JPWO2016111044A1 - 圧電振動部品及びその製造方法 - Google Patents
圧電振動部品及びその製造方法 Download PDFInfo
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- 238000004519 manufacturing process Methods 0.000 title claims description 10
- 239000000758 substrate Substances 0.000 claims abstract description 53
- 239000012790 adhesive layer Substances 0.000 claims abstract description 50
- 230000001070 adhesive effect Effects 0.000 claims abstract description 21
- 239000000853 adhesive Substances 0.000 claims abstract description 19
- 238000007789 sealing Methods 0.000 claims description 10
- 238000000034 method Methods 0.000 claims description 9
- 230000003746 surface roughness Effects 0.000 claims description 9
- 239000011521 glass Substances 0.000 claims description 8
- 238000002844 melting Methods 0.000 claims description 3
- 238000003825 pressing Methods 0.000 claims description 3
- 239000003822 epoxy resin Substances 0.000 description 12
- 229920000647 polyepoxide Polymers 0.000 description 12
- 230000005284 excitation Effects 0.000 description 9
- 239000013078 crystal Substances 0.000 description 6
- 239000000463 material Substances 0.000 description 4
- 229910052720 vanadium Inorganic materials 0.000 description 4
- 239000002131 composite material Substances 0.000 description 3
- 229920003986 novolac Polymers 0.000 description 3
- LEONUFNNVUYDNQ-UHFFFAOYSA-N vanadium atom Chemical compound [V] LEONUFNNVUYDNQ-UHFFFAOYSA-N 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 229920006332 epoxy adhesive Polymers 0.000 description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000005488 sandblasting Methods 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 238000005411 Van der Waals force Methods 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000001588 bifunctional effect Effects 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 125000000623 heterocyclic group Chemical group 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- AFEQENGXSMURHA-UHFFFAOYSA-N oxiran-2-ylmethanamine Chemical compound NCC1CO1 AFEQENGXSMURHA-UHFFFAOYSA-N 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000009832 plasma treatment Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 150000003681 vanadium Chemical class 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/10—Mounting in enclosures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/10—Mounting in enclosures
- H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
- H03H9/1014—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device
- H03H9/1021—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device the BAW device being of the cantilever type
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
- H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/88—Mounts; Supports; Enclosures; Casings
- H10N30/883—Additional insulation means preventing electrical, physical or chemical damage, e.g. protective coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
- H03H2003/022—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks the resonators or networks being of the cantilever type
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- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Abstract
Description
図1は、本発明の実施形態に係る圧電振動部品40の分解斜視図である。同図に示すように、圧電振動部品40は、主に、圧電振動子20と、圧電振動子20が実装される主面11を有する基板10と、圧電振動子20を外気から密閉するためのリッド30とを備えている。圧電振動子20は、厚み方向に対向する二つの面を有する平板状の圧電板21と、圧電板21の一方の面に形成された励振電極22と、圧電板21の他方の面に形成された励振電極23とを備えている。励振電極22,23に交流電圧を印加すると、圧電板21は、厚みすべりモードで振動する。圧電板21は、圧電特性を示す圧電材質(例えば、水晶板や圧電セラミックスなど)からなる。励振電極22,23は、例えば、金、クロム、ニッケル、アルミニウム、チタン等の導電性薄膜からなる。
11…主面
12…導電性接着剤
13…配線
14…切欠き部
15…導電性接着剤
16…配線
17…切欠き部
18…側面
20…圧電振動子
21…圧電板
22…励振電極
23…励振電極
30…リッド
31…凹部
32…フランジ部
33…縁部
40…圧電振動部品
51…接着層
52…接着層
53…接着層
Claims (5)
- 圧電振動子を実装する主面を有する基板と、
前記主面に対向するように開口された凹部を有するリッドと、
前記圧電振動子を前記凹部と前記主面との間の空間に密閉封止するように前記基板と前記リッドとを接合する接着層とを備え、
前記接着層は、前記基板の主面から側面にかけて前記基板の少なくとも一部を被覆するように形成されている、圧電振動部品。 - 請求項1に記載の圧電振動部品であって、
前記側面の表面粗さは、前記主面の表面粗さより粗い、圧電振動部品。 - 請求項1又は請求項2に記載の圧電振動部品であって、
前記接着層は、低融点ガラス接着剤である、圧電振動部品。 - 圧電振動子が実装される主面を有する基板を準備する工程と、
前記主面に対向するように開口された凹部を有するリッドを準備する工程と、
前記基板の主面から側面にかけて前記基板の少なくとも一部を被覆するように形成された接着層を介して前記圧電振動子を前記凹部と前記主面との間の空間に密閉封止する工程と、
を備える圧電振動部品の製造方法。 - 請求項4に記載の圧電振動部品の製造方法であって、
前記圧電振動子を密封封止する工程において、前記リッド及び前記基板の少なくとも一方を互いに対向する向きに押圧することを含む、圧電振動部品の製造方法。
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JP2015002485 | 2015-01-08 | ||
JP2015002485 | 2015-01-08 | ||
PCT/JP2015/075309 WO2016111044A1 (ja) | 2015-01-08 | 2015-09-07 | 圧電振動部品及びその製造方法 |
Publications (2)
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JPWO2016111044A1 true JPWO2016111044A1 (ja) | 2017-09-07 |
JP6607408B2 JP6607408B2 (ja) | 2019-11-20 |
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Country Status (4)
Country | Link |
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US (1) | US10715104B2 (ja) |
JP (1) | JP6607408B2 (ja) |
CN (1) | CN107112973B (ja) |
WO (1) | WO2016111044A1 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2018117243A (ja) * | 2017-01-18 | 2018-07-26 | 株式会社村田製作所 | 圧電振動子及びその製造方法 |
JP2018117286A (ja) * | 2017-01-19 | 2018-07-26 | 株式会社村田製作所 | 圧電振動子及びその製造方法 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10163369A (ja) * | 1996-12-03 | 1998-06-19 | Hitachi Ltd | 半導体装置及びその製造方法 |
JP2002176116A (ja) * | 2000-12-05 | 2002-06-21 | Daishinku Corp | 電子部品用パッケージの気密封止方法 |
WO2010074127A1 (ja) * | 2008-12-24 | 2010-07-01 | 株式会社大真空 | 圧電振動デバイス、圧電振動デバイスの製造方法、および圧電振動デバイスを構成する構成部材のエッチング方法 |
JP2012074937A (ja) * | 2010-09-29 | 2012-04-12 | Seiko Epson Corp | 圧電デバイス、及び圧電デバイスの製造方法 |
JP2013192052A (ja) * | 2012-03-14 | 2013-09-26 | Nippon Dempa Kogyo Co Ltd | 水晶デバイス及びその製造方法。 |
JP2014183359A (ja) * | 2013-03-18 | 2014-09-29 | Nippon Dempa Kogyo Co Ltd | 水晶振動子 |
JP2014197617A (ja) * | 2013-03-29 | 2014-10-16 | 日本電波工業株式会社 | 電子デバイス及びその製造方法 |
Family Cites Families (3)
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JP3755564B2 (ja) * | 1999-05-24 | 2006-03-15 | 株式会社村田製作所 | 圧電共振部品及びその製造方法 |
JP2013051512A (ja) * | 2011-08-30 | 2013-03-14 | Nippon Dempa Kogyo Co Ltd | 水晶振動子 |
JP2014197615A (ja) | 2013-03-29 | 2014-10-16 | 日本電波工業株式会社 | 電子デバイス及びその製造方法 |
-
2015
- 2015-09-07 JP JP2016568273A patent/JP6607408B2/ja active Active
- 2015-09-07 CN CN201580072237.3A patent/CN107112973B/zh active Active
- 2015-09-07 WO PCT/JP2015/075309 patent/WO2016111044A1/ja active Application Filing
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2017
- 2017-06-15 US US15/623,606 patent/US10715104B2/en active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10163369A (ja) * | 1996-12-03 | 1998-06-19 | Hitachi Ltd | 半導体装置及びその製造方法 |
JP2002176116A (ja) * | 2000-12-05 | 2002-06-21 | Daishinku Corp | 電子部品用パッケージの気密封止方法 |
WO2010074127A1 (ja) * | 2008-12-24 | 2010-07-01 | 株式会社大真空 | 圧電振動デバイス、圧電振動デバイスの製造方法、および圧電振動デバイスを構成する構成部材のエッチング方法 |
JP2012074937A (ja) * | 2010-09-29 | 2012-04-12 | Seiko Epson Corp | 圧電デバイス、及び圧電デバイスの製造方法 |
JP2013192052A (ja) * | 2012-03-14 | 2013-09-26 | Nippon Dempa Kogyo Co Ltd | 水晶デバイス及びその製造方法。 |
JP2014183359A (ja) * | 2013-03-18 | 2014-09-29 | Nippon Dempa Kogyo Co Ltd | 水晶振動子 |
JP2014197617A (ja) * | 2013-03-29 | 2014-10-16 | 日本電波工業株式会社 | 電子デバイス及びその製造方法 |
Also Published As
Publication number | Publication date |
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CN107112973A (zh) | 2017-08-29 |
CN107112973B (zh) | 2020-11-13 |
WO2016111044A1 (ja) | 2016-07-14 |
US10715104B2 (en) | 2020-07-14 |
JP6607408B2 (ja) | 2019-11-20 |
US20170288637A1 (en) | 2017-10-05 |
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