WO2012029404A1 - 電子機器冷却システム - Google Patents
電子機器冷却システム Download PDFInfo
- Publication number
- WO2012029404A1 WO2012029404A1 PCT/JP2011/065337 JP2011065337W WO2012029404A1 WO 2012029404 A1 WO2012029404 A1 WO 2012029404A1 JP 2011065337 W JP2011065337 W JP 2011065337W WO 2012029404 A1 WO2012029404 A1 WO 2012029404A1
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- WIPO (PCT)
- Prior art keywords
- electronic device
- condenser
- evaporator
- cooling system
- heat
- Prior art date
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
- H05K7/20663—Liquid coolant with phase change, e.g. heat pipes
- H05K7/20681—Liquid coolant with phase change, e.g. heat pipes within cabinets for removing heat from sub-racks
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
Definitions
- the present invention relates to an electronic device cooling system for cooling air heated by exhaust heat of the electronic device.
- the rack mount system is a system in which flat electronic devices standardized by JIS and EIA are installed in a stack in a rack.
- the height of electronic devices such as 1U (unit) servers and blade servers, which are generally called rack mount servers, is about 40 millimeters.
- an LSI Large Scale Integration
- an IC Integrated Circuit
- a method for cooling an electronic device a method of providing a heat transfer structure such as a heat pipe in the electronic device and a heat dissipation structure such as a fin at the end of the heat transfer structure is used (for example, see Patent Document 1). ). With this configuration, heat can be transferred to a place away from the LSI or IC by the heat transfer structure, and can be radiated to the outside of the electronic device via the heat dissipation structure.
- Patent Document 2 discloses a cooling system.
- a first heat transport member that transports heat generated by a semiconductor device to the outside is provided on an electronic circuit board of an electronic device.
- a second heat transport member that transports heat from the first heat transport member to the outside is provided in the housing of the electronic device.
- a heat radiating member for radiating heat from the second heat transport member to the outside of the housing is provided.
- Patent Document 3 discloses that the second heat transport member and the heat radiating member may constitute a refrigeration cycle.
- Patent Document 3 discloses a method of disposing an evaporator constituting a refrigeration cycle that cools the heat dissipated by an electronic device in a rack in which the electronic device including a fan that dissipates the generated heat is disposed.
- the exhaust heat of the electronic device is cooled by an evaporator provided in the server rack, thereby suppressing an increase in the air temperature of the server room in which the electronic device is placed. it can.
- the refrigerant vaporized by the evaporator is compressed between the condenser and the evaporator for cooling the refrigerant, and the refrigerant is circulated between the condenser and the evaporator. It is necessary to provide a compressor to be used. As a result, there is a problem that the cooling device becomes large.
- the electronic device cooling system of the present invention cools air heated by exhaust heat of the electronic device, and includes an evaporator, a condenser, a gas flow path, and a liquid flow path.
- the evaporator is provided in the air sending direction by the electronic device, and absorbs the heat of the air sent from the electronic device to cause the liquid refrigerant to phase change to the gaseous refrigerant.
- the condenser releases the heat of the gaseous refrigerant and causes the gaseous refrigerant to phase change to the liquid refrigerant.
- the gas flow path allows the gas refrigerant phase-changed by the evaporator to flow into the condenser.
- the liquid flow path allows the liquid refrigerant phase-changed by the condenser to flow into the evaporator.
- the condenser is disposed above the evaporator.
- the evaporator since the evaporator exchanges heat with the heat of the air sent from the electronic device, the temperature of the air heated by the exhaust heat of the electronic device is lowered, and the air temperature of the room where the electronic device is placed Can be suppressed. Furthermore, since the condenser is disposed above the evaporator, the liquid level inside the condenser is higher than the liquid level inside the evaporator. Thereby, the liquid solvent stored inside the condenser travels through the liquid flow path by gravity and flows into the evaporator. On the other hand, the gas solvent stored inside the evaporator travels through the gas flow path by gravity and flows into the condenser. Therefore, the electronic device cooling system according to the present invention can circulate the refrigerant between the condenser and the evaporator without including the compressor.
- 1 is a perspective view of an electronic device cooling system according to a first embodiment of the present invention.
- 1 is a configuration diagram of an electronic device cooling system according to a first embodiment of the present invention. It is a figure which shows the cross section of the evaporator shown in FIG. It is a figure which shows the cross section of the condenser shown in FIG. It is a figure which shows the arrangement
- FIG. 1 is a perspective view of an electronic device cooling system (electronic device cooling device) according to a first embodiment of the present invention.
- the electronic device cooling system is a system that cools air heated by exhaust heat of the electronic device.
- the electronic device cooling system includes a plurality of evaporators 1 and a plurality of condensers 2.
- the evaporator 1 evaporates a refrigerant
- the condenser 2 liquefies the refrigerant stored inside.
- the evaporator 1 is provided in the storage rack 5 that stores the electronic device, and cools the air sent from the electronic device by the latent heat of vaporization of the refrigerant.
- the condenser 2 is attached to a position higher than the evaporator 1 on the surface of a chilled water pipe 6 (cooling pipe) for an air conditioner provided in a data center or a server room storing the storage rack 5.
- the condenser 2 changes the phase of the gaseous refrigerant to a liquid by cooling the refrigerant stored inside. At this time, the temperature of the cold water flowing through the cold water pipe 6 is lower than the boiling point of the refrigerant stored in the condenser 2.
- the cold water pipe 6 to which the condenser 2 is attached is disposed across the data center or server room storing the storage rack 5 and the outside of the data center or server room. That is, at least a part of the cold water pipe 6 is exposed outside the data center or the server room.
- the lower part of the evaporator 1 (lower container) and the lower part of the condenser 2 are connected by a tube 3.
- the upper part (upper container) of the evaporator 1 and the upper part of the condenser 2 are connected by a tube 4.
- the tube 3 functions as a liquid flow path through which the refrigerant that the condenser 2 has changed in phase from gas to liquid flows into the evaporator 1.
- the tube 4 functions as a gas flow path through which the refrigerant whose phase is changed from the liquid to the gas by the evaporator 1 flows into the condenser 2.
- these tubes 3 and 4 are made of a material having flexibility and excellent chemical resistance such as a butyl tube, a silicon tube, a nylon tube, and a fluorine tube.
- a refrigerant having a low boiling point and high insulation properties such as fluorocarbon and hydrofluoroether is used.
- the evaporator 1 and the condenser 2 are connected by a pair of tubes 3 and 4 to form an airtight system.
- the inside of the airtight system formed by the evaporator 1, the condenser 2, and the pair of tubes 3 and 4 is filled with a refrigerant.
- the pressure inside the airtight system is kept lower than the atmospheric pressure. This is achieved by injecting a liquid refrigerant into the airtight system and then reducing the pressure of the airtight system to a vacuum state.
- the boiling point (saturated vapor pressure) of the refrigerant sealed inside decreases.
- the boiling point is not more than room temperature.
- the refrigerant coolant inside the evaporator 1 can be evaporated because the evaporator 1 heat-exchanges with the air warmed by the exhaust heat of an electronic device.
- FIG. 2 is a configuration diagram of the electronic device cooling system according to the first embodiment of the present invention.
- the evaporator 1 is provided in a storage rack 5 that stores the electronic device 7.
- the storage rack 5 includes a casing 51 that forms an outer shell, a plurality of mounting shelves 52 that are provided on the front side of the casing 51 and on which the electronic device 7 is mounted, and are provided on the rear side of the casing 51. A free rear door 53 is provided.
- the evaporator 1 is loaded between the mounting shelf 52 and the rear door 53 of the storage rack 5.
- the electronic device 7 placed on the placement shelf 52 is equipped with a blower for sending the exhaust heat of the electronic device 7 out of the electronic device 7.
- the electronic device 7 is mounted on the mounting shelf 52 so that the air sent from the electronic device 7 is discharged out of the housing 51 through the evaporator 1.
- FIG. 1 shows a state in which the rear door 53 is opened.
- the rear door 53 is closed and the evaporator 1 is covered by the rear door 53.
- the rear door 53 is provided with a plurality of through holes 54 and a plurality of exhaust holes 55.
- the tubes 3 and 4 are inserted through the through holes 54.
- the exhaust hole 55 exhausts the air sent from the electronic device 7 to the outside of the housing 51.
- FIG. 3 is a view showing a cross section of the evaporator 1.
- a gas refrigerant G and a liquid refrigerant L are stored in the evaporator 1.
- the evaporator 1 includes a lower container 11 connected to the tube 3, an upper container 12 connected to the tube 4, and an evaporation tube 13 that connects the lower container 11 and the upper container 12.
- the lower container 11 and the upper container 12 are connected by a plurality of evaporation tubes 13.
- Heat receiving fins 14 are provided between the evaporation tubes 13.
- the heat receiving fin 14 is a corrugated fin or the like, and promotes heat exchange between the air sent from the electronic device 7 and the refrigerant stored in the evaporation tube 13.
- Each component of the evaporator 1 is formed of a metal having high thermal conductivity such as copper or aluminum.
- a portion of the lower container 11 facing the rear door 53 is provided with an inflow hole 15 through which the refrigerant flows from the tube 3.
- a portion of the upper container 12 facing the rear door 53 is provided with an outflow hole 16 through which the refrigerant flows out of the tube 4.
- the heat receiving fins 14 are joined to the evaporation tube 13 by brazing or soldering. By reducing the fin pitch of the heat receiving fins 14 (that is, by narrowing the gap between the fins), it is possible to increase the heat transport amount of latent heat absorbed from the air when the refrigerant evaporates. On the other hand, when the fin pitch of the heat receiving fins 14 is reduced, the ventilation resistance of the air sent from the electronic device 7 increases and the wind speed decreases. For this reason, it is necessary to form fins so that the operating temperature of components such as LSI and IC of the electronic device 7 has a ventilation resistance that does not exceed the allowable temperature.
- FIG. 4 is a view showing a cross section of the condenser 2.
- a gas refrigerant G and a liquid refrigerant L are stored in the condenser 2.
- the condenser 2 is made of a metal having high thermal conductivity such as copper or aluminum.
- an inflow hole 21 through which the refrigerant flows from the tube 4 and an outflow hole 22 through which the refrigerant flows out of the tube 3 are formed.
- a heat radiating fin 23 is screwed to a portion of the inner wall of the condenser 2 facing the cold water pipe 6. The radiating fins 23 promote heat exchange between the cold water flowing through the cold water pipe 6 and the refrigerant stored in the condenser 2.
- the heat radiating fins 23 have a structure that increases the contact area with the refrigerant, such as a plate-type fin or a pin fin structure formed of a metal having high thermal conductivity such as copper or aluminum.
- the condenser 2 is attached to the cold water pipe 6 via a TIM (Thermal Interface Material) 24 in order to increase the efficiency of heat exchange between the heat radiation fins 23 and the cold water pipe 6. That is, the TIM 24 is provided between the condenser 2 and the cold water pipe 6.
- any type of TIM such as a grease type or a sheet type, may be used as long as the thermal conductivity is high.
- the operation of the electronic device cooling system according to the present embodiment will be described.
- the air is discharged outside the storage rack 5 through the evaporator 1 and the rear door 53.
- the heat of the air is transmitted to the evaporation pipe 13 through the heat receiving fins 14 of the evaporator 1.
- the heat transferred to the evaporation pipe 13 increases the temperature of the refrigerant stored in the evaporation pipe 13.
- the internal pressure of the airtight system composed of the evaporator 1, the condenser 2, and the pair of tubes 3 and 4 is lower than the atmospheric pressure.
- the temperature of the refrigerant exceeds the boiling point due to the heat from the heat receiving fins 14, and the liquid refrigerant evaporates.
- the liquid refrigerant absorbs latent heat from the air sent out by the electronic device 7 in order to change into a gas phase. Thereby, the temperature of the air which the electronic device 7 sent out can be lowered
- the liquid refrigerant becomes a gaseous refrigerant by absorbing latent heat.
- the gaseous refrigerant travels through the evaporation pipe 13 by buoyancy and moves to the upper container 12.
- the gaseous refrigerant that has reached the upper container 12 flows out to the tube 4.
- the gaseous refrigerant that has flowed into the tube 4 flows out to the condenser 2 installed above the evaporator 1 by buoyancy.
- the gaseous refrigerant that has flowed into the condenser 2 releases heat to the cold water flowing through the cold water pipe 6 via the radiation fins 23 and the TIM 24 provided inside the condenser 2.
- the temperature of the gas refrigerant is lower than the boiling point, and the gas refrigerant is condensed.
- the gaseous refrigerant gives latent heat to the cold water pipe 6 in order to change into a liquid phase.
- the heat given to the chilled water pipe 6 is transmitted to the chilled water flowing through the chilled water pipe 6, and is discharged out of the data center and the server room by the flow of the chilled water.
- Gas refrigerant becomes liquid refrigerant by giving latent heat. This liquid refrigerant moves below the condenser 2 by gravity. The liquid refrigerant that has reached the lower side of the condenser 2 flows out to the tube 3. The liquid refrigerant flowing into the tube 3 flows out into the lower container 11 of the evaporator 1 installed below the condenser 2 by gravity.
- FIG. 5A and 5B are diagrams showing the arrangement of the tubes 3 and 4.
- the pair of tubes 3 and 4 that connect the evaporator 1 and the condenser 2 desirably do not have a portion that is convexly bent downward with respect to the horizontal line. That is, it is desirable that the tubes 3 and 4 gradually extend downward from the condenser 2 toward the evaporator 1.
- FIG. 5B when the tube 3 is bent downward and convex with respect to the horizontal line, the liquid refrigerant flows in the portion surrounded by the dotted line A against gravity. Therefore, the speed of the refrigerant flowing through the airtight system is lowered, and there is a possibility that the circulation is delayed. Further, as shown in FIG.
- the evaporator 1 exchanges heat with the air warmed by the exhaust heat of the electronic device 7. For this reason, the temperature of air falls and it can suppress the raise of the air temperature of the room in which the electronic device 7 was mounted. Thereby, the cooling capacity by the air-conditioning equipment provided in the data center or the server room can be suppressed, and power saving of the air-conditioning equipment can be achieved.
- the electronic device cooling system according to the present embodiment 40 to 60% of the heat generated by the electronic device 7 could be received. Further, by using the electronic device cooling system according to the present embodiment, the temperature of the air discharged from the storage rack 5 can be reduced by about 15 ° C. at the maximum.
- the liquid level inside the condenser 2 is higher than the liquid level inside the evaporator 1.
- the liquid solvent stored inside the condenser 2 flows through the tube 3 by gravity and flows into the evaporator 1.
- the gas solvent stored inside the evaporator 1 travels through the tube 4 by gravity and flows into the condenser 2. Therefore, the electronic device cooling system can circulate the refrigerant between the condenser 2 and the evaporator 1 without including a compressor.
- the condenser 2 is provided on the surface of the cooling pipe through which cold water having a temperature lower than the boiling point of the refrigerant stored therein circulates. Thereby, the condenser 2 can condense a gaseous refrigerant efficiently.
- the cooling pipe is disposed across the inside of the server room or data center where the electronic device 7 is placed and the outside of the server room or data center. Therefore, the heat released by the condenser 2 into the cold water flowing through the cooling pipe can be discharged to the outside of the server room or the data center.
- the evaporator 1 is provided with the heat receiving fin 14 which accelerates
- the condenser 2 includes the radiation fins 23 that promote heat exchange between the cold water flowing through the cold water pipe 6 and the gaseous refrigerant. Thereby, the condenser 2 can condense a gaseous refrigerant efficiently.
- the tube 3 and the tube 4 have flexibility. Thereby, it is possible to simplify handling when the storage rack 5 is installed or moved, and the rear door 53 of the storage rack 5 can be opened and closed.
- FIG. 6 is a perspective view of an electronic device cooling system according to the second embodiment of the present invention.
- the storage rack 5 of the electronic device cooling system according to the second embodiment does not include the through hole 54 in the rear door 53 and includes the through hole 54 on the side surface of the housing 51.
- the inflow hole and the outflow hole of the evaporator 1 are not provided in the portion facing the rear door 53 of the evaporator 1, and the pair of tubes 3, 4 provided on the side surface of the evaporator 1
- the evaporator 1 and the condenser 2 are connected to each other through the through hole 54. According to the present embodiment, the electronic device cooling system can be applied even when a space for arranging the tubes 3 and 4 cannot be secured on the front surface of the rear door 53.
- FIG. 7 is a perspective view of an electronic device cooling system according to a third embodiment of the present invention.
- the electronic device cooling system according to the third embodiment has the evaporator 1 fixed to the rear door 53 of the storage rack 5.
- FIG. 7 shows a state where the rear door 53 is opened.
- the evaporator 1 faces the blower of the electronic device 7 by closing the rear door 53.
- the evaporator 1 is fixed to the rear door 53. Therefore, as shown in FIG. 7, when the rear door 53 is opened, the electronic device 7 placed on the placement shelf 52 can be taken out. That is, according to this embodiment, the electronic device 7 can be exchanged from either the front or rear of the storage rack 5.
- the condenser 2 is provided in the cooling pipe
- the present invention is not limited to this.
- Other cooling media may be used as long as the heat released from the condenser 2 is discharged outside the server room or data center in which the storage rack 5 is provided.
- the present invention can be applied to an electronic device cooling system.
- this electronic device cooling system the air heated by the exhaust heat of the electronic device can be cooled.
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Abstract
Description
特許文献3には、第2の熱輸送部材及び放熱部材が冷凍サイクルを構成しても良いことが開示されている。
さらに、本発明によれば、凝縮器が蒸発器より上方に配置されるため、凝縮器の内部の液面の高さが蒸発器の内部の液面の高さより高くなる。これにより、凝縮器の内部に貯留する液体溶媒は、重力によって液体流路を伝い、蒸発器へ流入する。他方、蒸発器の内部に貯留する気体溶媒は、重力によって気体流路を伝い、凝縮器へ流入する。そのため、本発明による電子機器冷却システムは、圧縮機を備えなくても、凝縮器と蒸発器との間で冷媒を循環させることができる。
《第1の実施形態》
図1は、本発明の第1の実施形態による電子機器冷却システム(電子機器冷却装置)の斜視図である。
電子機器冷却システムは、電子機器の排熱によって温められた空気を冷却するシステムである。
図1に示すように、電子機器冷却システムは、複数の蒸発器1と複数の凝縮器2とを備える。蒸発器1は、内部に貯留する冷媒と電子機器が送出する空気との熱交換によって冷媒を気化させる。凝縮器2は、内部に貯留する冷媒を液化させる。
蒸発器1は、電子機器を収納する収納ラック5内に設けられ、冷媒の気化潜熱によって電子機器から送出された空気を冷却する。
凝縮器2は、収納ラック5を格納するデータセンタやサーバルームに設けられた空調機用の冷水配管6(冷却管)の表面において、蒸発器1より高い位置に取り付けられる。凝縮器2は、内部に貯留する冷媒を冷却することで気体冷媒を液体に相変化させる。このとき、冷水配管6を流れる冷水の温度は、凝縮器2の内部に貯留する冷媒の沸点より低い。
凝縮器2が取り付けられる冷水配管6は、収納ラック5を格納するデータセンタやサーバルームとそのデータセンタまたはサーバルームの外側とに跨って配設される。即ち、冷水配管6は、少なくともその一部がデータセンタまたはサーバルームの外側に露呈している。
蒸発器1は、電子機器7を収納する収納ラック5内に設けられる。収納ラック5は、外郭を形成する筐体51と、筐体51の前側に設けられて電子機器7を載置するための複数の載置棚52と、筐体51の後側に設けられ開閉自在なリアドア53とを備える。蒸発器1は収納ラック5の載置棚52とリアドア53との間に積載される。
載置棚52に載置される電子機器7には、電子機器7の排熱を電子機器7外へ送出するための送風機が搭載されている。この電子機器7は、電子機器7から送出された空気が蒸発器1を介して筐体51の外に排出されるように載置棚52に載置される。
蒸発器1には、気体冷媒Gと液体冷媒Lとが貯留されている。蒸発器1は、チューブ3に接続された下部容器11と、チューブ4に接続された上部容器12と、下部容器11と上部容器12とを繋ぐ蒸発管13とを備える。図1に示すように、下部容器11と上部容器12とは複数の蒸発管13によって接続されている。蒸発管13同士の間には、受熱フィン14が設けられている。受熱フィン14は、コルゲーテッドフィン等であり、電子機器7が送出する空気と蒸発管13内に貯留された冷媒との熱交換を促進する。蒸発器1の各部品は、銅やアルミニウムなどの熱伝導率の高い金属で形成される。
受熱フィン14は、ロウ付けや半田付けにより、蒸発管13と接合される。受熱フィン14のフィンピッチを小さくする(すなわち、フィン同士の隙間を狭くする)ことで、冷媒が蒸発する際に空気から吸収する潜熱の熱輸送量を増やすことが出来る。一方、受熱フィン14のフィンピッチを小さくすると、電子機器7から送出される空気の通風抵抗が増加し、風速が低下する。そのため、電子機器7のLSIやIC等の部品の動作温度が、許容温度を超えない程度の通風抵抗となるようにフィンを形成しておく必要がある。
凝縮器2には、気体冷媒Gと液体冷媒Lとが貯留されている。凝縮器2は、銅やアルミニウムなどの熱伝導率が高い金属で形成されている。凝縮器2は、チューブ4から冷媒が流入する流入孔21と、チューブ3に冷媒を流出させる流出孔22とが形成される。凝縮器2の内壁のうち、冷水配管6に面する箇所には、放熱フィン23が螺子止めされる。放熱フィン23は、冷水配管6を流れる冷水と凝縮器2の内部に貯留する冷媒との熱交換を促進する。
放熱フィン23は、銅やアルミニウムなどの熱伝導率が高い金属で形成されたプレート型フィンやピンフィン構造など冷媒との接触面積を増大させる構造を有する。
凝縮器2は、放熱フィン23と冷水配管6との熱交換の効率を上げるため、TIM(Thermal interface material)24を介して冷水配管6に取り付けられる。すなわち、TIM24は、凝縮器2と冷水配管6との間に設けられている。TIM24には、グリースタイプ、シートタイプなど、熱伝導率が高ければどのようなタイプのTIMを用いても良い。
収納ラック5に収納された電子機器7が排熱によって温められた空気を送出すると、その空気は、蒸発器1及びリアドア53を介して収納ラック5外に排出される。
この空気が蒸発器1を通過する際、空気の熱は、蒸発器1の受熱フィン14を介して蒸発管13に伝達される。蒸発管13に伝達された熱は、蒸発管13内部に貯留された冷媒の温度を上昇させる。上述したように、蒸発器1と凝縮器2と1対のチューブ3、4とから構成される気密系の内圧は、大気圧より低くなっている。このため、受熱フィン14からの熱により冷媒の温度が沸点を超え、液体冷媒は蒸発する。
このとき、液体冷媒は、気体に相変化するために電子機器7が送出する空気から潜熱を吸収する。これにより、電子機器7が送出した空気の温度を下げることができ、電子機器7が載置された部屋の空気温度の上昇を抑えることができる。
凝縮器2に流入した気体冷媒は、凝縮器2の内部に設けられた放熱フィン23及びTIM24を介して、冷水配管6を流れる冷水に熱を放出する。放熱フィン23に熱を放出することで、気体冷媒の温度は沸点を下回り、気体冷媒は凝縮する。このとき、気体冷媒は、液体に相変化するために冷水配管6に潜熱を与える。冷水配管6に与えられた熱は、冷水配管6を流れる冷水に伝達され、冷水の流れによってデータセンタやサーバルームの外へ排出される。
蒸発器1と凝縮器2とを接続する1対のチューブ3、4は、図5Aに示すように、水平線に対して下に凸に撓んだ箇所を有しないことが望ましい。即ち、チューブ3、4は、凝縮器2から蒸発器1に向かうに従って漸次下方に延在することが望ましい。
図5Bに示すように、チューブ3が水平線に対して下に凸に撓んでいる場合、点線Aで囲った部分を液体冷媒が重力に逆らって流動することとなる。そのため、気密系を流れる冷媒の速度が低下し、循環が滞ってしまう恐れがある。また、図5Bに示すように、チューブ4が水平線に対して下に凸に撓んでいる場合、気体冷媒がチューブ4の壁面にぶつかることで圧力損失が発生して気体冷媒が液化したときに、点線Bで囲った部分に液体冷媒が滞留してしまう恐れがある。
これらの理由から、チューブ3及びチューブ4は、水平線に対して下に凸に撓んだ箇所を有しないことが望ましい。
本実施形態による電子機器冷却システムを用いることで、電子機器7が発生した熱量の4割~6割を受熱することができた。また、本実施形態による電子機器冷却システムを用いることで、収納ラック5からの排出空気温度を最大15℃程度下げることができた。
また、本実施形態によれば、凝縮器2は、冷水配管6を流れる冷水と気体冷媒との熱交換を促進する放熱フィン23を備える。これにより、凝縮器2は、気体冷媒を効率よく凝縮させることができる。
次に、本発明の第2の実施形態について説明する。第2の実施形態において、第1の実施形態と同様の構成要素については、同一の符号を付して詳細な説明を省略する。
図6は、本発明の第2の実施形態による電子機器冷却システムの斜視図である。
第2の実施形態による電子機器冷却システムの収納ラック5は、第1の実施形態と異なり、リアドア53に貫通孔54を備えず、筐体51の側面に貫通孔54を備える。また、蒸発器1の流入孔及び流出孔も、蒸発器1のリアドア53に面する部分に設けられず、蒸発器1の側面に設けられる1対のチューブ3、4は、筐体51の側面の貫通孔54を介して蒸発器1と凝縮器2とを接続する。
本実施形態によれば、リアドア53の前面にチューブ3、4を配するスペースを確保できない場合にも、電子機器冷却システムを適用することができる。
次に、本発明の第3の実施形態について説明する。第3の実施形態において、第1の実施形態と同様の構成要素については、同一の符号を付して詳細な説明を省略する。
図7は、本発明の第3の実施形態による電子機器冷却システムの斜視図である。
第3の実施形態による電子機器冷却システムは、第1、第2の実施形態と異なり、収納ラック5のリアドア53に蒸発器1が固定される。図7は、リアドア53が開いた状態を示している。実際に使用する際は、リアドア53を閉じた状態にすることで、蒸発器1が電子機器7の送風機に面するようにする。
本実施形態によれば、蒸発器1がリアドア53に固定されている。このため、図7に示すように、リアドア53を開いたときに、載置棚52に載置された電子機器7を取り出すことができる。つまり、本実施形態によれば、収納ラック5の前方後方のいずれからも電子機器7を交換することができる。
例えば、第1、第2の実施形態では、蒸発器1、凝縮器2、及び1対のチューブ3、4からなる気密系を複数備える場合を説明したが、これに限られない。例えば筐体51の高さと同程度の高さの蒸発器1を有する気密系を1つだけ備えても良い。同様に、第3の実施形態では、蒸発器1、凝縮器2、及び1対のチューブ3、4からなる気密系を1つだけ備える場合を説明したが、これに限られない。第1、第2の実施形態のように気密系を複数備えていても良い。
2 凝縮器
3、4 チューブ
5 収納ラック
6 冷水配管(冷却管)
7 電子機器
11 下部容器
12 上部容器
13 蒸発管
14 受熱フィン
15 流入孔
16 流出孔
21 流入孔
22 流出孔
23 放熱フィン
24 TIM
51 筐体
52 載置棚
53 リアドア
54 貫通孔
55 排気孔
Claims (10)
- 電子機器の排熱によって温められた空気を冷却する電子機器冷却システムであって、
前記電子機器による空気の送出方向に設けられ、前記電子機器から送出された空気の熱を吸収して液体冷媒を気体冷媒に相転移させる蒸発器と、
気体冷媒の熱を放出して前記気体冷媒を液体冷媒に相転移させる凝縮器と、
前記蒸発器が相転移させた気体冷媒を前記凝縮器に流入させる気体流路と、
前記凝縮器が相転移させた液体冷媒を前記蒸発器に流入させる液体流路と
を備え、
前記凝縮器は、前記蒸発器より上方に配置される
電子機器冷却システム。 - 前記気体流路と前記液体流路の少なくとも一方は、前記凝縮器から前記蒸発器に向かうに従って漸次下方に延在する請求項1に記載の電子機器冷却システム。
- 前記凝縮器は、前記凝縮器の内部に貯留された気体冷媒の沸点より温度の低い流体が循環する冷却管の表面に設けられる請求項1または請求項2に記載の電子機器冷却システム。
- 前記冷却管は、少なくともその一部が前記電子機器が載置された部屋の外側に露呈している請求項3に記載の電子機器冷却システム。
- 前記電子機器を載置する載置棚を備える収納ラックをさらに備え、
前記蒸発器は、前記収納ラック内部における、前記載置棚に載置された電子機器による空気の送出方向に設けられ、
前記凝縮器は、前記収納ラック外部に設けられる
請求項1から請求項4の何れか1項に記載の電子機器冷却システム。 - 前記蒸発器は、前記電子機器が送出する空気と前記液体冷媒との熱交換を促進する受熱フィンを備える請求項1から請求項5の何れか1項に記載の電子機器冷却システム。
- 前記凝縮器は、前記流体と前記気体冷媒との熱交換を促進する放熱フィンを備える請求項3または請求項4に記載の電子機器冷却システム。
- 前記気体流路及び前記液体流路は、可撓性を有するチューブである請求項1から請求項7の何れか1項に記載の電子機器冷却システム。
- 前記気体流路及び前記液体流路は、前記収納ラックの側方に設けられた貫通孔を介して前記蒸発器と前記凝縮器とを接続する請求項3に記載の電子機器冷却システム。
- 前記収納ラックは、前記電子機器による空気の送出方向側に開閉自在に取り付けられた扉を備え、
前記蒸発部は、前記扉に固定されている請求項3に記載の電子機器冷却システム。
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US13/818,091 US20130333414A1 (en) | 2010-08-31 | 2011-07-05 | System for cooling electronic device |
CN201180041351.1A CN103081581B (zh) | 2010-08-31 | 2011-07-05 | 用于冷却电子装置的系统 |
JP2012531730A JP5857964B2 (ja) | 2010-08-31 | 2011-07-05 | 電子機器冷却システム |
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JPWO2012029404A1 (ja) | 2013-10-28 |
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