JP6904704B2 - 相変化冷却装置および相変化冷却方法 - Google Patents
相変化冷却装置および相変化冷却方法 Download PDFInfo
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- JP6904704B2 JP6904704B2 JP2016544940A JP2016544940A JP6904704B2 JP 6904704 B2 JP6904704 B2 JP 6904704B2 JP 2016544940 A JP2016544940 A JP 2016544940A JP 2016544940 A JP2016544940 A JP 2016544940A JP 6904704 B2 JP6904704 B2 JP 6904704B2
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- steam
- refrigerant
- phase change
- cooling device
- change cooling
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- 238000001816 cooling Methods 0.000 title claims description 90
- 230000008859 change Effects 0.000 title claims description 58
- 239000003507 refrigerant Substances 0.000 claims description 194
- 239000007788 liquid Substances 0.000 claims description 83
- 230000032258 transport Effects 0.000 claims description 57
- 230000001154 acute effect Effects 0.000 claims description 2
- 230000006866 deterioration Effects 0.000 description 6
- 230000005484 gravity Effects 0.000 description 4
- 238000001704 evaporation Methods 0.000 description 3
- 230000008020 evaporation Effects 0.000 description 3
- 239000012530 fluid Substances 0.000 description 3
- 238000004891 communication Methods 0.000 description 2
- 239000002826 coolant Substances 0.000 description 2
- 230000010365 information processing Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20327—Accessories for moving fluid, for connecting fluid conduits, for distributing fluid or for preventing leakage, e.g. pumps, tanks or manifolds
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20318—Condensers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/208—Liquid cooling with phase change
- H05K7/20827—Liquid cooling with phase change within rooms for removing heat from cabinets, e.g. air conditioning devices
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Mechanical Engineering (AREA)
- Computer Hardware Design (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
Center:DC)が設置され運用されている。ここで、データセンタ(DC)とは、サーバやデータ通信装置を設置し運用することに特化した施設をいう。このようなデータセンタ(DC)においては、サーバやデータ通信装置などの電子機器からの発熱密度が非常に高いため、これらの電子機器を効率的に冷却する必要がある。
本発明の第1の実施形態に係る相変化冷却装置は、受熱する複数の受熱部と、放熱する凝縮部と、複数の受熱部と凝縮部とを接続する第1の冷媒経路及び第2の冷媒経路と、を有する。ここで第1の冷媒経路は、複数の受熱部とそれぞれ接続する複数の副冷媒管と、複数の副冷媒管と接続する冷媒合流部と、冷媒合流部と凝縮部とを接続する主冷媒管、とを備える。
次に、本発明の第2の実施形態について説明する。本実施形態においては、相変化冷却装置1000が備える冷媒蒸気輸送構造1100についてさらに詳細に説明する。
次に、本発明の第3の実施形態について説明する。本実施形態においては、相変化冷却装置1000が備える冷媒蒸気輸送構造1100についてさらに詳細に説明する。
1010 受熱部
1020 凝縮部
1100、1101 冷媒蒸気輸送構造
1110 副蒸気管
1120、2100、3100、3200 蒸気合流部
1130、3130 主蒸気管
1200 冷媒液輸送構造
1210 主液管
1220 冷媒液貯留部
1230 副液管
2110 容器部
2111 流入穴
2112 ねじ穴
2120 接続突起部
2130、3120 分岐配管
3110 配管部
3130 逆止弁
Claims (9)
- 複数の発熱源から受熱する冷媒をそれぞれ収容する複数の受熱手段と、
前記受熱手段で気化した前記冷媒の冷媒蒸気を凝縮液化して冷媒液を生成する凝縮手段と、
前記受熱手段と前記凝縮手段を接続し、前記冷媒蒸気を輸送する冷媒蒸気輸送構造と、
前記受熱手段と前記凝縮手段を接続し、前記冷媒液を輸送する冷媒液輸送構造、とを有し、
前記冷媒蒸気輸送構造は、
前記複数の受熱手段とそれぞれ接続する複数の副蒸気管と、
前記複数の副蒸気管と接続し、前記冷媒蒸気が合流する蒸気合流手段と、
前記蒸気合流手段と前記凝縮手段とを接続する主蒸気管、とを備え、
前記冷媒液輸送構造は、主液管と、冷媒液貯留部と、複数の副液管とを備え、
前記主液管は、前記凝縮手段と接続し、
前記冷媒液貯留部は、前記主液管と接続し、前記冷媒液をため、
前記複数の副液管は、前記冷媒液貯留部と前記複数の受熱手段とをそれぞれ接続し、
前記蒸気合流手段は、前記冷媒液貯留部とは別に位置している
相変化冷却装置。 - 請求項1に記載した相変化冷却装置において、
前記蒸気合流手段は、前記複数の受熱手段よりも上方に位置している
相変化冷却装置。 - 請求項1または2に記載した相変化冷却装置において、
前記蒸気合流手段は、
上面と下面と側面とを少なくとも含む複数の平面を有する立体形状からなる容器部と、
前記上面および前記側面の少なくとも一方に位置し、前記主蒸気管と接続する主蒸気管接続手段と、
前記側面および前記下面の少なくとも一方に位置し、前記複数の副蒸気管とそれぞれ接続する複数の副蒸気管接続手段、とを有する
相変化冷却装置。 - 請求項3に記載した相変化冷却装置において、
前記主蒸気管接続手段および前記副蒸気管接続手段は、接続突起部をそれぞれ備える
相変化冷却装置。 - 請求項4に記載した相変化冷却装置において、
前記蒸気合流手段は、前記接続突起部の径が互いに異なる二個の前記副蒸気管接続手段を少なくとも含む
相変化冷却装置。 - 請求項4または5に記載した相変化冷却装置において、
前記接続突起部は一端にフランジ部を備え、
前記主蒸気管接続手段は、前記容器部の上面に前記フランジ部が締結手段によって固定された前記接続突起部を備え、
前記副蒸気管接続手段は、前記容器部の側面に前記フランジ部が締結手段によって固定された前記接続突起部を備える
相変化冷却装置。 - 請求項1または2に記載した相変化冷却装置において、
前記蒸気合流手段は、配管部を有し、
前記配管部は、側面において前記複数の副蒸気管と接続し、
前記配管部の径は、前記副蒸気管の径よりも大きい
相変化冷却装置。 - 請求項7に記載した相変化冷却装置において、
前記副蒸気管から前記配管部に流入する前記冷媒蒸気の流動方向と前記配管部を流動する前記冷媒蒸気の流動方向が、同一平面上でなす角度は鋭角である
相変化冷却装置。 - 請求項1から8のいずれか一項に記載した相変化冷却装置において、
前記蒸気合流手段は、前記冷媒液輸送構造と接続する分岐配管をさらに有する
相変化冷却装置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014172114 | 2014-08-27 | ||
JP2014172114 | 2014-08-27 | ||
PCT/JP2015/004144 WO2016031186A1 (ja) | 2014-08-27 | 2015-08-19 | 相変化冷却装置および相変化冷却方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2016031186A1 JPWO2016031186A1 (ja) | 2017-06-08 |
JP6904704B2 true JP6904704B2 (ja) | 2021-07-21 |
Family
ID=55399102
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016544940A Active JP6904704B2 (ja) | 2014-08-27 | 2015-08-19 | 相変化冷却装置および相変化冷却方法 |
Country Status (3)
Country | Link |
---|---|
US (1) | US20170280590A1 (ja) |
JP (1) | JP6904704B2 (ja) |
WO (1) | WO2016031186A1 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI694563B (zh) * | 2017-09-28 | 2020-05-21 | 雙鴻科技股份有限公司 | 雙迴路液冷系統 |
US11723176B2 (en) * | 2021-06-22 | 2023-08-08 | Baidu Usa Llc | Multi-tier cooling system without load perception |
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- 2015-08-19 WO PCT/JP2015/004144 patent/WO2016031186A1/ja active Application Filing
- 2015-08-19 US US15/506,513 patent/US20170280590A1/en not_active Abandoned
- 2015-08-19 JP JP2016544940A patent/JP6904704B2/ja active Active
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JPWO2016031186A1 (ja) | 2017-06-08 |
WO2016031186A1 (ja) | 2016-03-03 |
US20170280590A1 (en) | 2017-09-28 |
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