WO2015072128A1 - 配管構造、それを用いた冷却装置、および冷媒蒸気輸送方法 - Google Patents
配管構造、それを用いた冷却装置、および冷媒蒸気輸送方法 Download PDFInfo
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- WO2015072128A1 WO2015072128A1 PCT/JP2014/005637 JP2014005637W WO2015072128A1 WO 2015072128 A1 WO2015072128 A1 WO 2015072128A1 JP 2014005637 W JP2014005637 W JP 2014005637W WO 2015072128 A1 WO2015072128 A1 WO 2015072128A1
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- refrigerant
- piping structure
- flow path
- pipe
- structure according
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B23/00—Machines, plants or systems, with a single mode of operation not covered by groups F25B1/00 - F25B21/00, e.g. using selective radiation effect
- F25B23/006—Machines, plants or systems, with a single mode of operation not covered by groups F25B1/00 - F25B21/00, e.g. using selective radiation effect boiling cooling systems
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16L—PIPES; JOINTS OR FITTINGS FOR PIPES; SUPPORTS FOR PIPES, CABLES OR PROTECTIVE TUBING; MEANS FOR THERMAL INSULATION IN GENERAL
- F16L41/00—Branching pipes; Joining pipes to walls
- F16L41/08—Joining pipes to walls or pipes, the joined pipe axis being perpendicular to the plane of the wall or to the axis of another pipe
- F16L41/086—Joining pipes to walls or pipes, the joined pipe axis being perpendicular to the plane of the wall or to the axis of another pipe fixed with screws
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B39/00—Evaporators; Condensers
- F25B39/02—Evaporators
- F25B39/028—Evaporators having distributing means
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B41/00—Fluid-circulation arrangements
- F25B41/40—Fluid line arrangements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B41/00—Fluid-circulation arrangements
- F25B41/40—Fluid line arrangements
- F25B41/42—Arrangements for diverging or converging flows, e.g. branch lines or junctions
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2500/00—Problems to be solved
- F25B2500/01—Geometry problems, e.g. for reducing size
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2500/00—Problems to be solved
- F25B2500/05—Cost reduction
Definitions
- the present invention relates to a piping structure used for a cooling device such as a semiconductor device or an electronic device, and in particular, a piping structure used for a cooling device using a boiling cooling system in which heat is transferred and released by a refrigerant vaporization and condensation cycle, and the like.
- TECHNICAL FIELD The present invention relates to a cooling device using a refrigeration and a refrigerant vapor transport method.
- DCs data centers
- the data center (DC) refers to a facility specialized in installing and operating servers and data communication devices.
- the temperature and humidity of the server room in the facility uniformly.
- Patent Document 1 In order to solve the above-mentioned problems, development of a technique for reducing the power consumption of an air conditioner is being promoted, and an example thereof is described in Patent Document 1.
- the related cooling unit described in Patent Document 1 is configured to be attached to a rear door (rear door) of a server rack.
- the related cooling unit is composed of a radiator unit that removes the hot air discharged from the back surface, a fan unit in which fans for forcibly discharging the hot air are arranged, and a frame unit that integrally mounts these units. ing.
- the related cooling unit comprised integrally is comprised as a back door of a rack.
- Fig. 6 shows the configuration of the pipe assembly provided in the radiator unit of the related cooling unit.
- the pipe assembly 500 has a horizontal pipe 510 meandering in multiple directions and arranged in the horizontal direction, and a set of vertical pipes 521 and 522 connected to the horizontal pipe 510 and arranged in the vertical direction.
- the vertical pipes 521 and 522 are connected to a pair of lower pipes 531 and 532 and an upper pipe 541 and 542, respectively, through which the refrigerant flows.
- the lower pipe 531, the vertical pipe 521, and the upper pipe 541 constitute an inflow side pipe that allows the refrigerant before heat absorption to flow in the direction of the arrow C1.
- the lower pipe 532, the vertical pipe 522, and the upper pipe 542 constitute an outflow side pipe that causes the refrigerant after the heat absorption to flow in the arrow C2 direction.
- the other ends of the lower pipes 531 and 532 are connected to a heat exchanger disposed outdoors via a hose.
- the refrigerant that has absorbed heat that has been refluxed to the lower pipe 532 on the outflow side flows out to the heat exchanger, thereby constructing a cooling system in which the refrigerant circulates.
- the pump is driven to forcibly circulate the refrigerant.
- the pipe aggregate 500 is an aggregate structure of the horizontal pipes 510, and a cooling effect is exerted by the action of the horizontal pipes 510.
- the horizontal pipe 510 is an aggregate of a plurality of horizontal pipe sets 511, 512 to 51n, each of which has a structure of a meander pipe having three meanders.
- the plurality of horizontal pipe sets 511 to 51n are arranged from the top to the bottom along the vertical pipes 521 and 522, and the pipe end of each horizontal pipe set is welded to the vertical pipe to form the skeleton of the pipe assembly 500. is doing.
- JP 2010-04-1007 A paragraphs [0017] to [0043], FIG. 3)
- the related cooling unit described in Patent Document 1 is configured to be attached to the back door (rear door) of the server rack. Since some rear doors (rear doors) of electronic equipment racks such as server racks have a height of 2 m or more, the cooling unit becomes large.
- the pipe ends of the plurality of horizontal pipe sets are connected to each other by welding to the vertical pipes to form a pipe aggregate.
- the cooling unit becomes large, the number of connecting portions of the pipes (refrigerant piping) through which the refrigerant flows increases, and the pressure loss of the refrigerant vapor at the connecting portion also increases.
- a pipe assembly (piping structure) in the related cooling unit is used, there is a problem that the cooling capacity is reduced in a large cooling unit.
- the object of the present invention is to solve the above-described problem that it is difficult to avoid a decrease in cooling capacity without increasing power consumption when a cooling device using a pipe structure is enlarged.
- the piping structure of the present invention comprises a tubular portion having a first flow path through which a refrigerant flows, an outer shell portion surrounding the first flow path, and a part of the outer shell portion.
- the second flow path is arranged at the end opposite to the end connected to the first flow path.
- a connecting portion is provided.
- the first refrigerant flows in a first direction
- the second refrigerant flows in a second direction different from the first direction
- the first refrigerant and the second refrigerant Are joined so that the angle formed by the first direction and the second direction on the same plane is an acute angle.
- the cooling device using the piping structure, and the refrigerant vapor transport method even when the cooling device is enlarged, it is possible to avoid a decrease in cooling capacity without causing an increase in power consumption. Can do.
- FIG. 1 is a cross-sectional view showing a configuration of a piping structure 100 according to a first embodiment of the present invention.
- the piping structure 100 according to the present embodiment includes a tubular part 110, an introduction part 120, and a connection part 130.
- the tubular portion 110 includes a first flow path 111 through which a refrigerant flows and an outer shell portion 112 that surrounds the first flow path 111.
- the introduction part 120 includes a second flow path 121 that constitutes a part of the outer shell part 112 and is connected to the first flow path 111.
- the connection portion 130 is disposed at the end portion of the introduction portion 120 opposite to the end portion on the side where the second flow path 121 is connected to the first flow path 111.
- the refrigerant flowing through the first flow path 111 and the refrigerant flowing into the first flow path 111 are included in the introduction part 120 that constitutes a part of the outer shell part 112. Merge through the second channel 121. Therefore, since the pressure loss at the time of joining can be controlled by the introduction part 120, the fall of cooling capacity can be avoided. That is, even when the introduction unit 120 is provided at a plurality of locations of the tubular part 110 and the cooling device is enlarged, an increase in pressure loss can be avoided, so that the refrigerant is forced by driving a pump or the like. There is no need to circulate. As a result, even when the cooling device is enlarged, it is possible to avoid a decrease in cooling capacity without causing an increase in power consumption.
- the outer surface of the connecting portion 130 can be a flat surface, and the connecting portion 130 can have a seal structure. With such a configuration, according to the piping structure 100, it is possible to connect to other piping with a simple structure.
- FIG. 2 shows a schematic configuration of the server module 200 arranged in a data center (DC) or the like.
- a plurality of such server modules 200 are arranged in a data center (DC).
- the server module 200 includes a server rack 210 and a heat transport module 220 attached to the rear door 211 of the server rack 210.
- the heat transport module 220 is a cooling device using a boiling cooling system that transports and dissipates heat by a refrigerant vaporization and condensation cycle, and the cooling device using the piping structure according to the present embodiment can be used.
- a plurality of electronic devices 212 and a fan 213 are mounted on the server rack 210, respectively.
- cooling air is supplied in the direction of arrow A in FIG. 2 by an air conditioner.
- the fan 213 in the server rack 210 sucks cooling air and thereby cools the electronic device 212.
- the cooling air is exhausted from the rear door 211 of the server rack 210 after cooling the electronic device 212.
- the exhausted cooling air is sucked into the air conditioner and cooled, and then supplied again into the server room.
- FIG. 3 shows the configuration of the cooling device 300 using the piping structure according to the present embodiment.
- FIG. 3 is a view of the server rack 210 shown in FIG. 2 as viewed from the back side.
- a plurality of evaporation sections 310 are provided in the heat exhaust section of the electronic device 212.
- a fin-and-tube heat exchanger can be used for the evaporation unit 310.
- the fin-and-tube heat exchanger is composed of fins and heat transfer tubes, and heat exchange is performed between the air flowing between the fins and the refrigerant flowing in the heat transfer tubes.
- the evaporation unit 310 is disposed so as to cover the exhaust side of the server rack 210.
- the evaporating unit 310 receives heat from the exhaust that has been warmed by cooling the electronic device 212, and the refrigerant stored inside vaporizes the heat and exhausts the cooled exhaust to the outside of the server rack 210. .
- a vapor pipe 321 and a liquid pipe 322 are connected to the evaporation unit 310.
- the steam pipe 321 is connected to an external steam pipe 331 extending outside the server room.
- the refrigerant vapor evaporated in the evaporation unit 310 flows into the steam pipe 321, is transported to the outside of the server room through the steam pipe 321 and the external steam pipe 331, and flows into the radiator 340 installed outside the server room.
- the refrigerant vapor radiates and condenses into liquid by exchanging heat with the cooling water supplied by the cold water pipe 341 in the radiator 340, and returns to the server room through the external liquid pipe 332.
- the configuration of the radiator 340 is not particularly limited as long as it has a function of removing heat from the refrigerant vapor and causing it to condense and liquefy.
- the water cooling system which uses a liquid as a medium used for heat exchange but an air cooling system may be used.
- the refrigerant that has returned to the server room flows again into the evaporation section 310 via the distribution structure 350.
- the distribution structure 350 is arranged at the same height in the vertical direction as each of the evaporators 310, and has an outlet at a position having a different height. Therefore, the liquid refrigerant that has flowed into the distribution structure 350 first flows out from the outlet located below toward the evaporation unit 310. When the liquid level of the evaporation section 310 rises to the height of the other outlet of the distribution structure 350, the refrigerant flows out of the other outlet and is supplied to the distribution structure 350 positioned one step below.
- the distribution structure 350 distributes the refrigerant liquefied in the radiator 340 to at least one evaporation unit among the plurality of evaporation units 310. With such a configuration, it is possible to supply an arbitrary amount of refrigerant to each evaporation unit 310.
- a refrigerant having a saturated vapor pressure equal to or lower than atmospheric pressure at zero degrees Celsius can be used.
- a refrigerant for example, an organic refrigerant such as hydrofluorocarbon, hydrofluoroether, or hydrofluoroketone can be used.
- the piping structure 400 at the connection point between the evaporation section 310 and the steam pipe 321 will be described with reference to FIGS.
- the piping structure 100 described in the first embodiment can be used for the piping structure of the present embodiment.
- FIG. 4 shows a region surrounded by a circle B in FIG.
- FIG. 4 is a cross-sectional view in which a connection point between the steam pipe 321 and the steam outlet 311 that is the outlet of the evaporation unit 310 is cut along a plane perpendicular to the central axis C of the steam pipe 321.
- the piping structure 400 of this embodiment includes a block shape 420 as an introduction portion between the outer shell portion constituting the steam pipe 321 and the steam discharge port 311.
- a connecting portion 430 having a plane parallel to the end face of the steam discharge port 311 is disposed at the end of the block shape 420 and on the end opposite to the steam pipe 321.
- the block shape 420 constitutes a part of the outer shell of the steam pipe 321.
- the outer surface of the block shape 420 may have a portion formed of a curved surface.
- the block shape 420 includes a flow path (second flow path) that connects the steam outlet 311 and the tubular portion (first flow path) of the steam pipe 321 therein.
- the extending direction of the flow path (second flow path) can be configured not to intersect the central axis C of the tubular portion.
- the extension of the central axis D of the flow path (second flow path) connected to the steam discharge port 311 and the central axis C of the steam pipe 321 can be shifted. In this manner, by disposing the central axes of the respective flow paths, it is possible to avoid a collision in a region where the flow velocity of the moving fluids to be joined is the highest, and to suppress an increase in fluid pressure.
- connection part 430 can be configured to have an opening through which the refrigerant flows, and the cross-sectional area of the flow path (first flow path) of the steam pipe 321 is larger than the cross-sectional area of the opening. That is, the cross-sectional area of the flow path by the steam pipe 321 can be made larger than the cross-sectional area of the steam discharge port 311.
- the effect by having such a structure is demonstrated below.
- the refrigerant vapor that flows in and joins from the plurality of steam discharge ports 311 flows.
- the cross-sectional area of the flow path by the steam pipe 321 larger than the cross-sectional area of the steam discharge port 311, it is possible to suppress an increase in internal pressure when the refrigerant vapor merges.
- the vaporization temperature of the refrigerant affects the cooling performance.
- the increase in internal pressure causes an increase in the refrigerant boiling point.
- the increase in the internal pressure of the refrigerant can be prevented as described above, so that the deterioration of the cooling performance can be prevented.
- connection part 430 having a plane parallel to the end face of the steam discharge port 311 is disposed at the end of the block shape 420. Therefore, a simple seal structure 440 can be provided at the connection portion 430.
- seal structure 440 for example, a configuration in which a seal material is sandwiched and fixed with screws can be employed.
- the sealing material is preferably made of a material resistant to the refrigerant, and for example, hydrogenated nitrile rubber (HNBR) or metal O-ring can be used.
- HNBR hydrogenated nitrile rubber
- the heat transport module 220 can be manufactured without performing processing such as welding or brazing. Become. According to the above-described configuration, the apparatus can also be disassembled during maintenance of the heat transport module 220 or the like.
- FIG. 5 shows another configuration of the piping structure 400 at the connection point between the evaporation section 310 and the steam pipe 321.
- 5 is a cross-sectional view taken along a plane parallel to the central axis C of the steam pipe 321 including the central axis D of the steam outlet 311 in FIG.
- the piping structure 400 includes an extending direction F1 of the tubular portion (first flow path) of the steam pipe 321 and a flow path (second flow path) inside the block shape 420 connected to the steam discharge port 311.
- the extending direction F2 of the flow path) can be configured to have an acute angle on the same plane. The angle at this time is preferably 45 degrees or less, and typically 45 degrees.
- the flow path is provided inside the block shape 420 (introduction portion) corresponding to the thick portion of the tubular portion of the steam pipe 321. Therefore, it is possible to easily adjust the angle at which the refrigerant vapors merge by this flow path. And since it can be set as the structure which has arrange
- the refrigerant vapor flowing in from the vapor discharge port 311 spirals in the moving direction of the refrigerant vapor flowing from below. It becomes possible to merge like drawing. Thereby, generation
- Piping structure 400 can be formed using an extrusion process. According to the extrusion method, it is possible to form a planar shape at an arbitrary location and to form a part of the tubular portion thick. Not only this but the piping structure 400 can be formed also by attaching a block material to a part of piping by welding or brazing.
- the piping structure 400 according to the present embodiment is not limited to the cooling device, and can be applied to the connection of piping for the purpose of transporting a fluid whose pressure loss affects performance.
- a configuration in which a plurality of pipes are sealed in a steam pipe through which refrigerant vapor flows can be formed by a low-cost means such as a connecting means using screws.
- a low-cost means such as a connecting means using screws.
- the refrigerant vapor can be transported suitably without the need for flow rate control using a drive source such as a pump or a valve. Therefore, it is possible to improve the heat absorption performance of the cooling device using the piping structure.
- the refrigerant vapor transport method of the present embodiment first, the first refrigerant is caused to flow in the first direction, and the second refrigerant is caused to flow in a second direction different from the first direction. Then, the first refrigerant and the second refrigerant are merged so that the angle formed by the first direction and the second direction on the same plane is an acute angle. Furthermore, the first refrigerant and the second refrigerant may be merged so that the first direction and the second direction do not intersect.
- the cooling device is enlarged by providing the block shape 420 as the introduction portion at a plurality of locations of the steam pipe 321, An increase in loss can be avoided. Therefore, it is not necessary to forcibly circulate the refrigerant by driving a pump or the like. As a result, even when the cooling device is enlarged, it is possible to avoid a decrease in cooling capacity without causing an increase in power consumption.
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Abstract
Description
図1は、本発明の第1の実施形態に係る配管構造100の構成を示す断面図である。本実施形態による配管構造100は、管状部110、導入部120、および接続部130を有する。
本実施形態では、データセンタ(Data Center:DC)等に配置されるサーバラックに搭載される配管構造を用いた冷却装置について説明する。
110 管状部
111 第1の流路
112 外殻部
120 導入部
121 第2の流路
130、430 接続部
200 サーバ・モジュール
210 サーバラック
211 リアドア
212 電子機器
213 ファン
220 熱輸送モジュール
300 配管構造を用いた冷却装置
310 蒸発部
311 蒸気排出口
321 蒸気管
322 液配管
331 外部蒸気管
332 外部液配管
340 放熱器
341 冷水管
350 分配構造
420 ブロック形状
440 シール構造
500 パイプ集合体
510 横パイプ
511、512~51n 横パイプ組
521、522 縦パイプ
531、532 下パイプ
541、542 上パイプ
Claims (11)
- 冷媒が流動する第1の流路と、前記第1の流路を囲む外殻部とを備えた管状部と、
前記外殻部の一部を構成し、前記第1の流路と接続する第2の流路を備えた導入部と、
前記導入部の端部のうち、前記第2の流路が前記第1の流路と接続する側の端部と反対側の端部に配置した接続部、とを有する
配管構造。 - 請求項1に記載した配管構造において、
前記接続部の外面は、平面である
配管構造。 - 請求項1または2に記載した配管構造において、
前記接続部は、シール構造を備える
配管構造。 - 請求項1から3のいずれか一項に記載した配管構造において、
前記接続部は、前記冷媒が流動する開口部を備え、
前記第1の流路の断面積は、前記開口部の断面積よりも大きい
配管構造。 - 請求項1から4のいずれか一項に記載した配管構造において、
前記第2の流路の延伸方向は、前記第1の流路の中心軸と交差しない
配管構造。 - 請求項1から5のいずれか一項に記載した配管構造において、
前記第1の流路の延伸方向と前記第2の流路の延伸方向が、同一平面上でなす角度は鋭角である
配管構造。 - 請求項1から6のいずれか一項に記載した配管構造において、
前記冷媒の飽和蒸気圧は、摂氏零度において大気圧以下である
配管構造。 - 請求項1から7のいずれか一項に記載した配管構造と、
前記接続部に接続された複数の蒸発部、とを有し、
前記冷媒は、前記蒸発部において吸熱することにより気化する
配管構造を用いた冷却装置。 - 請求項8に記載した配管構造を用いた冷却装置において、
前記管状部と接続する放熱器と、前記放熱器と接続する分配構造、とをさらに有し、
前記放熱器は、前記蒸発部において気化した冷媒を放熱させて液化させ、
前記分配構造は、前記放熱器において液化した冷媒を、前記複数の蒸発部のうち少なくとも一の蒸発部に分配する
冷却装置。 - 第1の冷媒を第1の方向に流動させ、
第2の冷媒を前記第1の方向と異なる第2の方向に流動させ、
前記第1の冷媒と前記第2の冷媒を、前記第1の方向と前記第2の方向が同一平面上でなす角度が鋭角であるように合流させる
冷媒蒸気輸送方法。 - 請求項10に記載した冷媒蒸気輸送方法において、
前記第1の冷媒と前記第2の冷媒を、前記第1の方向と前記第2の方向が交差しないように合流させる
冷媒蒸気輸送方法。
Priority Applications (5)
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CN201480062251.0A CN105723167B (zh) | 2013-11-14 | 2014-11-10 | 管道结构、使用管道结构的冷却装置及制冷剂蒸气输送方法 |
KR1020167015500A KR101917484B1 (ko) | 2013-11-14 | 2014-11-10 | 배관 구조, 그 배관 구조를 사용한 냉각 장치, 및 냉매 증기 수송 방법 |
US15/036,688 US20160290691A1 (en) | 2013-11-14 | 2014-11-10 | Piping structure, cooling device including the same, and method for transporting refrigerant vapor |
EP14861773.1A EP3081883A4 (en) | 2013-11-14 | 2014-11-10 | Piping structure, cooling device using same, and refrigerant vapor transport method |
JP2015547632A JP6835470B2 (ja) | 2013-11-14 | 2014-11-10 | 配管構造、それを用いた冷却装置、および冷媒蒸気輸送方法 |
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US10788270B2 (en) | 2015-10-15 | 2020-09-29 | Nec Platforms, Ltd. | Cooling device |
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US10415903B2 (en) * | 2014-10-15 | 2019-09-17 | Hamilton Sundstrand Corporation | Prevention of cooling flow blockage |
Citations (6)
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JP6129338B2 (ja) * | 2013-11-19 | 2017-05-17 | カルソニックカンセイ株式会社 | フランジ構造 |
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2014
- 2014-11-10 EP EP14861773.1A patent/EP3081883A4/en not_active Withdrawn
- 2014-11-10 KR KR1020167015500A patent/KR101917484B1/ko active IP Right Grant
- 2014-11-10 US US15/036,688 patent/US20160290691A1/en not_active Abandoned
- 2014-11-10 JP JP2015547632A patent/JP6835470B2/ja active Active
- 2014-11-10 WO PCT/JP2014/005637 patent/WO2015072128A1/ja active Application Filing
- 2014-11-10 CN CN201480062251.0A patent/CN105723167B/zh active Active
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Also Published As
Publication number | Publication date |
---|---|
EP3081883A4 (en) | 2017-09-13 |
KR101917484B1 (ko) | 2018-11-09 |
KR20160084859A (ko) | 2016-07-14 |
JPWO2015072128A1 (ja) | 2017-03-16 |
EP3081883A1 (en) | 2016-10-19 |
US20160290691A1 (en) | 2016-10-06 |
CN105723167A (zh) | 2016-06-29 |
CN105723167B (zh) | 2018-01-02 |
JP6835470B2 (ja) | 2021-02-24 |
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