front-rear direction, the θ direction, and the vertical direction. The wafer transfer device 70 moves in the wafer transfer area D, and can transfer the wafer W to predetermined devices in the surrounding block G1, block G2, block G3, and block G4. For example, as shown in FIG. 3 , a plurality of wafer transfer devices 70 are arranged up and down, and the wafers W can be transferred to a predetermined device having the same height as each of the blocks G1 to G4 , for example.

In addition, the wafer transfer area D is provided with a shuttle transfer device 71 that transfers the wafer W linearly between the block G3 and the block G4.

The shuttle 71 is free to move linearly, for example, in the Y direction in FIG. 3 . The shuttle transfer device 71 moves in the Y direction while supporting the wafer W, and can transfer the wafer W between the transfer device 50 of the block G3 and the transfer device 60 of the block G4 of the same height.

As shown in FIG. 1 , on the positive side of the block G3 in the X direction, a wafer transfer device 72 is provided. The wafer transfer device 72 has, for example, a transfer arm 72a that is freely movable in the front-rear direction, the θ direction, and the vertical direction. The wafer transfer device 72 moves up and down while supporting the wafer W, and can transfer the wafer W to each transfer device 50 in the block G3.

The IF block 5 is provided with a wafer transport device 73 and a transfer device 74 . The wafer transfer device 73 has, for example, a transfer arm 73a that is freely movable in the Y direction, the θ direction, and the vertical direction. The wafer transfer device 73 supports the wafer W by, for example, a transfer arm 73a, and can transfer the wafer W among the transfer devices 60, the transfer device 74, and the exposure device 4 in the block G4.

In addition, the CS block 2, the PS block 3 and the IF block 5 of the coating and developing processing system 1 are respectively below, as shown in FIG. 2 and FIG. Feet 80. The foot 80 is a so-called adjustable foot, and its height can be adjusted arbitrarily.

The control unit 6 is, for example, a computer, and has a program storage unit (not shown). The program storage unit stores programs for controlling the operation of the above-mentioned various processing devices or driving systems such as conveying devices, and controlling the processing of the wafers W in the coating and developing processing system 1 . Furthermore, the aforementioned program is stored in a computer-readable recording medium H such as a computer-readable hard disk (HD), a floppy disk (FD), a compact disk (CD), a magneto-optical disk (MO), a memory card, etc., It can also be mounted on the control unit 6 from the recording medium H.

Next, wafer processing by the coating and developing processing system 1 will be described.

In the wafer processing using the coating and developing processing system 1 , first, the wafer W is taken out from the cassette C on the cassette mounting table 12 by the wafer transport device 21 , and transported to the transfer device 50 of the PS block 3 .

Next, the wafer W is transported by the wafer transport device 70 to the heat treatment device 40 of the block G2 for temperature adjustment. Then, the wafer W is transported to the photoresist coating device 31 in the block G1 to form a photoresist film on the wafer W. Then, the wafer W is transported to the heat treatment apparatus 40 and subjected to a pre-bake process (PAB: Pre-Applied Bake). In addition, the same heat treatment is performed in the pre-baking treatment, the PEB treatment in the subsequent stage, and the post-baking treatment. However, the heat treatment apparatuses 40 used for each heat treatment are different from each other.

Then, the wafer W is transported to the peripheral exposure device 41 and subjected to peripheral exposure processing. Next, the wafer W is transported to the exposure apparatus 4 and subjected to exposure processing in a predetermined pattern.

Next, the wafer W is transported to the thermal processing apparatus 40 and subjected to PEB processing. Then, the wafer W is transported to, for example, the development processing apparatus 30 and subjected to development processing. After the development process is completed, the wafer W is transported to the heat treatment apparatus 40 and subjected to a post-baking process. The wafer W is transported to the defect inspection apparatus 61, and the defect inspection of the wafer W is performed. In the defect inspection, inspection is carried out for the presence or absence of scratches and foreign matter adhesion. Then, the wafer W is transported to the cassette C of the mounting plate 13 to complete a series of photolithography procedures.

(1st Embodiment) Next, the installation system which belongs to the 1st Embodiment of this invention is demonstrated. The setting system is a setting method for a coating and developing processing system. FIG. 4 is an explanatory diagram showing an outline of the configuration of the installation system 100 according to the first embodiment. The setting system 100 is used for the setting method of the coating and developing processing system 1. For example, the CS block 2, which is the “first block” of the present invention, which is set at a predetermined position, can be set at the target position based on it. PS block 3 as "Second block". The installation system 100 includes an imaging device 200 , a distance measuring device 210 , a plurality of level measuring devices 220 , a plurality of moving devices 300 , and a control device 400 .

The imaging device 200 captures the target mark (not shown) formed on the surface of the CS block 2 on the PS block 3 side, that is, the back surface 2a, and is captured by an image processing camera using, for example, a CMOS (Complementary Metal Oxide Semiconductor) sensor. It is configured and installed in a predetermined position of PS block 3. The imaging result of the imaging device 200 is used to obtain the information of the position of the PS block 3 relative to the target position in the X direction and the Z direction. In other words, the camera device 200 is a device for acquiring information of the X-direction position of the PS block 3 relative to the target position, that is, a device for acquiring X-direction position information, and is used for acquiring the PS block 3 relative to the target position A device for information about the position in the Z direction, that is, a device for obtaining position information in the Z direction. The target mark captured by the camera 200 is, for example, a perfect circle. When the PS block 3 is arranged at the target position, it is formed at a position where the optical axis of the camera 200 coincides with the center of the target mark.

The distance measuring device 210 measures the distance from the PS block 3 to the CS block 2, specifically, measures the distance from the front surface 3a to the back surface 2a of the CS block 2 on the side of the CS block 2 of the PS block 3, It is composed of, for example, a triangulation ranging sensor, and is installed at a predetermined position of the PS block 3 . The measurement result of the distance measuring device 210 is used to obtain the information of the Y-direction position of the PS block 3 relative to the target position. In other words, the distance measuring device 210 is a device for obtaining the information of the Y-direction position of the PS block 3 relative to the target position, that is, a device for obtaining the Y-direction position information. Furthermore, the distance measuring device 210 may be installed in the CS block 2, and a plurality of numbers may be provided to utilize the average value of the distance measurement results.

The level measuring device 220 measures the level, that is, the inclination of the predetermined measurement positions P1A to P1D of the PS block 3 , and is composed of, for example, an acceleration sensor, and is installed in the predetermined direction at the measurement positions P1A to P1D. The measurement position P1A is the position of the positive side in the X direction and the negative side in the Y direction of the PS block 3; the measurement position P1B is the position of the positive side in the X direction and the positive side in the Y direction of the PS block 3; the measurement position P1C is the position of the PS The position of the negative side in the X direction and the negative side in the Y direction of the block 3; the measurement position P1D is the position of the negative side in the X direction and the positive side in the Y direction of the PS block 3. Hereinafter, the horizontal measuring devices 220 placed at the measurement positions P1A to P1D are respectively referred to as horizontal measuring devices 220A to 220D.

The moving device 300 moves the PS block 3 and is mounted on the predetermined mounting positions P2A to P2D of the PS block 3 in a predetermined direction. The installation position P2A is the position on the positive side in the X direction and the negative side in the Y direction of the PS block 3; the installation position P2B is the position on the positive side in the X direction and the positive side in the Y direction of the PS block 3; the installation position P2C, It is the negative end of the PS block 3 in the X direction and is the position of the negative side in the Y direction; the installation position P2D is the position of the negative end of the PS block 3 in the X direction and the positive side in the Y direction. Hereinafter, the mobile devices 300 placed at the mounting positions P2A to P2D are respectively referred to as mobile devices 300A to 300D.

Furthermore, the number of the mobile device 300 and the level measuring device 220 is not limited to four, and may also be three depending on the installation location. In addition, the number of the mobile devices 300 and the number of the level measuring devices 220 may also be different from each other.

FIG. 5 is a side view showing the outline of the configuration of the mobile device 300A. The mobile device 300A, as shown in FIG. 5 , has a support portion 310 abutting against the bottom surface of the PS block 3 to support the PS block 3 . Moreover, the moving apparatus 300A has the XYZ stage 320 which moves the support part 310 in the X direction, the Y direction, and the Z direction.

The XYZ stage 320 has, for example, a Z-direction drive device 321 that supports the support portion 310 to move the support portion 310 in the Z-direction; an XY-stage 322 supports the Z-direction drive device 321 and moves in the X-direction and the Y-direction. This allows the Z-direction driving device 321 , that is, the supporting portion 310 to move in the X-direction and the Y-direction. The XY stage 322 can be moved in the X direction and the Y direction by an XY direction driving device not shown. In addition, in this example, the driving method of the Z-direction driving device 321 and the XY-direction driving device is a method using an electric linear actuator including a ball screw, but it may also be a method using a hydraulic cylinder or the like. ,other methods. In this example, the XY stage 322 supports the Z-direction drive device 321 that supports the support portion 310 , but the XY stage 322 may support the support portion 310 and the Z-direction drive device 321 supports the XY stage 322 .

The mobile device 300A also has a base 330 supporting the XYZ stage 320 on the floor F of the clean room. Furthermore, the mobile device 300A includes a grip portion 340 that the operator holds when moving the mobile device 300A, and wheels (not shown) for allowing the operator to easily move the mobile device 300A.

The mobile devices 300B to 300D have the same configuration as the mobile device 300A. However, the mobile devices 300A and 300B are mounted in the predetermined directions at the predetermined positions P2A and P2B of the PS block 3 and have the gripping portion 340 on the positive side in the X direction. However, the mobile devices 300C and 300D are attached to In a state of being attached to the predetermined positions P2C and P2D of the PS block 3 in a predetermined direction, the grip portion 340 is provided at a position on the negative side in the X direction.

Return to the description of FIG. 4 . The control device 400 controls the camera device 200, the distance measuring device 210, the level measuring devices 220A-220D and the mobile devices 300A-300D, and the camera device 200, the distance measuring device 210, the level measuring devices 220A-220D and the mobile devices 300A- 300D, which is connected in a communicable manner. For this communication, a well-known wireless communication technology such as wireless local area network or Bluetooth (registered trademark) communication is used.

The control device 400 is composed of, for example, a personal computer, and includes a control unit 410 , a display unit 420 , and an operation unit 430 . The control unit 410 is composed of a CPU (Central Processing Unit) or the like, and controls the entire control device 400 . The display unit 420 is constituted by, for example, a flat-panel image display panel such as a liquid crystal display and an organic EL display. The display unit 420 may also be provided with a touch panel. The operation unit 430 is composed of buttons, direction keys, a touch panel provided in the display unit 420 , or a combination of these components.

Next, an installation method of the coating and developing processing system 1 using the installation system 100 will be described. FIG. 6 is a flowchart of an example of the main procedure of the pertaining setting method. 8 , 10 and 12 are exemplary views of the screens displayed on the display unit 420 when the coating and developing processing system 1 is installed according to the corresponding installation method. 7 , 9 and 11 are flowcharts showing examples of an in-plane position adjustment program, a height adjustment program, and an inclination adjustment program, which will be described later, in the installation method.

First, the CS block 2 is installed at a predetermined position on the floor F of the clean room in a predetermined direction, and the inclination of the CS block 2 is adjusted (step S1 ).

Next, the PS block 3 is transported to a predetermined area on the ground F within a predetermined distance from the target position based on the CS block 2 installed at the predetermined position by manual operation by a plurality of operators (step S2) . The above-mentioned predetermined distance refers to the distance that can be moved by the XY stage 322 of the moving devices 300A-300D, for example, 10-30 mm. Furthermore, even if the subsequent processing must be performed by an operator, it can be performed by one operator.

After step S2, the operator installs the imaging device 200 and the distance measuring device 210 at a predetermined position (step S3).

Next, the operator installs a plurality of mobile devices 300 on the PS block 3 (step S4). Specifically, the operator installs the mobile devices 300A to 300D on the predetermined positions P2A to P2D of the PS block 3 , respectively. During installation, for example, the mobile devices 300A to 300D are moved in a state where the support parts 310 of the mobile devices 300A to 300D are most lowered, and the support parts 310 are inserted under the PS block 3 . Next, the operator lifts the support unit 310 to support the PS block 3 with the mobile devices 300A to 300D. The lifting of the support portion 310 can be performed, for example, through the operation portion 430 of the control device 400 . Then, the operator shortens the height of the foot 80 so that the foot 80 will not interfere with the ground F when the position and inclination of the PS block 3 are adjusted.

After step S4, the operator installs plural level measuring devices 220 on the PS block 3 (step S5). Specifically, the operator installs the level measuring devices 220A to 220D on the predetermined measurement positions P1A to P1D of the PS block 3, respectively (step S5). The sequence of the procedure of step S3, the procedure of step S4, and the procedure of step S5 is arbitrary.

The control device 400 calculates the information of the position of the PS block 3 relative to the target position in the horizontal plane by using the imaging result of the camera device 200 and the distance measurement result of the distance measuring device 210, and according to the information, makes the plurality of mobile devices 300A- 300D The supporting part 310 of the synchronously moves to adjust the position of the PS block 3 in the horizontal plane (step S6 ).

In the position adjustment procedure in the horizontal plane in step S6, as shown in FIG. 7, the control device 400 obtains the information of the position of the PS block 3 relative to the target position in the horizontal plane, that is, the X direction of the PS block 3 relative to the target position information of the position and the position in the Y direction (step S61). The Y-direction position of the PS block 3 relative to the target position can be calculated according to the ranging result of the ranging device 210. Specifically, it can be calculated from the above-mentioned ranging result and the Y-coordinate value (for example, 5 mm) of the above-mentioned target position. come out. In addition, the X-direction position of the PS block 3 relative to the target position can be calculated according to the ranging result of the ranging device 210 and the imaging result of the camera device 200 . 200 In the obtained camera image, the offset between the target mark and the center of the camera image in the X direction is calculated.

Next, the control device 400 displays, for example, the screen I1 shown in FIG. 8 on the display unit 420 according to the information of the position of the PS block 3 relative to the target position in the horizontal plane (step S62 ). The picture I1 shows: the current position of the PS block 3 relative to the target position in the horizontal plane, that is, the current position of the PS block 3 relative to the target position in the X direction, and the current position of the PS block 3 relative to the target position The current position in the Y direction. The operator can know from the screen I1 of this example that in order to make the PS block 3 at the target position in the horizontal plane, the PS block 3 must be moved to the positive side of the Y direction, that is, the direction close to the CS block 2. PS block 3 is moved to the positive side in the X direction.

The operator judges whether the PS block 3 is located at the target position in the horizontal plane according to the screen I1 (step S63 ). In the case of being at the target position (in the case of yes), the operator presses the end button (not shown) to end the position adjustment procedure in the horizontal plane. On the other hand, if it is not located at the target position (the case of No), the operator, according to the screen I1, selects the PS area to be placed in the negative X direction, the positive X direction, the negative Y direction, and the positive Y direction. In the direction in which the block 3 moves, press the corresponding button (step S64). Next, the control device 400, in response to the pressing, moves the support parts 310 of the mobile devices 300A-300D synchronously by the XY stage 322 to move the PS block 3 in the selected direction by a predetermined distance (step S65). The distance moved in response to one push of the button, that is, the predetermined distance described above is preliminarily recorded in a recording unit (not shown).

Then, the steps after step S61 are performed again. In step S63, when it is judged that the PS block 3 is in the target position within the horizontal plane, the position adjustment procedure in the horizontal plane ends.

After the position adjustment procedure in the horizontal plane in step S6, the control device 400 calculates the height direction of the PS block 3 relative to the target position by using the imaging result of the camera device 200 and the distance measurement result of the distance measuring device 210 (in this example: vertical direction) position information, according to the information, the support parts 310 of the plurality of mobile devices 300A-300D are moved synchronously to adjust the position of the PS block 3 in the height direction (step S7).

In the height adjustment procedure of step S7, as shown in FIG. 9, the information of the position of the PS block 3 relative to the height direction of the target position, that is, the information of the position of the PS block 3 relative to the Z direction of the target position ( Step S71). The Z-direction position of the PS block 3 relative to the target position can be calculated according to the distance measurement result of the distance measuring device 210 and the imaging result of the camera device 200 . In the camera image, the offset between the target mark and the center of the camera image in the Z direction is calculated.

Next, the control device 400 displays, for example, the screen I2 shown in FIG. 10 on the display unit 420 according to the information of the Z-direction position of the PS block 3 relative to the target position (step S72 ). The screen I2 shows: the current position of the PS block 3 in the Z direction with respect to the target position, that is, the current height of the target height. The operator can know from the screen I2 of this example that in order to position the PS block 3 at the target position in the height direction, the PS block 3 must be moved to the positive side in the Z direction.

The operator determines whether or not the PS block 3 is located at the target position in the height direction based on the screen I2 (step S73 ). In the case of being at the target position (in the case of yes), the operator presses an end button (not shown) to end the height adjustment program. On the other hand, if it is not at the target position (No), the operator, according to the screen I2, selects the direction to move the PS block 3 in the negative Z direction and the positive Z direction, and presses the corresponding button (step S74). Next, the control device 400, in response to the pressing, moves the supporting parts 310 of the mobile devices 300A-300D synchronously by the Z-direction drive mechanism to move the PS block 3 in the selected direction by a predetermined distance (step S75). The distance moved in response to one push of the button, that is, the predetermined distance described above is preliminarily recorded in a recording unit (not shown).

Then, the steps after step S71 are performed again. In step S73, when it is judged that the PS block 3 is located at the target position in the height direction, the height adjustment process is ended.

After the height adjustment procedure in step S7, the control device 400, according to the measurement results of the level measuring devices 220A-220D, moves the supporting parts 310 of the mobile devices 300A-300D individually to adjust the inclination of the PS block 3 (step S8). ).

In the inclination adjustment procedure of step S8, as shown in FIG. 11 , the inclinations among the measurement positions P1A to P1D of the PS block 3 are obtained from the level measuring devices 220A to 220D installed in the measurement positions P1A to P1D. information (step S81).

Next, the control device 400 displays, for example, the screen I3 shown in FIG. 12 on the display unit 420 according to the information of the inclination among the measurement positions P1A to P1D of the PS block 3 (step S82 ). In this screen I3, the degree of inclination among the measurement positions P1A to P1D is displayed in color. For example, the measurement position whose inclination is within the allowable range is displayed in blue (white in the figure), and the measurement position whose inclination is outside the allowable range is displayed in blue (white in the figure). However, the measurement positions within the predetermined range are displayed in yellow (light gray in the figure), and the measurement positions whose inclination is outside the allowable range and outside the predetermined range are displayed in red (dark gray in the figure). The operator can know from the screen I3 of this example that the inclination must be adjusted for the measurement positions P1A and P1B.

The operator judges whether or not the inclinations of all the measurement positions P1A to P1D are maintained within the allowable range based on the screen I3 (step S83 ). When all are kept within the allowable range (yes), the operator presses the end button (not shown) to end the inclination adjustment process. On the other hand, if it is not kept within the allowable range (no case), the operator selects which of the measurement positions P1A to P1D to adjust the inclination according to the screen I3, and presses the corresponding button (step S84).

Next, the control device 400, in response to the above-mentioned pressing, adjusts the moving device 300 necessary for adjusting the inclination of the measurement position P1 selected by the operator, and the movement device 300 necessary for maintaining the inclination of the selected measurement position P1 within the allowable range. The amount of movement in the Z direction of the support portion 310 is correspondingly displayed on the display portion 420 (step S85 ). The amount of movement in the Z direction is displayed, for example, by the number of times the button for moving the support portion 310 in the Z direction is pressed. The method of determining the moving device 300 necessary for the adjustment of the inclination of the measurement position P1 selected by the operator, or the method of determining the amount of movement in the Z direction of the support portion 310 necessary to keep the inclination within the allowable range, can be, for example, using Those described in Japanese Patent Application Laid-Open No. 2017-73538.

The operator operates the operation part 430 according to the display result of the display part 420, for example, presses the corresponding button according to the number of times displayed on the display screen (step S86). The control device 400, in response to the pressing, moves the supporting portion 310 of the corresponding mobile device 300 in the positive or negative direction of the Z direction to adjust the inclination of the PS block 3 (step S87). In addition, the moving distance of the support portion 310 in the Z direction is the distance corresponding to the number of times of pressing, and the distance corresponding to one pressing is recorded in advance in a recording portion (not shown).

Then, the steps after step S81 are performed again. In step S83, when it is judged that the inclinations of all the measurement positions P1A to P1D are maintained within the allowable range, the inclination adjustment routine is terminated.

Next, the operator extends the feet 80 of the PS block 3 to the floor F of the clean room, then lowers the support parts 310 of the mobile devices 300A to 300D, and uses the feet 80 to support the PS block 3 in the clean room. Room floor F. The mobile devices 300A to 300D are removed (step S9). Then, the CS block 2 and the PS block 3 are fixed with bolts and nuts to complete the setting of the PS block 3.

The IF block 5 is set, and the inclination of the IF block 5 is adjusted (step S10). In this way, the installation process of the coating and developing process system of this embodiment is completed.

According to the present embodiment, the position adjustment of the PS block 3 in the X direction, the Y direction, and the Z direction, or the adjustment of the inclination of the PS block 3 is performed by using the support portion that supports the PS block 3 in the X direction and the Y direction. It is carried out by the moving device 300 that moves in the Z direction, so that the coating and developing processing system 1 can be installed with a small number of people and in a short period of time.

In addition, according to the present embodiment, since the moving device 300 is attached to the PS block 3 in a freely attachable and detachable manner, it can also be used when other coating and developing processing systems are installed. As for the camera device 200 , the distance measuring device 210 , and the level measuring device 220 , they can also be freely attached and detached, so that these components can also be used in the setting of other coating and developing processing systems. As for the target mark photographed by the imaging device 200, it is also formed in a freely attachable and detachable manner, so it can also be used in the setting of other coating and developing processing systems.

In addition, according to the present embodiment, the inclination of each of the measurement positions P1A to P1D of the PS block 3 is displayed in color, so the operator can intuitively judge whether the inclination of all the measurement positions P1A to P1D is maintained within the allowable range. , or the measurement positions P1A~P1D where the inclination should be adjusted.

(Second Embodiment) In the first embodiment, the position adjustment, height adjustment, and inclination adjustment in the horizontal plane were performed in response to the operator's operation, that is, manually. However, in this embodiment, these Adjustments will be made automatically.

In the setting method of the coating and developing processing system 1 pertaining to the present embodiment, for example, after performing steps S1 to S5 in the setting method of the first embodiment, when the operator presses the "AUTO" button displayed on the display unit 420, the control device 400, Position adjustment, height adjustment, and inclination adjustment of PS block 3 in the horizontal plane are automatically performed. When these adjustments are completed, the control device 400 displays, for example, a "FINISH" message indicating completion on the display unit 420 in order to inform the operator of this.

The installation method according to the present embodiment and the installation method according to the first embodiment differ only in the horizontal plane position adjustment procedure in step S6, the height adjustment procedure in step S7, and the inclination adjustment procedure in step S8, so only these procedures will be described. . 13 to 15 are flowcharts of examples of the in-plane position adjustment program, the height adjustment program, and the inclination adjustment program, respectively, which belong to the present embodiment.

In the position adjustment procedure in the horizontal plane pertaining to this embodiment, as shown in FIG. 13 , the information of the position of the PS block 3 relative to the target position in the horizontal plane, that is, the X-direction position of the PS block 3 relative to the target position and Information of the Y-direction position (step S101).

Next, the control device 400 determines whether the PS block 3 is located at the target position in the horizontal plane according to the obtained information of the position in the horizontal plane (step S102 ). In the case of being at the target position (in the case of yes), the control device 400 ends the position adjustment procedure in the horizontal plane. On the other hand, in the case of not being located at the target position (the case of NO), the control device 400, according to the information of the position of the PS block 3 relative to the target position in the horizontal plane, in the negative direction of the X direction, the positive direction of the X direction, and the direction of the Y direction Among the negative direction and the positive direction of the Y direction, the direction in which the support part 310 is to be moved is selected (step S103). Furthermore, when the PS block 3 is offset from the target position in either the X direction or the Y direction, the direction with the largest offset from the target position, for example, is selected as the direction to move the support portion 310 .

The control device 400 calculates the offset between the PS block 3 and the target position in the selected direction, that is, the movement amount of the support portion 310 required for the PS block 3 to be located at the target position in the selected direction (step S104 ) .

Next, the control device 400 moves the support parts 310 of all the mobile devices 300A to 300D in the horizontal plane according to the selected moving direction of the support part 310 and the calculated movement amount, that is, to make all the mobile devices 300A to 300D move in the horizontal plane. The support part 310 of 300D moves in the selected moving direction by the calculated moving amount (step S105).

Then, the steps after step S101 are performed again. In step S102, when it is determined that the PS block 3 is at the target position within the horizontal plane, the control device 400 ends the position adjustment procedure in the horizontal plane.

In the height adjustment program of the present embodiment, as shown in FIG. 14 , the control device 400 obtains information on the position of the PS block 3 relative to the height direction of the target position, that is, the Z of the PS block 3 relative to the target position information on the direction and position (step S111).

Next, the control device 400 determines whether the PS block 3 is located at the target position in the height direction according to the information of the Z direction position of the PS block 3 relative to the target position (step S112 ). In the case of being at the target position (yes), the control device 400 ends the height adjustment procedure. On the other hand, in the case of not being located at the target position (the case of No), the control device 400, according to the information of the Z-direction position of the PS block 3 relative to the target position, selects the desired Z-direction between the Z-direction negative direction and the Z-direction positive direction. The direction in which the support portion 310 is moved (step S113).

The control device 400 calculates the offset between the PS block 3 and the target position in the Z direction, that is, the movement amount of the support portion 310 required to locate the PS block 3 in the Z direction at the target position (step S114 ).

Next, the control device 400 moves the supporting parts 310 of all the mobile devices 300A to 300D in the height direction according to the selected moving direction of the supporting part 310 and the calculated movement amount, that is, all the mobile devices 300A to 300D are moved in the height direction. The support part 310 of 300D moves in the selected moving direction by the calculated moving amount (step S115).

Then, the steps after step S111 are performed again. In step S112, when it is determined that the PS block 3 is located at the target position in the height direction, the control device 400 ends the height adjustment program.

Furthermore, in the horizontal plane position adjustment program and the height adjustment program pertaining to this embodiment, there are cases where the calculated movement amount of the support portion 310 does not match the actual movement amount of the PS block 3 . In this case, it is better to move the support part 310 by a small amount, calculate the corresponding relationship between the calculated movement amount of the support part 310 and the actual movement amount of the PS block 3, and feed back the calculation result of the corresponding relationship, That is, the movement amount of the support portion 310 is corrected according to the calculated correspondence.

In the inclination adjustment program pertaining to the present embodiment, as shown in FIG. 15 , the control device 400 acquires each of the measurement positions P1A to 220D of the PS block 3 from the level measuring devices 220A to 220D attached to the measurement positions P1A to P1D. Information of the inclination in P1D (step S121).

Next, the control device 400 determines whether the inclinations of all the measurement positions P1A to P1D are kept within the allowable range according to the information of the inclinations among the measurement positions P1A to P1D of the PS block 3 (step S122 ). When all are kept within the allowable range (yes), the control device 400 ends the inclination adjustment process. On the other hand, if it is not kept within the allowable range (the case of no), the control device 400 selects the measurement position from any of the measurement positions P1A to P1D according to the information of the inclination among the measurement positions P1A to P1D of the PS block 3 Select the object of inclination adjustment in the selection (step S123). For example, the control device 400 selects the measurement position where the inclination is most deviated from the allowable range as the inclination adjustment object.

Next, the control device 400 determines the moving device 300 necessary to adjust the inclination of the selected measurement position P1 (step S124). For the support unit 310 of the mobile device 300 determined in this step S124, the moving direction and the moving amount necessary to keep the inclination of the selected measurement position P1 within the allowable range are determined (step S125).

Next, the control device 400 moves the supporting part 310 of the mobile device 300 determined in step S124 according to the moving direction and the amount of movement of the supporting part 310 determined in step S125 , that is, the mobile device 300 determined in step S124 is moved. The supporting portion 310 moves in the moving direction of the supporting portion 310 determined in step S125 by the amount of movement determined in step S125 (step S126).

Then, the steps after step S121 are performed again. In step S122, when it is determined that the inclinations of all the measurement positions P1A to P1D are maintained within the allowable range, the control device 400 ends the inclination adjustment routine.

According to the present embodiment, the position adjustment of the PS block 3 in the X direction, the Y direction, and the Z direction, or the adjustment of the inclination of the PS block 3 is performed by using the support portion that supports the PS block 3 in the X direction and the Y direction. Since the moving device 300 to move in the Z direction is performed automatically, the coating and developing processing system 1 can be installed with a small number of people and in a shorter time than in the first embodiment.

(Variation of the first and second embodiments) FIG. 16 is an explanatory diagram of another example of the transfer procedure of the PS block 3 . In the above-mentioned example, in the transport process of the PS block 3, the PS block 3 was transported by a plurality of operators with bare hands. However, the transport method of the PS block 3 is not limited to this method, and as shown in FIG. 16 , a plurality of transport devices 500 may be used for transport. The transport device 500 supports the PS block 3 with the upper surface 500a, and has a running mechanism (not shown) composed of wheels or the like. The conveyance device 500 can be moved on the clean room ground in a state where the PS block 3 is mounted by the above-described travel mechanism under the control of the control device 400 (see FIG. 4 ).

Taking advantage of the situation of the transport device 500 , in the above-mentioned transport procedure of the PS block 3 , first, the PS block 3 is mounted on the plurality of transport devices 500 . After mounting, the operator operates the control device 400 to transport the PS block 3 to a predetermined position.

According to this example, since the conveyance time of the PS block 3 can be shortened, the time required for installation of the coating and developing processing system 1 can be further shortened. In addition, it is possible to reduce the number of workers during the transfer procedure.

Furthermore, it is preferable that the conveying apparatus 500 has a lift mechanism for raising and lowering the upper surface 500a. This is because the PS block 3 can be mounted on the transport device 500 with a small number of people. In addition, the transport device 500 and the mobile device 300 may also be integrated.

In the above description, the height adjustment and the inclination adjustment are each performed once, but may be performed alternately multiple times. In addition, in the above description, the position adjustment in the horizontal plane is performed before the height adjustment and the inclination adjustment, but it may be performed after the height adjustment and the inclination adjustment. In addition, in the above description, the position adjustment in the horizontal plane or the height adjustment is performed after the installation of the level measuring device, but the position adjustment in the horizontal plane can be performed as long as the installation of the level measuring device is before the adjustment of the inclination. or after height adjustment.

Even in the above description, the distance measuring device 210 is used to obtain the information of the position of the PS block 3 . However, the distance measuring device 210 can also be installed at the corner of the PS block 3 before the transportation process of the PS block 3. During transportation, when the measurement result of the distance measuring device 210 is below the predetermined value, the be informed by sound. This prevents the PS block 3 from colliding with a wall or the like when the PS block 3 is being transported. In particular, when an operator uses the transport device 500 to transport the PS block 3, the operator's field of vision is limited, so the PS block 3 may collide during transport. However, by adopting the above-mentioned configuration, the PS block 3 can be prevented from colliding with a wall or the like even if it is transported by one person.

Furthermore, the setting or inclination adjustment of the CS block 2 or the IF block 5 can also be applied to the setting method of the present embodiment. In addition, the CS block 2 is divided into the cassette feed-in/out unit 10 and the wafer conveyance unit 11 as described above, so the setting or inclination adjustment of the cassette feed-in/out unit 10 or the wafer conveyance unit 11 can also be applied. This embodiment belongs to the setting method.

The embodiments of the present invention have been described above, but the present invention is not limited to the examples. A person with ordinary knowledge in the technical field can think of various modifications or amendments within the scope of the technical idea described in the scope of the patent application, and understand that they belong to the technical scope of the present invention.

For example, in the above-mentioned embodiment, the semiconductor manufacturing apparatus has been described as a coating and developing processing system, but the semiconductor manufacturing apparatus to which the present invention is applied is not limited to the coating and developing processing system. [Industrial applicability]

The present invention can be used for installation techniques of semiconductor manufacturing apparatuses such as coating and developing processing systems.

1‧‧‧Coating and developing processing system 2‧‧‧Cassette station block (CS block) 2a‧‧‧Back 3‧‧‧Processing station block (PS block) 3a‧‧‧Front 4‧‧‧Exposure Device 5‧‧‧Interface Station Block (IF Block) 6‧‧‧Control Section 10‧‧‧Cassette Feeding and Sending Section 11‧‧‧Wafer Conveying Section 12‧‧‧Cassette Mounting Table 13‧‧‧ Mounting Plate 20‧‧‧Transportation Path 21‧‧‧Wafer Transporting Device 30‧‧‧Development Processing Device 31‧‧‧Resist Coating Device 40‧‧‧Heat Treatment Device 41‧‧‧Peripheral Exposure Device 50, 60‧‧ ‧Transfer device 61‧‧‧Defect inspection device 70‧‧‧Wafer transportation device 70a‧‧‧Transport arm 71‧‧‧Shuttle transportation device 72‧‧‧Wafer transportation device 72a‧‧‧Transfer arm 73‧‧‧Wafer Circular conveying device 73a‧‧‧conveying arm 74‧‧‧transmission device 80‧‧‧foot 100‧‧‧installation system 200‧‧‧camera device 210‧‧‧distance measuring device 220, 220A～220D‧‧‧horizontal amount Measuring device 300, 300A～300D‧‧‧Moving device 310‧‧‧Support part 320‧‧‧XYZ stage 321‧‧‧Z direction driving device 322‧‧‧XY stage 330‧‧‧Base 340‧‧‧Grip part 400‧‧‧Control device 410‧‧‧Control part 420‧‧‧Display part 430‧‧‧Operating part 500‧‧‧Conveying device 500a‧‧‧Top C‧‧‧Cassette D‧‧‧Wafer conveying area F ‧‧‧Ground G1～G4‧‧‧Block H‧‧‧Recording medium I1～3‧‧‧Screen P1, P1A～P1D‧‧‧Measurement location P2, P2A～P2D‧‧‧Installation location W‧‧‧Crystal round

FIG. 1 is a plan view showing the outline of the configuration of the coating and developing processing system pertaining to the present embodiment. FIG. 2 is a front view showing the outline of the configuration of the coating and developing processing system pertaining to the present embodiment. FIG. 3 is a rear view showing the outline of the configuration of the coating and developing processing system according to the present embodiment. FIG. 4 is an explanatory diagram showing the outline of the configuration of the installation system used in the coating and developing treatment system installation method according to the first embodiment. FIG. 5 is a side view showing an outline of the configuration of the mobile device. FIG. 6 is a flowchart showing an example of a main procedure of a method for setting up a coating and developing processing system pertaining to the first embodiment. FIG. 7 is a flowchart of an example of an in-plane position adjustment procedure. FIG. 8 is a diagram showing an example of a screen displayed at the time of installation in the method for setting up the coating and developing processing system pertaining to the first embodiment. FIG. 9 is a flowchart of an example of a height adjustment procedure. FIG. 10 is a diagram showing another example of a screen displayed at the time of installation in the method of setting up the coating and developing processing system pertaining to the first embodiment. FIG. 11 is a flowchart of an example of an inclination adjustment procedure. FIG. 12 is a diagram showing another example of a screen displayed at the time of installation in the method of setting up the coating and developing processing system pertaining to the first embodiment. FIG. 13 is a flowchart showing another example of the in-plane position adjustment program. FIG. 14 is a flowchart showing another example of the height adjustment procedure. FIG. 15 is a flowchart showing another example of the inclination adjustment routine. FIG. 16 is an explanatory diagram of a modification of the first and second embodiments.

2‧‧‧CS block (box station block)

2a‧‧‧Back

3‧‧‧PS block (processing station block)

3a‧‧‧front

100‧‧‧Setting up the system

200‧‧‧Camera Installation

210‧‧‧Ranging device

220, 220A~220D‧‧‧level measuring device

300, 300A~300D‧‧‧Mobile device

400‧‧‧Controls

410‧‧‧Control Department

420‧‧‧Display

430‧‧‧Operation Department

P1, P1A~P1D‧‧‧Measurement position

P2, P2A~P2D‧‧‧Installation position

Claims (14)

A method for setting up a semiconductor manufacturing apparatus, the semiconductor manufacturing apparatus is constituted by arranging a plurality of blocks on the ground, so as to perform predetermined processing on a substrate to be processed; 1 block is set at a predetermined position on the ground; in the transportation process, the second block is transported to the target position based on the first block set at the predetermined position, and is located on the ground within a predetermined distance a predetermined area; a mobile device installation program, with a plurality of mobile devices, the mobile devices have a support part supporting the predetermined position of the second block, and the support part can be moved in a predetermined plane parallel to the ground, and moving the support part in a height direction perpendicular to the ground, and installing the plurality of moving devices at the predetermined position; an in-plane adjustment procedure, according to the position of the second block relative to the target position in the predetermined plane information to make the support parts of the plurality of mobile devices move synchronously to adjust the position of the second block in the predetermined plane; a height adjustment program, according to the second block relative to the target in the height direction The information of the position of the position enables the supporting parts of the plurality of mobile devices to move synchronously to adjust the position of the second block in the height direction; and an inclination adjustment program, according to the inclination of the second block information to move the support parts of the plurality of mobile devices individually to adjust the inclination of the second block. According to the method for setting up a semiconductor manufacturing apparatus according to claim 1, the in-plane adjustment procedure includes the following procedure: displayed on the display part; in response to the operation performed on the operation part, the supporting parts of all the mobile devices are moved within the predetermined plane. The method for setting up a semiconductor manufacturing apparatus of claim 1, wherein the in-plane adjustment procedure includes the following procedure: determining the in-plane position according to the information of the position of the second block relative to the target position in the predetermined plane the moving direction and the moving amount of the supporting portion in the predetermined plane; according to the determined moving direction and the moving amount of the supporting portion, the supporting portions of all the mobile devices are moved in the predetermined plane. The method for setting up a semiconductor manufacturing apparatus according to any one of the claims 1 to 3, wherein the height adjustment procedure includes the following procedure: according to the position of the second block relative to the target position in the height direction information, the position is displayed on the display part; in response to the operation on the operation part, the support part of all the mobile devices is moved in the height direction. The method for setting up a semiconductor manufacturing apparatus according to any one of the claims 1 to 3, wherein the height adjustment procedure includes the following procedure: according to the position of the second block relative to the target position in the height direction information to determine the moving direction and the moving amount of the supporting portion in the height direction; according to the determined moving direction and the moving amount of the supporting portion, the supporting portions of all the mobile devices are moved in the height direction. The method for setting up a semiconductor manufacturing apparatus according to any one of the claims 1 to 3 of the claimed scope, wherein the inclination adjustment program includes: an inclination display procedure, which, according to the inclination information of the second block, displays the inclination The degree-related information is displayed on the display part; in response to the operation performed on the operation part, the support part of a part of the plurality of mobile devices is moved in the height direction. The method for setting up a semiconductor manufacturing apparatus according to claim 6, wherein the inclination display program displays the inclination degree in color. The method for setting up a semiconductor manufacturing apparatus according to any one of the claims 1 to 3 of the claimed scope, wherein the inclination adjustment procedure includes the following procedure: according to the inclination information, it is determined to move the support portion in the height direction the mobile device, and determine the determined movement direction and movement amount of the support portion of the mobile device; according to the determined movement direction and movement amount of the support portion, make the determined support portion move. The method for setting up a semiconductor manufacturing apparatus according to any one of claims 1 to 3 of the scope of the application, wherein, in the transporting process, the second block is mounted on a transporting device moving on the ground and transported. The method for setting up a semiconductor manufacturing device according to any one of the claims 1 to 3 of the scope of the application, further comprising a device installation procedure for installing a device; the device is used to obtain: the second block is on the predetermined surface information of the position relative to the target position within the second block, and information of the position of the second block relative to the target position in the height direction. The method for setting up a semiconductor manufacturing device according to any one of the claims 1 to 3 of the scope of the application, further comprising a device installation procedure for installing a device; the device is used to obtain: the inclination of the second block Information. A program runs on a computer that controls a control unit of a setting system, so that the setting system executes the setting method of a semiconductor manufacturing apparatus according to any one of claims 1 to 11 of the claimed scope. A readable computer recording medium storing the program as claimed in item 12 of the scope of the patent application. An installation system of a semiconductor manufacturing apparatus, the semiconductor manufacturing apparatus is constituted by arranging a plurality of blocks on the ground, the setting system is characterized by comprising: a position information acquisition device for acquiring a second block parallel to the ground information on the position of the predetermined plane relative to the target position based on the first block, and information on the position of the second block relative to the target position in the height direction perpendicular to the predetermined plane; horizontal measuring device , used to obtain the information of the inclination of the second block; a plurality of mobile devices have a support part supporting a predetermined position of the second block, so that the support part can move in the predetermined plane and make the support part The part moves in the height direction, and the plurality of mobile devices are respectively installed at the predetermined position; and the control device controls the device for obtaining position information, the level measuring device, and the plurality of mobile devices to perform the following procedures: An in-plane adjustment program is to set the first block at a predetermined position on the ground, transport the second block to a predetermined area on the ground within a predetermined distance from the target position, and the plurality of The mobile devices are respectively installed at the predetermined positions, and thereafter, according to the information of the position of the second block relative to the target position in the predetermined plane, the supporting parts of the plurality of mobile devices are moved synchronously, so as to adjust the position of the mobile devices in the predetermined plane. the position of the second block in the predetermined plane; the height adjustment program, according to the information of the position of the second block relative to the target position in the height direction, to make the support parts of the plurality of mobile devices move synchronously, to adjust the position of the second block in the height direction; and an inclination adjustment program, according to the information of the inclination of the second block, to move the support parts of the plurality of mobile devices individually to adjust the first 2 blocks of inclination.

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