JPWO2014087635A1 - 電子機器収納装置の冷却システム及び電子機器収納建屋の冷却システム - Google Patents
電子機器収納装置の冷却システム及び電子機器収納建屋の冷却システム Download PDFInfo
- Publication number
- JPWO2014087635A1 JPWO2014087635A1 JP2014550921A JP2014550921A JPWO2014087635A1 JP WO2014087635 A1 JPWO2014087635 A1 JP WO2014087635A1 JP 2014550921 A JP2014550921 A JP 2014550921A JP 2014550921 A JP2014550921 A JP 2014550921A JP WO2014087635 A1 JPWO2014087635 A1 JP WO2014087635A1
- Authority
- JP
- Japan
- Prior art keywords
- electronic device
- refrigerant
- rack
- cooling system
- server
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/208—Liquid cooling with phase change
- H05K7/20818—Liquid cooling with phase change within cabinets for removing heat from server blades
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B23/00—Machines, plants or systems, with a single mode of operation not covered by groups F25B1/00 - F25B21/00, e.g. using selective radiation effect
- F25B23/006—Machines, plants or systems, with a single mode of operation not covered by groups F25B1/00 - F25B21/00, e.g. using selective radiation effect boiling cooling systems
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/06—Control arrangements therefor
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20718—Forced ventilation of a gaseous coolant
- H05K7/20736—Forced ventilation of a gaseous coolant within cabinets for removing heat from server blades
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/208—Liquid cooling with phase change
- H05K7/20809—Liquid cooling with phase change within server blades for removing heat from heat source
Abstract
Description
2 吸気口
3 排気口
4 蒸発器
5 凝縮器
6 サーバラック
7 温度センサ
8 蒸気管
9 凝縮管
10 循環FAN
11 凝縮室
12 凝縮FAN
13 タンク
14 熱交換器接続管
15 タンク接続管
16 冷媒
17 移動式プレート
18 タンク固定プレート
19 流体制御バルブ
Claims (8)
- 電子機器と、前記電子機器を載置する複数段の載置棚とで構成されるラックを備え、前記ラックには内部に冷媒を有する蒸発器が搭載され、前記ラックの外部には前記蒸発器と配管で接続された凝縮部が設置され、前記蒸発器内の冷媒面の高さを調整する冷媒調整手段を備えることを特徴とした電子機器収納装置の冷却システム。
- 前記熱交換器の蒸発器には冷媒を貯蔵するタンクを備える請求項1に記載の電子機器収納装置の冷却システム。
- 前記冷媒面の高さを調整する冷媒調整手段は、前記タンクの高さを調節する手段を有したことを特徴とする請求項2に記載の電子機器収納装置の冷却システム。
- 前記冷媒面の高さを調整する冷媒調整手段は、それぞれが前記凝縮部に接続し、かつ前記タンクの異なる高さに接続した複数の流体制御装置が設けられたことを特徴とする請求項2に記載の電子機器収納装置の冷却システム。
- 前記ラックの温度を検知する温度センサを設け、その結果に応じて前記冷媒面の高さを調整する冷媒調整手段を制御することを特徴とする請求項1から4のいずれかに記載の電子機収納装置の温度調整システム。
- 電子機器と、前記電子機器を載置する複数段の載置棚とで構成されるラックを備え、前記ラックは前記ラックを複数台収納する建屋に配置され、前記建屋には外気を吸気、排気する複数個の吸気口、排気口が設けられ、前記ラックには内部に冷媒を有する蒸発器と、前記ラックの外部に前記蒸発器と配管で接続された凝縮部が設置され、前記蒸発器内の冷媒面の高さを調整する冷媒調整手段を備えることを特徴とする電子機器収納建屋の冷却システム。
- 前記電子機器収納建屋の排気口には送風機が設置されていることを特徴とした請求項6に記載の電子機器収納建屋の冷却システム。
- 前記ラックの温度を検知する温度センサを設け、その結果に応じて前記電子機器収納建屋の送風機出力と、冷媒調整手段を制御することを特徴とした請求項6または7に記載の電子機器収納建屋の冷却システム。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012264430 | 2012-12-03 | ||
JP2012264430 | 2012-12-03 | ||
PCT/JP2013/007069 WO2014087635A1 (ja) | 2012-12-03 | 2013-12-03 | 電子機器収納装置の冷却システム及び電子機器収納建屋の冷却システム |
Publications (1)
Publication Number | Publication Date |
---|---|
JPWO2014087635A1 true JPWO2014087635A1 (ja) | 2017-01-05 |
Family
ID=50883077
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014550921A Pending JPWO2014087635A1 (ja) | 2012-12-03 | 2013-12-03 | 電子機器収納装置の冷却システム及び電子機器収納建屋の冷却システム |
Country Status (10)
Country | Link |
---|---|
US (1) | US9693485B2 (ja) |
EP (1) | EP2927778A4 (ja) |
JP (1) | JPWO2014087635A1 (ja) |
KR (1) | KR20150091506A (ja) |
CN (1) | CN104838329A (ja) |
AU (1) | AU2013356152B2 (ja) |
BR (1) | BR112015012796A2 (ja) |
IN (1) | IN2015DN03895A (ja) |
SG (1) | SG11201504298TA (ja) |
WO (1) | WO2014087635A1 (ja) |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6904704B2 (ja) * | 2014-08-27 | 2021-07-21 | 日本電気株式会社 | 相変化冷却装置および相変化冷却方法 |
US9552025B2 (en) * | 2014-09-23 | 2017-01-24 | Google Inc. | Cooling electronic devices in a data center |
JP5869646B1 (ja) | 2014-10-17 | 2016-02-24 | Necプラットフォームズ株式会社 | 冷媒供給装置および冷却装置および冷却システム |
CN105987468A (zh) * | 2015-02-06 | 2016-10-05 | 深圳易信科技股份有限公司 | 机房应急制冷装置 |
WO2016147615A1 (ja) * | 2015-03-13 | 2016-09-22 | 日本電気株式会社 | 冷媒供給装置、それを用いた相変化冷却装置、および冷媒供給方法 |
US10448543B2 (en) * | 2015-05-04 | 2019-10-15 | Google Llc | Cooling electronic devices in a data center |
CN106304752A (zh) * | 2015-05-19 | 2017-01-04 | 王玉富 | 一种适用于服务器分层配置的相变换热机柜 |
ES2877516T3 (es) * | 2015-10-21 | 2021-11-17 | Vertiv Corp | Sistemas de enfriamiento para salas de equipos pequeños y procedimientos de enfriamiento de salas de equipos pequeños |
US10349561B2 (en) | 2016-04-15 | 2019-07-09 | Google Llc | Cooling electronic devices in a data center |
CN105910600A (zh) * | 2016-06-14 | 2016-08-31 | 冯青元 | 微区域导航系统及其方法 |
CN105919301B (zh) * | 2016-06-17 | 2018-02-06 | 胡江 | 基于物联网的储米柜及其控制方法 |
JP6304420B1 (ja) * | 2017-03-23 | 2018-04-04 | 日本電気株式会社 | 冷媒分配装置、冷却装置及び冷媒分配装置における冷媒分配方法 |
JP6733630B2 (ja) * | 2017-09-13 | 2020-08-05 | 株式会社デンソー | サーモサイフォン |
US11359865B2 (en) * | 2018-07-23 | 2022-06-14 | Green Revolution Cooling, Inc. | Dual Cooling Tower Time Share Water Treatment System |
KR101995512B1 (ko) * | 2019-03-22 | 2019-07-02 | 엘제이테크 주식회사 | 산업용 기기의 냉각 장치 |
USD982145S1 (en) | 2020-10-19 | 2023-03-28 | Green Revolution Cooling, Inc. | Cooling system enclosure |
USD998770S1 (en) | 2020-10-19 | 2023-09-12 | Green Revolution Cooling, Inc. | Cooling system enclosure |
US11812587B2 (en) * | 2021-05-03 | 2023-11-07 | Microsoft Technology Licensing, Llc | Computer cooling |
US11805624B2 (en) | 2021-09-17 | 2023-10-31 | Green Revolution Cooling, Inc. | Coolant shroud |
US11925946B2 (en) | 2022-03-28 | 2024-03-12 | Green Revolution Cooling, Inc. | Fluid delivery wand |
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JPS643447A (en) * | 1987-03-12 | 1989-01-09 | Takenaka Komuten Co | Cooling system |
JPH02259312A (ja) * | 1989-03-31 | 1990-10-22 | Nippon Steel Corp | 液体燃料の燃焼制御方法および装置 |
JPH05312361A (ja) * | 1991-11-20 | 1993-11-22 | Furukawa Electric Co Ltd:The | 空調システム |
JP2002199300A (ja) * | 2000-12-26 | 2002-07-12 | Matsushita Electric Ind Co Ltd | 画像データ送信方法、表示方法および画像データ送信装置 |
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JP2013065227A (ja) * | 2011-09-20 | 2013-04-11 | Hitachi Ltd | サーバラックの冷却システム及びサーバ機器 |
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-
2013
- 2013-12-03 SG SG11201504298TA patent/SG11201504298TA/en unknown
- 2013-12-03 WO PCT/JP2013/007069 patent/WO2014087635A1/ja active Application Filing
- 2013-12-03 CN CN201380063005.2A patent/CN104838329A/zh active Pending
- 2013-12-03 JP JP2014550921A patent/JPWO2014087635A1/ja active Pending
- 2013-12-03 IN IN3895DEN2015 patent/IN2015DN03895A/en unknown
- 2013-12-03 BR BR112015012796A patent/BR112015012796A2/pt not_active IP Right Cessation
- 2013-12-03 EP EP13860412.9A patent/EP2927778A4/en not_active Withdrawn
- 2013-12-03 KR KR1020157017796A patent/KR20150091506A/ko not_active Application Discontinuation
- 2013-12-03 AU AU2013356152A patent/AU2013356152B2/en not_active Expired - Fee Related
- 2013-12-03 US US14/646,599 patent/US9693485B2/en not_active Expired - Fee Related
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
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JPS643447A (en) * | 1987-03-12 | 1989-01-09 | Takenaka Komuten Co | Cooling system |
JPH02259312A (ja) * | 1989-03-31 | 1990-10-22 | Nippon Steel Corp | 液体燃料の燃焼制御方法および装置 |
JPH05312361A (ja) * | 1991-11-20 | 1993-11-22 | Furukawa Electric Co Ltd:The | 空調システム |
JP2002199300A (ja) * | 2000-12-26 | 2002-07-12 | Matsushita Electric Ind Co Ltd | 画像データ送信方法、表示方法および画像データ送信装置 |
JP2003194291A (ja) * | 2001-12-25 | 2003-07-09 | Bridgestone Corp | スチールワイヤ用オイル塗布装置 |
JP2011224863A (ja) * | 2010-04-20 | 2011-11-10 | Seiko Epson Corp | 製膜装置および製膜方法 |
WO2012029404A1 (ja) * | 2010-08-31 | 2012-03-08 | 日本電気株式会社 | 電子機器冷却システム |
JP2013065227A (ja) * | 2011-09-20 | 2013-04-11 | Hitachi Ltd | サーバラックの冷却システム及びサーバ機器 |
Also Published As
Publication number | Publication date |
---|---|
WO2014087635A1 (ja) | 2014-06-12 |
AU2013356152A1 (en) | 2015-05-28 |
US9693485B2 (en) | 2017-06-27 |
EP2927778A4 (en) | 2016-08-03 |
CN104838329A (zh) | 2015-08-12 |
SG11201504298TA (en) | 2015-07-30 |
EP2927778A1 (en) | 2015-10-07 |
BR112015012796A2 (pt) | 2017-07-11 |
US20150305209A1 (en) | 2015-10-22 |
AU2013356152B2 (en) | 2017-07-27 |
IN2015DN03895A (ja) | 2015-10-02 |
KR20150091506A (ko) | 2015-08-11 |
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