SG11201504298TA - Cooling system for electronic device storing apparatus and cooling system for electronic device storing building - Google Patents

Cooling system for electronic device storing apparatus and cooling system for electronic device storing building

Info

Publication number
SG11201504298TA
SG11201504298TA SG11201504298TA SG11201504298TA SG11201504298TA SG 11201504298T A SG11201504298T A SG 11201504298TA SG 11201504298T A SG11201504298T A SG 11201504298TA SG 11201504298T A SG11201504298T A SG 11201504298TA SG 11201504298T A SG11201504298T A SG 11201504298TA
Authority
SG
Singapore
Prior art keywords
electronic device
cooling system
device storing
building
storing apparatus
Prior art date
Application number
SG11201504298TA
Inventor
Kenichi Inaba
Minoru Yoshikawa
Hitoshi Sakamoto
Akira Shoujiguchi
Arihiro Matsunaga
Masaki Chiba
Original Assignee
Nec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nec Corp filed Critical Nec Corp
Publication of SG11201504298TA publication Critical patent/SG11201504298TA/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/208—Liquid cooling with phase change
    • H05K7/20818—Liquid cooling with phase change within cabinets for removing heat from server blades
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B23/00—Machines, plants or systems, with a single mode of operation not covered by groups F25B1/00 - F25B21/00, e.g. using selective radiation effect
    • F25B23/006—Machines, plants or systems, with a single mode of operation not covered by groups F25B1/00 - F25B21/00, e.g. using selective radiation effect boiling cooling systems
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/06—Control arrangements therefor
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20718—Forced ventilation of a gaseous coolant
    • H05K7/20736—Forced ventilation of a gaseous coolant within cabinets for removing heat from server blades
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/208—Liquid cooling with phase change
    • H05K7/20809—Liquid cooling with phase change within server blades for removing heat from heat source
SG11201504298TA 2012-12-03 2013-12-03 Cooling system for electronic device storing apparatus and cooling system for electronic device storing building SG11201504298TA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012264430 2012-12-03
PCT/JP2013/007069 WO2014087635A1 (en) 2012-12-03 2013-12-03 Cooling system for electronic equipment storage device and cooling system for electronic equipment storage facility

Publications (1)

Publication Number Publication Date
SG11201504298TA true SG11201504298TA (en) 2015-07-30

Family

ID=50883077

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201504298TA SG11201504298TA (en) 2012-12-03 2013-12-03 Cooling system for electronic device storing apparatus and cooling system for electronic device storing building

Country Status (10)

Country Link
US (1) US9693485B2 (en)
EP (1) EP2927778A4 (en)
JP (1) JPWO2014087635A1 (en)
KR (1) KR20150091506A (en)
CN (1) CN104838329A (en)
AU (1) AU2013356152B2 (en)
BR (1) BR112015012796A2 (en)
IN (1) IN2015DN03895A (en)
SG (1) SG11201504298TA (en)
WO (1) WO2014087635A1 (en)

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US20170280590A1 (en) * 2014-08-27 2017-09-28 Nec Corporation Phase-change cooling device and phase-change cooling method
US9552025B2 (en) * 2014-09-23 2017-01-24 Google Inc. Cooling electronic devices in a data center
JP5869646B1 (en) * 2014-10-17 2016-02-24 Ｎｅｃプラットフォームズ株式会社 Refrigerant supply device, cooling device, and cooling system
CN105987468A (en) * 2015-02-06 2016-10-05 深圳易信科技股份有限公司 Emergency refrigerating device for machine room
WO2016147615A1 (en) * 2015-03-13 2016-09-22 日本電気株式会社 Refrigerant supply device, phase change cooling device in which same is used, and refrigerant supply method
US10448543B2 (en) * 2015-05-04 2019-10-15 Google Llc Cooling electronic devices in a data center
CN106304752A (en) * 2015-05-19 2017-01-04 王玉富 A kind of phase-change heat-exchange rack being applicable to server hierarchies configuration
WO2017070211A1 (en) * 2015-10-21 2017-04-27 Liebert Corporation Cooling systems for small equipment rooms and methods of cooling small equipment rooms
US10349561B2 (en) 2016-04-15 2019-07-09 Google Llc Cooling electronic devices in a data center
CN105910600A (en) * 2016-06-14 2016-08-31 冯青元 Micro-region navigation system and method
CN105919301B (en) * 2016-06-17 2018-02-06 胡江 Rice-storing cabinet and its control method based on Internet of Things
JP6304420B1 (en) * 2017-03-23 2018-04-04 日本電気株式会社 Refrigerant distribution device, cooling device, and refrigerant distribution method in refrigerant distribution device
JP6733630B2 (en) * 2017-09-13 2020-08-05 株式会社デンソー Thermo siphon
US11359865B2 (en) * 2018-07-23 2022-06-14 Green Revolution Cooling, Inc. Dual Cooling Tower Time Share Water Treatment System
KR101995512B1 (en) * 2019-03-22 2019-07-02 엘제이테크 주식회사 Coller for industrial apparatus
USD982145S1 (en) 2020-10-19 2023-03-28 Green Revolution Cooling, Inc. Cooling system enclosure
USD998770S1 (en) 2020-10-19 2023-09-12 Green Revolution Cooling, Inc. Cooling system enclosure
US11812587B2 (en) * 2021-05-03 2023-11-07 Microsoft Technology Licensing, Llc Computer cooling
US11805624B2 (en) 2021-09-17 2023-10-31 Green Revolution Cooling, Inc. Coolant shroud
US11925946B2 (en) 2022-03-28 2024-03-12 Green Revolution Cooling, Inc. Fluid delivery wand

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Also Published As

Publication number Publication date
AU2013356152A1 (en) 2015-05-28
EP2927778A1 (en) 2015-10-07
CN104838329A (en) 2015-08-12
AU2013356152B2 (en) 2017-07-27
EP2927778A4 (en) 2016-08-03
KR20150091506A (en) 2015-08-11
IN2015DN03895A (en) 2015-10-02
WO2014087635A1 (en) 2014-06-12
US9693485B2 (en) 2017-06-27
JPWO2014087635A1 (en) 2017-01-05
US20150305209A1 (en) 2015-10-22
BR112015012796A2 (en) 2017-07-11

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