JP6927229B2 - 相変化冷却装置および相変化冷却方法 - Google Patents
相変化冷却装置および相変化冷却方法 Download PDFInfo
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- JP6927229B2 JP6927229B2 JP2018541037A JP2018541037A JP6927229B2 JP 6927229 B2 JP6927229 B2 JP 6927229B2 JP 2018541037 A JP2018541037 A JP 2018541037A JP 2018541037 A JP2018541037 A JP 2018541037A JP 6927229 B2 JP6927229 B2 JP 6927229B2
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- phase change
- change cooling
- refrigerant
- cooling device
- piping
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20309—Evaporators
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20318—Condensers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20327—Accessories for moving fluid, for connecting fluid conduits, for distributing fluid or for preventing leakage, e.g. pumps, tanks or manifolds
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/208—Liquid cooling with phase change
- H05K7/20827—Liquid cooling with phase change within rooms for removing heat from cabinets, e.g. air conditioning devices
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
- G06F2200/20—Indexing scheme relating to G06F1/20
- G06F2200/201—Cooling arrangements using cooling fluid
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
図1は、本発明の第1の実施形態に係る相変化冷却装置100の構成を模式的に示す概略図である。本実施形態による相変化冷却装置100は、蒸発器110、凝縮器120、冷媒液駆動部(冷媒液駆動手段)130、第1の配管部140、第2の配管部150、第3の配管部160、冷媒貯留部(冷媒貯留手段)170、および第4の配管部180を有する。
次に、本発明の第2の実施形態について説明する。図4に、本発明の第2の実施形態に係る相変化冷却装置200の構成を模式的に示す。
110 蒸発器
120 凝縮器
130 冷媒液駆動部
140 第1の配管部
150 第2の配管部
160 第3の配管部
170 冷媒貯留部
180、280 第4の配管部
181、281 第1の接続点
182、282 第2の接続点
210 蒸発部
220 凝縮部
241 蒸発器側配管
242 凝縮器側配管
243 共通配管
251 第2の凝縮器側配管
252 第2の共通配管
261 第3の蒸発器側配管
262 第3の共通配管
HD1 第1の水平配管距離
HD2 第2の水平配管距離
VD1 第1の垂直配管距離
VD2 第2の垂直配管距離
Claims (7)
- 発熱源から受熱する冷媒液を収容する蒸発器と、
前記冷媒液が前記蒸発器で気化することにより発生した冷媒蒸気の熱を放熱し冷媒液を生成する凝縮器と、
前記冷媒液を循環させる冷媒液駆動手段と、
前記蒸発器と前記凝縮器を接続する第1の配管部と、
前記凝縮器と前記冷媒液駆動手段を接続する第2の配管部と、
前記冷媒液駆動手段と前記蒸発器を接続する第3の配管部と、
前記第2の配管部によって構成される流路内に位置する前記冷媒液をためる冷媒貯留手段と、
一端が第1の接続点において前記第1の配管部と接続し、他端が第2の接続点において前記冷媒貯留手段と接続する第4の配管部、とを有し、
前記第1の配管部の前記蒸発器との接続位置から前記第2の接続点までの水平距離である第1の水平配管距離は、前記第1の配管部の前記凝縮器との接続位置から前記第2の接続点までの水平距離である第2の水平配管距離よりも短い
相変化冷却装置。 - 請求項1に記載した相変化冷却装置において、
前記第1の接続点と前記第2の接続点との間の垂直距離である第1の垂直配管距離は、前記第1の配管部の前記凝縮器との接続位置から前記第1の接続点までの垂直距離である第2の垂直配管距離よりも短い
相変化冷却装置。 - 請求項1または2に記載した相変化冷却装置において、
前記冷媒貯留手段は、前記第1の接続点よりも下方に位置している
相変化冷却装置。 - 請求項1から3のいずれか一項に記載した相変化冷却装置において、
前記冷媒貯留手段は、前記冷媒液駆動手段よりも上方に位置している
相変化冷却装置。 - 請求項4に記載した相変化冷却装置において、
前記冷媒液駆動手段は、ポンプであり、
前記冷媒貯留手段は、前記ポンプの正常動作時における吸込み圧力を供給するために必要な距離だけ前記ポンプから離間して位置している
相変化冷却装置。 - 請求項1から5のいずれか一項に記載した相変化冷却装置において、
前記凝縮器は、前記蒸発器よりも上方に位置し、
前記第1の接続点は、前記蒸発器よりも上方であって、かつ、前記凝縮器よりも下方に位置している
相変化冷却装置。 - 請求項1から6のいずれか一項に記載した相変化冷却装置において、
複数の前記蒸発器を備えた蒸発部を有し、
前記第1の配管部は、前記複数の蒸発器とそれぞれ接続する複数の蒸発器側配管と、前記凝縮器と接続する凝縮器側配管と、前記複数の蒸発器側配管および前記凝縮器側配管とそれぞれ接続する共通配管、とを含み、
前記第4の配管部は、前記共通配管の前記第1の接続点において前記第1の配管部と接続している
相変化冷却装置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016184363 | 2016-09-21 | ||
JP2016184363 | 2016-09-21 | ||
PCT/JP2017/033426 WO2018056201A1 (ja) | 2016-09-21 | 2017-09-15 | 相変化冷却装置および相変化冷却方法 |
Publications (2)
Publication Number | Publication Date |
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JPWO2018056201A1 JPWO2018056201A1 (ja) | 2019-07-04 |
JP6927229B2 true JP6927229B2 (ja) | 2021-08-25 |
Family
ID=61689526
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2018541037A Active JP6927229B2 (ja) | 2016-09-21 | 2017-09-15 | 相変化冷却装置および相変化冷却方法 |
Country Status (3)
Country | Link |
---|---|
US (1) | US20190277572A1 (ja) |
JP (1) | JP6927229B2 (ja) |
WO (1) | WO2018056201A1 (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20170280590A1 (en) * | 2014-08-27 | 2017-09-28 | Nec Corporation | Phase-change cooling device and phase-change cooling method |
JP7077763B2 (ja) * | 2018-05-16 | 2022-05-31 | 株式会社デンソー | 機器温調装置 |
US11435794B2 (en) * | 2020-07-08 | 2022-09-06 | Nvidia Corporation | Intelligent repurposable cooling systems for mobile datacenter |
CN113566620A (zh) * | 2021-07-23 | 2021-10-29 | 南京佳力图机房环境技术股份有限公司 | 一种微通道热管换热系统 |
JP7081731B1 (ja) | 2021-08-19 | 2022-06-07 | 日本電気株式会社 | 冷却装置および冷却装置の制御方法 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
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JPS5959682U (ja) * | 1982-10-07 | 1984-04-18 | 川崎製鉄株式会社 | セパレ−ト型熱交換装置 |
JPS6179773U (ja) * | 1984-10-29 | 1986-05-28 | ||
US20040089439A1 (en) * | 2002-11-07 | 2004-05-13 | Treverton Andrew Clare | Tube-to-tube heat exchanger assembly |
JP2010190553A (ja) * | 2009-02-20 | 2010-09-02 | Hitachi Plant Technologies Ltd | 電子機器の冷却システム |
EP2543242B1 (en) * | 2010-03-03 | 2014-05-14 | Parker-Hannificn Corporation | Condenser bypass for two-phase electronics cooling system |
JP5806581B2 (ja) * | 2011-10-18 | 2015-11-10 | 株式会社日立製作所 | 冷却システム及び冷却方法 |
JP6267070B2 (ja) * | 2014-07-02 | 2018-01-24 | 株式会社日立製作所 | 冷却システムの冷媒漏洩検知方法 |
JP6605819B2 (ja) * | 2015-03-06 | 2019-11-13 | 株式会社東芝 | 冷却装置 |
-
2017
- 2017-09-15 WO PCT/JP2017/033426 patent/WO2018056201A1/ja active Application Filing
- 2017-09-15 JP JP2018541037A patent/JP6927229B2/ja active Active
- 2017-09-15 US US16/335,164 patent/US20190277572A1/en not_active Abandoned
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Publication number | Publication date |
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US20190277572A1 (en) | 2019-09-12 |
WO2018056201A1 (ja) | 2018-03-29 |
JPWO2018056201A1 (ja) | 2019-07-04 |
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