WO2016147615A1 - 冷媒供給装置、それを用いた相変化冷却装置、および冷媒供給方法 - Google Patents
冷媒供給装置、それを用いた相変化冷却装置、および冷媒供給方法 Download PDFInfo
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- WO2016147615A1 WO2016147615A1 PCT/JP2016/001300 JP2016001300W WO2016147615A1 WO 2016147615 A1 WO2016147615 A1 WO 2016147615A1 JP 2016001300 W JP2016001300 W JP 2016001300W WO 2016147615 A1 WO2016147615 A1 WO 2016147615A1
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- Prior art keywords
- refrigerant
- refrigerant liquid
- storage tank
- heat receiving
- phase change
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20327—Accessories for moving fluid, for connecting fluid conduits, for distributing fluid or for preventing leakage, e.g. pumps, tanks or manifolds
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/06—Control arrangements therefor
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/208—Liquid cooling with phase change
- H05K7/20818—Liquid cooling with phase change within cabinets for removing heat from server blades
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/208—Liquid cooling with phase change
- H05K7/20827—Liquid cooling with phase change within rooms for removing heat from cabinets, e.g. air conditioning devices
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
- G06F2200/20—Indexing scheme relating to G06F1/20
- G06F2200/201—Cooling arrangements using cooling fluid
Definitions
- the present invention relates to a refrigerant supply device, a phase change cooling device using the refrigerant, and a refrigerant supply method, and more particularly, to a refrigerant supply device used in a cooling device that transports and dissipates heat by a refrigerant vaporization and condensation cycle.
- the present invention relates to a used phase change cooling device and a refrigerant supply method.
- Patent Document 1 An example of a cooling device using a refrigerant circulation cycle based on such a phase change phenomenon of the refrigerant is described in Patent Document 1.
- the related electronic device cooling system described in Patent Document 1 includes an evaporator in the vicinity of the server.
- a cooling coil is provided inside the evaporator, and the refrigerant liquid flowing in the cooling coil evaporates with hot air generated from the server, thereby removing vaporization heat from the surroundings and gasifying it.
- the evaporator is provided with a temperature sensor for measuring the temperature of the wind after the hot air discharged from the server is cooled by the evaporator.
- an expansion valve for adjusting the supply flow rate of the refrigerant supplied to the cooling coil is provided at the inlet of the cooling coil. And it is set as the structure by which the opening degree of an expansion valve is adjusted automatically based on the temperature measured by a temperature sensor.
- JP 2012-146331 A (paragraphs [0021] to [0026])
- the related electronic device cooling system described in Patent Document 1 is configured to adjust the refrigerant supply amount in accordance with the load. This is because it is necessary to supply a refrigerant having a flow rate corresponding to the latent heat according to the exhaust heat amount of the rack. That is, when the flow rate is equal to or less than the latent heat component, the refrigerant liquid is insufficient on the downstream side of the refrigerant flow path in the heat receiving portion, and no phase change occurs, so heat cannot be absorbed. Conversely, when the flow rate is equal to or greater than the latent heat, the refrigerant liquid becomes excessive and liquid cooling is caused by sensible heat, so that the temperature rises by the heat capacity of the refrigerant liquid on the downstream side. For this reason, the heat exchange efficiency is lowered, and sufficient heat absorption cannot be performed.
- the related electronic device cooling system described above has the following problems when a plurality of electronic device devices such as servers that vary in load are mounted. That is, when the load of each server mounted on the rack fluctuates, the heat absorption performance is lowered, and thus the air conditioning load increases. The reason is as follows.
- the related electronic device cooling system is configured to adjust the supply flow rate of the refrigerant supplied to the evaporator for each server rack in which a plurality of servers are housed. For this reason, the refrigerant having a flow rate corresponding to the latent heat is supplied after grasping the load condition of the entire rack. However, since the flow rate of the refrigerant for the latent heat is small, if the load on the server fluctuates between the time when the refrigerant flows into the rack and the time when it flows out, the amount of refrigerant supplied cannot follow. Therefore, the endothermic performance is lowered.
- the processor in the server is configured to greatly change the load, that is, the power consumption amount by increasing or decreasing the information processing amount due to the recent development of energy saving technology.
- the endothermic performance is deteriorated for the above-described reason every time the load fluctuates. As a result, the load on the air conditioner in the server room increases.
- phase change cooling device for cooling a plurality of heating elements
- the cooling performance is deteriorated due to the variation in the heat generation amount of the plurality of heating elements.
- An object of the present invention is a refrigerant that solves the above-described problem that in a phase change cooling device that targets a plurality of heating elements to be cooled, cooling performance is reduced due to fluctuations in the amount of heat generated by the plurality of heating elements. It is in providing a supply device, a phase change cooling device using the same, and a refrigerant supply method.
- the refrigerant supply device of the present invention includes a storage tank that stores a refrigerant liquid that flows by a drive pump, and a refrigerant liquid amount adjusting unit that controls a flow rate of the refrigerant liquid flowing out from the storage tank to the heat receiving unit.
- a branch outflow portion is provided, and the branch outflow portion is provided above the refrigerant liquid amount adjusting means, and causes the refrigerant liquid in the tank stored in the storage tank to flow out to another storage tank located below the storage tank.
- the phase change cooling device using the refrigerant supply device of the present invention includes a plurality of heat receiving units arranged in the vertical direction, containing the refrigerant, and a heat radiating unit that radiates heat received by the refrigerant at the heat receiving unit and flows out the refrigerant liquid. And a drive pump that causes the refrigerant liquid to flow, and a plurality of refrigerant supply devices that respectively supply the refrigerant liquid to the plurality of heat receiving units, and the refrigerant supply device stores a refrigerant liquid that flows by the drive pump.
- a refrigerant liquid amount adjusting means for controlling the flow rate of the refrigerant liquid flowing out from the storage tank to the heat receiving part
- the storage tank includes a branch outflow part, and the branch outflow part is provided above the refrigerant liquid amount adjusting means. Then, the refrigerant liquid in the tank stored in the storage tank flows out to the other storage tank positioned below the storage tank.
- the refrigerant supply method of the present invention holds the stored refrigerant liquid that stores the refrigerant liquid flowing by the drive pump, controls the flow rate of the circulating refrigerant liquid that is part of the stored refrigerant liquid and flows to the heat receiving region, and stores the stored refrigerant. A part of the stored refrigerant liquid is caused to flow downward in the vertical direction from the vicinity of the liquid level.
- the phase change cooling device using the refrigerant supply method, and the refrigerant supply method according to the present invention cooling is performed even when a plurality of heating elements are to be cooled and the heat generation amounts of the plurality of heating elements fluctuate. Performance degradation can be avoided.
- FIG. 1 It is a schematic diagram for demonstrating the circulation of the refrigerant
- FIG. 1 is a cross-sectional view showing the configuration of the refrigerant supply device according to the first embodiment of the present invention.
- a refrigerant supply device (refrigerant supply structure) 10 according to the present embodiment includes a storage tank 11 and a refrigerant liquid amount adjusting means 12.
- the storage tank 11 stores the refrigerant liquid that flows by the drive pump 21.
- the refrigerant liquid amount adjusting means 12 controls the flow rate of the refrigerant liquid flowing out from the storage tank 11 to the heat receiving unit 22.
- the storage tank 11 includes a branch outflow portion 11 c, and the branch outflow portion 11 c is provided above the refrigerant liquid amount adjusting means 12, and the storage tank 11X is located below the storage tank 11. 11 is discharged from the tank.
- a branch pipe 13 for transporting the refrigerant liquid in the tank to the other storage tank 11X is connected to the branch outflow portion 11c from the vicinity of the liquid level of the refrigerant liquid in the tank. That is, the branch pipe 13 connects the refrigerant liquid in the tank from the vicinity of the liquid level of the refrigerant liquid in the tank stored in the storage tank 11 to the other storage tank 11X located on the lower side in the vertical direction with respect to the storage tank 11. To transport.
- the refrigerant liquid amount adjusting unit 12 is configured to be provided in a pipe connected to the bottom surface of the storage tank 11, but is not limited thereto, and is connected to the lower end of the side surface of the storage tank 11. It is good also as a structure provided in piping.
- the heat receiving unit 22 contains the refrigerant, and the refrigerant liquid is vaporized by receiving heat from the heating element.
- the storage tank 11 stores the refrigerant liquid, and the refrigerant liquid is supplied from the storage tank 11 to the heat receiving unit 22 via the refrigerant liquid amount adjusting means 12. Therefore, the storage tank 11 functions as a buffer with respect to increase / decrease of the refrigerant liquid amount in the heat receiving part 22. Therefore, even if the heat generation amount of the heat generating element fluctuates rapidly, the refrigerant liquid in the heat receiving unit 22 does not become excessive or insufficient.
- coolant supply structure 10 of this embodiment is set as the structure which conveys the refrigerant
- the refrigerant supply structure 10 of the present embodiment it is possible to avoid a decrease in cooling performance even when a plurality of heating elements are to be cooled and the amount of heat generated by the plurality of heating elements varies. it can.
- the storage tank 11 includes an inflow portion 11a into which the refrigerant liquid flows, an outflow portion 11b from which the refrigerant liquid flows out toward the heat receiving portion 22, and a branch outflow portion 11c to which the branch pipe 13 is connected. Can do. And the refrigerant
- the storage tank 11 can be configured to have at least a volume capable of accommodating the refrigerant liquid having a capacity in which the total heat amount due to the vaporization heat of the refrigerant liquid is equal to the maximum heat receiving amount in the heat receiving unit 22.
- the refrigerant liquid amount adjusting means 12 can be configured to control the flow rate of the refrigerant liquid so that the cooling characteristics of the heat receiving unit 22 are substantially the same at different positions along the flow direction of the refrigerant liquid. Specifically, for example, the temperature of the air exhausted from the heat receiving unit 22 can be used as the cooling characteristic of the heat receiving unit 22.
- the refrigerant liquid amount adjusting means 12 is typically a variable flow rate valve.
- the refrigerant liquid amount adjusting means 12 can be a pipe connecting the heat receiving part 22 and the storage tank 11.
- this piping can be configured to include a portion in which the inner diameter of the piping is different from the inner diameter of the other piping that connects the other storage tank 11X and the other heat receiving portion.
- coolant liquid can be used as the refrigerant
- FIG. Specifically, for example, a configuration in which the length of the pipe, the radius of curvature of the pipe, and the friction coefficient of the pipe inner surface are made different can be used.
- the stored refrigerant liquid that stores the refrigerant liquid flowing by the drive pump is retained.
- the flow rate of the circulating refrigerant liquid that is a part of the stored refrigerant liquid and flows to the heat receiving region is controlled. Further, a part of the stored refrigerant liquid is caused to flow downward in the vertical direction from the vicinity of the liquid level of the stored refrigerant liquid.
- the flow rate of the circulating refrigerant liquid can be controlled so that the cooling characteristics in the heat receiving region are substantially the same at different positions along the flow direction of the circulating refrigerant liquid. Further, the circulating refrigerant liquid is caused to flow toward each of the plurality of heat receiving areas positioned in the vertical direction, and the pressure loss increases as the circulating refrigerant liquid flows toward the heat receiving area positioned on the lower side in the vertical direction. It is good also as controlling.
- the refrigerant supply structure 10 and the refrigerant supply method of the present embodiment even if a plurality of heating elements are to be cooled and the amount of heat generated by the plurality of heating elements fluctuates, the cooling performance decreases. Can be avoided.
- phase change cooling device 100 using the refrigerant supply structure 10 will be described.
- positioned at a data center (Data Center: DC) etc. is demonstrated as an example.
- phase change cooling device 100 using refrigerant supply structure 10 is simply referred to as “phase change cooling device 100”.
- FIG. 2 schematically shows a schematic configuration in which the phase change cooling device 100 according to the present embodiment is arranged in a data center building.
- the phase change cooling device 100 of the present embodiment includes a heat receiving module 110, a heat radiating unit 120, and a drive pump 130.
- the heat receiving unit module 110 includes a plurality of heat receiving units that store the refrigerant and are arranged in the vertical direction, and a plurality of refrigerant supply structures that respectively supply the refrigerant liquid to the plurality of heat receiving units.
- the heat radiating unit 120 radiates the heat received by the refrigerant at the heat receiving unit, and the refrigerant liquid flows out.
- the drive pump 130 causes the refrigerant liquid to flow toward the heat receiving unit module 110.
- a housing (rack) 510 on which a plurality of electronic device devices 511 such as servers and network devices are mounted is installed, and data processing is performed.
- the electronic device 511 generates heat by a load such as data processing, and the heat is exhausted outside the rack 510.
- the phase change cooling device 100 of the present embodiment has a configuration in which a plurality of heat receiving portions are arranged inside a housing (rack) 510 that houses an electronic device device 511 as a cooling target. That is, the heat receiving unit module 110 constituting the phase change cooling device 100 is installed on the exhaust side surface of the rack 510, for example, the exhaust side door.
- the heat receiving unit module 110 is connected to, for example, the machine room 520 adjacent to the outside of the server room 500 or the heat radiating unit 120 installed outdoors via the liquid pipe 140 and the steam pipe 150.
- the above-described drive pump 130 is installed in the flow path of the liquid pipe 140 and conveys the refrigerant liquid between the heat radiating unit 120 and the heat receiving unit module 110.
- FIG. 3 shows an external configuration of a rack 510 on which the heat receiving unit module 110 and the electronic device 511 according to the present embodiment are mounted.
- the heat generated in the electronic device device 511 is directly radiated from the heat radiating unit 120 to the outside of the server room 500. Therefore, the amount of heat that the air conditioner in the server room 500 cools down can reduce the load on the air conditioner. Note that the arrows in FIG. 2 indicate the movement of heat generated in the electronic device apparatus 511.
- a low boiling point refrigerant such as hydrofluorocarbon (HFC) or hydrofluoroether (HFE) can be used. It is used in an environment of saturated vapor pressure by evacuating after injecting the refrigerant.
- HFC hydrofluorocarbon
- HFE hydrofluoroether
- the refrigerant in the heat receiving module 110 changes phase from liquid to gas by the exhaust heat of the electronic device 511, and takes the exhaust heat as heat of vaporization.
- the vaporized refrigerant becomes refrigerant vapor and is transported by heat to the heat radiating unit 120 through the vapor pipe 150.
- the refrigerant vapor releases heat by exchanging heat with the outside air or cold water, and again changes to a liquid to become a refrigerant liquid.
- the refrigerant liquid passes through the liquid pipe 140 by the driving force of the driving pump 130 and is returned to the heat receiving unit module 110.
- FIG. 4 shows the configuration of the heat receiving module 110.
- the heat receiving unit module 110 includes a plurality of heat receiving units 111, and each of the heat receiving units 111 is provided with a reserve tank 112 as a storage tank, a valve 113 as a refrigerant liquid amount adjusting means, and a branch pipe 114.
- the heat receiving unit 111 exchanges heat between the exhaust heat of the electronic device 511 and the refrigerant.
- the reserve tank 112 temporarily buffers the refrigerant liquid.
- the valve 113 is disposed between the heat receiving unit 111 and the reserve tank 112, and adjusts the flow rate of the refrigerant liquid.
- phase change cooling device 100 Next, the operation of the phase change cooling device 100 according to the present embodiment will be described.
- the reserve tank 112 includes an inflow portion into which the refrigerant liquid conveyed from the drive pump 130 flows, an outflow portion from which the refrigerant liquid flows out toward the heat receiving portion 111, and a branch outflow portion to which the branch pipe 114 is connected. And from the outflow part, the heat receiving part refrigerant
- the reserve tank 112 can be configured to have at least a volume capable of accommodating a refrigerant liquid having a capacity in which the total amount of heat due to the heat of vaporization of the refrigerant liquid is equal to the maximum amount of heat received in the heat receiving unit 111. That is, the reserve tank 112 only needs to have a capacity capable of storing (reserving) a refrigerant liquid having a flow rate obtained by dividing at least the maximum heat generation amount of heat exchange in the heat receiving unit 111 by the latent heat of the refrigerant. Thereby, a refrigerant liquid can be supplied according to the load fluctuation of the electronic device apparatus 511.
- the refrigerant liquid 221 that has flowed into the heat receiving unit 111 exchanges heat with the exhaust heat of the exhaust air from the electronic device device 511, changes phase to the refrigerant vapor 222, and flows out to the vapor pipe 150.
- the direction of the exhaust air is perpendicular to the paper surface, and as shown in FIG. 5, the refrigerant liquid 221 flows from the lower side of the heat receiving unit 111 and becomes the refrigerant vapor 222 to be above the heat receiving unit 111. Spill from.
- the temperature distribution of the exhaust air exhausted from the heat receiving unit 111 at this time is schematically shown in FIG.
- the direction of the exhaust air is perpendicular to the paper surface, and the refrigerant liquid 221 flows in from the lower side of the heat receiving unit 111 and flows out from the upper side of the heat receiving unit 111 as the refrigerant vapor 222. It is configured.
- the exhaust gas temperature Tout on the downstream side of the heat receiving unit 111 shown in FIG. It becomes higher than the exhaust temperature Tin on the upstream side.
- the opening of the valve 113 is increased to increase the flow rate of the refrigerant liquid, the refrigerant liquid that has not been vaporized on the upstream side warms and moves to the downstream side, so the temperature rises by the heat capacity that is the sensible heat of the refrigerant liquid. Occurs downstream. Therefore, the downstream exhaust temperature Tout is similarly higher than the upstream exhaust temperature Tin.
- the opening degree of the valve 113 is adjusted so as to optimize the flow rate of the refrigerant liquid by monitoring the load information in the electronic device 511, the exhaust gas temperature information in the heat receiving unit 111, and the like.
- FIG. 7 shows an example of the relationship between the valve opening and the valve position in a related heat receiving module that does not have a reserve tank.
- the related heat receiving part module is provided with four heat receiving parts.
- the vertical axis is the opening of the valve
- the horizontal axis is the position in the vertical direction of the valve
- the direction away from the origin is the lower side. That is, it is assumed that the valves are arranged in the order of V1, V2, V3, and V4 from the upper side to the lower side in the vertical direction.
- W indicates the opening adjustment width of each valve
- the valve on the upstream side needs to adjust the valve opening according to the load fluctuation of each electronic device that exchanges heat with all the heat receiving units located on the downstream side. For this reason, the range of opening adjustment becomes larger as the valve is upstream. That is, the tolerance of the opening degree of the electronic device apparatus with respect to the load fluctuation becomes smaller as the valve is upstream.
- the phase change cooling device 100 includes the reserve tank 112 that buffers the refrigerant amount corresponding to the load fluctuation of the electronic device 511 on the upstream side of each valve 113. Therefore, the influence by having arrange
- FIG. 8 shows an example of the relationship between the valve opening and the valve position in the heat receiving module 110 provided in the phase change cooling device 100 according to the present embodiment.
- the vertical axis is the opening of the valve
- the horizontal axis is the position in the vertical direction of the valve
- the direction away from the origin is the lower side.
- W in the figure indicates the opening adjustment width of each valve
- the heat receiving module 110 has a configuration in which the reserve tank 112 is provided on the upstream side of the valve 113.
- the reserve tank 112 stores (reserves) at least the refrigerant liquid corresponding to the maximum amount of heat exchange of each heat receiving section 111, and when the reserve amount is exceeded, it flows out to the reserve tank 112 on the downstream side. It is configured.
- the refrigerant liquid is supplied from the reserve tank 112 to each heat receiving unit 111, and therefore, as shown in FIG. Can be bigger.
- the phenomenon that the refrigerant liquid amount decreases as the heat receiving portion located on the lower side in the vertical direction does not occur. Can be relaxed.
- the refrigerant supply amount can be followed in a short time without deteriorating the heat exchange performance. Furthermore, since the valve opening adjustment amount and frequency can be reduced, the reliability of the cooling system can be improved.
- the load on the air conditioner in the server room can be reduced.
- the refrigerant in the reserve tank serves as a buffer against server load fluctuations, tolerance for server load fluctuations can be increased. For this reason, even if the load on the server fluctuates suddenly, there is no excess or deficiency in the refrigerant supply amount, so that a decrease in the heat absorption performance can be avoided.
- the reliability of the cooling system can be improved.
- the reason is that the valve opening adjustment amount and the adjustment frequency can be suppressed by increasing the tolerance against the load fluctuation of the server as described above. Thereby, it is possible to reduce the risk of failure of the valve drive parts and to extend the service life.
- FIG. 9 shows the configuration of the heat receiving module provided in the phase change cooling device according to the present embodiment.
- the heat receiving section module 110 includes a heat receiving section liquid pipe as a pipe connecting the heat receiving section 111 and the reserve tank 112 as a storage tank in addition to the valve 113 as a refrigerant liquid amount adjusting means.
- 340 is provided.
- the heat receiving part liquid tube 340 was set as the structure containing the part comprised so that the internal diameter of the heat receiving part liquid tube 340 was located small as the heat receiving part liquid tube located in the downward direction of the perpendicular direction. That is, the inner diameter of the heat receiving part liquid tube 340 is uniformly different depending on the position in the vertical direction, or the inner diameter of a part of the heat receiving part liquid tube 340 is different.
- the pressure loss of the refrigerant liquid flowing in the liquid pipe 140 can be increased as the pipe is located on the lower side in the vertical direction. Therefore, the opening degree of the valve 113 can be made closer to a constant value from the upstream side to the downstream side. As a result, the tolerance of the valve opening with respect to the load fluctuation of the electronic device 511 can be further increased, and the control system for adjusting the opening of the valve can be simplified.
- FIG. 10 it is good also as a structure provided only with the heat receiving part liquid pipe
- FIG. 10 By setting it as such a structure, the pressure loss of the refrigerant liquid which flows through the inside of the liquid pipe 140 can be enlarged as the pipe is located on the lower side in the vertical direction. In this case, the pressure loss of the heat receiving part liquid tube 340 is fixed for each heat receiving part 111.
- the reserve tank 112 can absorb a certain amount of load fluctuation, and therefore operation without adjusting the valve opening is also possible. It is.
- the cost of the valve and the cost of the control system for adjusting the opening can be reduced.
- FIG. 11 schematically shows a schematic configuration in which the phase change cooling device 400 according to the present embodiment is arranged in a data center building.
- the phase change cooling device 400 of the present embodiment has a configuration in which a plurality of heat receiving units 111 are arranged apart from a housing that houses a cooling target. That is, the phase change cooling device 400 has a configuration in which a heat receiving unit module 410 including a plurality of heat receiving units 111 and a plurality of refrigerant supply structures is installed on the wall surface of the server room 500, for example.
- the exhaust heat of the electronic device 511 is received by the heat receiving unit module 410 on the wall surface of the server room 500 and is radiated from the heat radiating unit 120 installed outside the server room 500.
- the arrow in a figure shows the movement of the heat
- This configuration eliminates the need to install a heat receiving module for each rack 510. Therefore, it is possible to suppress the initial investment cost for the cooling device.
- phase change cooling device of each embodiment described above it becomes possible to heat-transport exhaust heat from a rack equipped with a plurality of servers with varying loads, such as a data center, by forced circulation outside the server room. Therefore, the power consumption of the air conditioner can be reduced.
Abstract
Description
図1は、本発明の第1の実施形態に係る冷媒供給装置の構成を示す断面図である。本実施形態による冷媒供給装置(冷媒供給構造)10は、貯留タンク11および冷媒液量調整手段12を有する。
次に、本発明の第2の実施形態について説明する。本実施形態では、第1の実施形態による冷媒供給構造10を用いた相変化冷却装置について説明する。以下では、データセンタ(Data Center:DC)等に配置されるサーバラックに搭載される冷媒供給構造10を用いた相変化冷却装置100を例として説明する。なお、以下の説明では、「冷媒供給構造10を用いた相変化冷却装置100」を単に「相変化冷却装置100」と言う。
次に、本発明の第3の実施形態について説明する。
次に、本発明の第4の実施形態について説明する。
11、11X 貯留タンク
11a 流入部
11b 流出部
11c 分岐流出部
12 冷媒液量調整手段
13、114 分岐配管
21 駆動ポンプ
22、111 受熱部
100、400 相変化冷却装置
110、410 受熱部モジュール
112 リザーブタンク
113 バルブ
120 放熱部
130 駆動ポンプ
140 液管
150 蒸気管
211 受熱部冷媒液流
212 分岐冷媒液流
221 冷媒液
222 冷媒蒸気
340 受熱部液管
500 サーバ室
510 ラック
511 電子機器装置
520 機械室
Claims (19)
- 駆動ポンプによって流動する冷媒液を貯留する貯留タンクと、
前記貯留タンクから受熱手段に流出する前記冷媒液の流量を制御する冷媒液量調整手段、を有し、
前記貯留タンクは分岐流出部を備え、
前記分岐流出部は、前記冷媒液量調整手段より上方に設けられ、前記貯留タンクに対して下方に位置する他の貯留タンクに、前記貯留タンクに貯留しているタンク内冷媒液を流出する
冷媒供給装置。 - 請求項1に記載した冷媒供給装置において、
前記分岐流出部に、前記タンク内冷媒液の液面近傍から、前記タンク内冷媒液を前記他の貯留タンクに輸送する分岐配管が接続された
冷媒供給装置。 - 請求項1または2に記載した冷媒供給装置において、
前記冷媒液量調整手段は、前記貯留タンクの底面、および側面の下端のいずれかに接続される配管に設けられる
冷媒供給装置。 - 請求項1から3のいずれか一項に記載した冷媒供給装置において、
前記冷媒液量調整手段は、前記受熱手段の冷却特性が、前記冷媒液の流動方向に沿った異なる位置において略同一となるように前記冷媒液の流量を制御する
冷媒供給装置。 - 請求項1から4のいずれか一項に記載した冷媒供給装置において、
前記冷媒液量調整手段は、流量可変バルブである
冷媒供給装置。 - 請求項1から5のいずれか一項に記載した冷媒供給装置において、
前記冷媒液量調整手段は、前記受熱手段と前記貯留タンクを接続する配管であり、
前記配管は、前記配管の内径が前記他の貯留タンクと他の受熱手段を接続する他の配管の内径と異なる部分を含む
冷媒供給装置。 - 請求項1から6のいずれか一項に記載した冷媒供給装置において、
前記貯留タンクは、前記冷媒液が流入する流入部と、前記冷媒液が前記受熱手段に向けて流出する流出部と、分岐配管が接続する前記分岐流出部、とを備え、
前記冷媒液量調整手段が、前記流出部に接続されている
冷媒供給装置。 - 請求項1から7のいずれか一項に記載した冷媒供給装置において、
前記貯留タンクは、前記冷媒液の気化熱による全熱量が前記受熱手段における最大受熱量と等しくなる容量の前記冷媒液を、少なくとも収容可能な容積を備える
冷媒供給装置。 - 冷媒を収容し、鉛直方向に配置した複数の受熱手段と、
前記冷媒が前記受熱手段で受熱した熱を放熱し、冷媒液を流出する放熱手段と、
前記冷媒液を流動させる駆動ポンプと、
前記冷媒液を前記複数の受熱手段にそれぞれ供給する複数の冷媒供給装置、とを有し、
前記冷媒供給装置は、
駆動ポンプによって流動する冷媒液を貯留する貯留タンクと、
前記貯留タンクから受熱手段に流出する前記冷媒液の流量を制御する冷媒液量調整手段、を有し、
前記貯留タンクは分岐流出部を備え、
前記分岐流出部は、前記冷媒液量調整手段より上方に設けられ、前記貯留タンクに対して下方に位置する他の貯留タンクに、前記貯留タンクに貯留しているタンク内冷媒液を流出する
冷媒供給装置を用いた相変化冷却装置。 - 請求項9に記載した冷媒供給装置を用いた相変化冷却装置において、
前記分岐流出部に、前記タンク内冷媒液の液面近傍から、前記タンク内冷媒液を前記他の貯留タンクに輸送する分岐配管が接続された
冷媒供給装置を用いた相変化冷却装置。 - 請求項9または10に記載した冷媒供給装置を用いた相変化冷却装置において、
前記冷媒液量調整手段は、前記貯留タンクの底面、および側面の下端のいずれかに接続される配管に設けられる
冷媒供給装置を用いた相変化冷却装置。 - 請求項9から11のいずれか一項に記載した冷媒供給装置を用いた相変化冷却装置において、
前記冷媒液量調整手段は、前記受熱手段の冷却特性が、前記冷媒液の流動方向に沿った異なる位置において略同一となるように前記冷媒液の流量を制御する
冷媒供給装置を用いた相変化冷却装置。 - 請求項9から12のいずれか一項に記載した冷媒供給装置を用いた相変化冷却装置において、
前記冷媒液量調整手段は、流量可変バルブである
冷媒供給装置を用いた相変化冷却装置。 - 請求項9から13のいずれか一項に記載した冷媒供給装置を用いた相変化冷却装置において、
前記冷媒液量調整手段は、前記受熱手段と前記貯留タンクをそれぞれ接続する配管であり、
前記配管は、前記配管の内径が鉛直方向の下方側に位置する前記配管ほど小さく構成された部分を含む
冷媒供給装置を用いた相変化冷却装置。 - 請求項9から14のいずれか一項に記載した冷媒供給装置を用いた相変化冷却装置において、
前記複数の受熱手段が、冷却対象物を収容する筐体の内部に配置している
冷媒供給装置を用いた相変化冷却装置。 - 請求項9から15のいずれか一項に記載した冷媒供給装置を用いた相変化冷却装置において、
前記複数の受熱手段が、冷却対象物を収容する筐体から離間して配置している
冷媒供給装置を用いた相変化冷却装置。 - 駆動ポンプによって流動する冷媒液を貯留した貯留冷媒液を保持し、
前記貯留冷媒液の一部であって、受熱領域に流動する循環冷媒液の流量を制御し、
前記貯留冷媒液の液面近傍から前記貯留冷媒液の一部を鉛直方向の下方側に流出させる
冷媒供給方法。 - 請求項17に記載した冷媒供給方法において、
前記受熱領域における冷却特性が、前記循環冷媒液の流動方向に沿った異なる位置において略同一となるように前記循環冷媒液の流量を制御する
冷媒供給方法。 - 請求項17または18に記載した冷媒供給方法において、
前記循環冷媒液を、鉛直方向に位置する複数の受熱領域のそれぞれに向かって流動させ、
鉛直方向の下方側に位置する前記受熱領域に向かって流動する前記循環冷媒液ほど圧力損失が大きくなるように制御する
請求項17または18に記載した冷媒供給方法。
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JPS58225293A (ja) * | 1982-06-23 | 1983-12-27 | 株式会社東芝 | 液冷式電気機器 |
JP2011237887A (ja) * | 2010-05-06 | 2011-11-24 | Hitachi Plant Technologies Ltd | 電子機器の冷却方法及び冷却システム |
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WO2015183265A1 (en) * | 2014-05-28 | 2015-12-03 | Hewlett-Packard Development Company, L.P. | Multiple tank cooling system |
WO2016031195A1 (ja) * | 2014-08-27 | 2016-03-03 | 日本電気株式会社 | 相変化冷却装置および相変化冷却方法 |
US9968010B2 (en) * | 2015-12-21 | 2018-05-08 | Dell Products, L.P. | Information handling system having flexible chassis block radiators |
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JPS58225293A (ja) * | 1982-06-23 | 1983-12-27 | 株式会社東芝 | 液冷式電気機器 |
JP2011237887A (ja) * | 2010-05-06 | 2011-11-24 | Hitachi Plant Technologies Ltd | 電子機器の冷却方法及び冷却システム |
WO2014087635A1 (ja) * | 2012-12-03 | 2014-06-12 | 日本電気株式会社 | 電子機器収納装置の冷却システム及び電子機器収納建屋の冷却システム |
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