CN106304752A - A kind of phase-change heat-exchange rack being applicable to server hierarchies configuration - Google Patents
A kind of phase-change heat-exchange rack being applicable to server hierarchies configuration Download PDFInfo
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- CN106304752A CN106304752A CN201510254540.7A CN201510254540A CN106304752A CN 106304752 A CN106304752 A CN 106304752A CN 201510254540 A CN201510254540 A CN 201510254540A CN 106304752 A CN106304752 A CN 106304752A
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Abstract
A kind of phase-change heat-exchange rack being applicable to server hierarchies configuration.It is by being placed in the phase-change heat-exchange vaporization chamber of each layer of rack, cabinet or the heat exchange condensers of outdoor and connecting line are constituted.For solving the liquid refrigerants distribution of each layer vaporization chamber of differing heights, it is allowed to be in the reasonable duty being partly full of, every layer at least evaporator main room be connected with system liquid refrigerant return pipe by liquid level valve, remaining vaporization chamber of this layer passes through the top of bottom and evaporation cavity that two refrigerant pipelines contain liquid respectively with it and is connected.The top of the evaporator main room of each floor of all racks is connected to system gas coolant conveying pipe by pipeline, and system gas coolant conveying pipe and system liquid refrigerant return pipe connect top and the bottom of condenser respectively.
Description
The present invention and " evaporation chamber for inner container type evaporative cooling device " application number 20010151624.83,2007 applyings date
November 6 was series Patents.
Technical field
The present invention relates to data center server rack cooling technology field, the phase inversion of a kind of control hierarchy configuration
Thermal evaporation room be in partly be full of state be conducive to concentrate cooling rack.
Technical background
Along with information-based fast-developing, global data center pace of construction is substantially accelerated, and its high energy consumption problem has caused height
Pay attention to.The server of the most most of data centers all uses high rotating speed blower fan to cool down processor etc., and rack installs additional
Heat is entered machine room by diameter fan, the air conditioning system of machine room process.In a lot of data, air conditioning energy consumption accounts for more than 40%.
For reducing air conditioning energy consumption, develop and much in rack, installed heat-exchanger rig additional heat energy is directly got rid of the technology of machine room.Patent
CN201410057650 discloses a kind of Novel server cooling machine cabinet, is used for placing some servers, this Novel server
Cooling machine cabinet includes: a server cabinet, be installed on server machine multiple heat exchangers cashier's office in a shop, outdoor chiller and company
Adapter road;The described server machine multiple heat exchangers cashier's office in a shop that are installed on are all direct-cooling type heat exchangers;Described multiple heat exchange
Device is respectively arranged in described server cabinet and places on each layer of support of server, with server directly by by touching;Described
Multiple heat exchangers respectively by connecting line be together in parallel then connect described in outdoor chiller.Microchannel copper aluminum coil pipe
Direct-cooling type heat exchanger structure is complicated, and is difficulty with the control of the temperature equalization to each stratum server.
Patent CN200810000097.0 mono-kind evaporation cooling concentrates heat exchange distributed switch power supply system owing to requiring own
Pyrotoxin be in same level and have the biggest limitation.
Summary of the invention
It is an object of the invention to heat produced by the electronic devices such as the CPU of server by the evaporation directly contacted therewith
Room evaporation coolant is delivered to condenser and is carried out heat exchange with the external world.Fig. 1 is that the one of the present invention is typically suitable for server hierarchies configuration
Phase-change heat-exchange rack.As it can be seen, can be layered placement server in rack, every layer of placement is multiple, each server
Being fastened by bolts with a heat exchange vaporization chamber or block pressure and be in close contact, the main heater members position such as CPU therein, heat exchange is steamed
The inner bag metal sheet sending out room should appear framework by the method such as punching press or stretching, is formed by heat-conducting silicone grease or heat conduction adhesive sticker
Good thermo-contact, the less element of general heating, can be by the capacity of heat transmission preferable jelly body resin of molding in advance, will
Heat passes to heat exchange vaporization chamber.The heat exchange vaporization chamber contacted with server is connected by upper and lower two pipelines evaporator main room with every layer,
The pipe of bottom absorbs liquid coolant, and the coolant of evaporation discharged by the pipe on top, and the outside of evaporator main room can also configure heating part
Part.The evaporator main room of every layer is furnished with liquid level valve, by the system liquid refrigerant return pipe of described liquid level valve evaporator main room Yu rack
It is connected, the liquid level in vaporization chamber can be controlled so that heater members is positioned under liquid level plane, the top of the most each vaporization chamber
Leave sufficient gas coolant free air space.The coolant of all evapn collected by the gas coolant conveying pipe of rack, is delivered to condenser.
The present invention is further detailed explanation with specific embodiment below in conjunction with the accompanying drawings:
Accompanying drawing explanation
Fig. 1 is a kind of phase-change heat-exchange rack being applicable to server hierarchies configuration of the present invention;
Fig. 2 is the typical structure of one layer of vaporization chamber in rack of the present invention;
Fig. 3 is the heat exchange vaporization chamber structure that a kind of of the present invention directly contacts with server;
Fig. 4 is the phase-change heat-exchange being applicable to server hierarchies configuration in a kind of water-cooled heat exchange condensers of the present invention is placed in rack
Rack;
Fig. 5 is that a kind of water-cooled heat exchange condensers of the present invention is placed in rack inner bottom part and is applicable to the phase transformation of server hierarchies configuration
Heat exchange rack.
Detailed description of the invention
Specific embodiment in conjunction with the above-mentioned accompanying drawing explanation present invention.
Fig. 1 gives the embodiment of a phase-change heat-exchange rack being typically suitable for server hierarchies configuration.In figure, 100 are
Cabinet, 200 is the evaporator main room of layered configuration, and 300 is system liquid refrigerant return pipe, and 310 is liquid coolant storage bin,
400 is system gas coolant conveying pipe, and 500 is condenser, and 600 is heat exchange vaporization chamber;210 is liquid coolant connecting tube, 220
For gas coolant connecting tube, 230 is liquid level valve.
Fig. 2 and Fig. 3 gives and the structure of server contact heat-exchanging vaporization chamber.In figure, 600 is that heat exchange vaporization chamber is by thin gold
Belonging to plate inner bag and outside framework composition, 630 metal sheets should pass through the contour heating of CPU at server of the method such as punching press or stretching
Appearing framework at element, 610 is gas coolant connecting branch, and 620 is liquid coolant connecting branch.
What Fig. 4 was given is the phase-change heat-exchange of the server hierarchies configuration of rack built-in water-cooling condenser and standby air-cooled condenser
The embodiment of rack.Compared to Figure 1 water cooling heat exchanger 700 is added, including 710 cooling water inlet pipes, 720 cooling water water outlets
Pipe and standby air-cooled condenser 500.
What Fig. 5 was given is rack built-in water-cooling condenser, is placed in bottom rack, and the server hierarchies of standby air-cooled condenser
The embodiment of the phase-change heat-exchange rack of configuration.Go back water cooling heat exchanger 700 compared with Fig. 1 and Fig. 4 and be moved to the bottom of rack,
Adding liquid coolant catcher 730, the temperature difference drives refrigerant pump 800, upper liquid-level switch 810, lower liquid-level switch 820, coolant
Inlet solenoid valve 830, refrigerant exit electromagnetic valve 840, liquid coolant conveying pipe 860, standby air-cooled condenser 500 and seal every
Plate 110.
As it is shown in figure 1, the liquid coolant connecting tube 210 of the evaporator main room 200 of all layered configuration is all connected to system
Liquid refrigerant return pipe 300, the side, evaporator main room of liquid coolant connecting tube 210 is furnished with liquid level valve 230, all of gas coolant company
Adapter 220 is all connected to the gas coolant conveying pipe 400 of system, and the high-end outlet of system gas coolant conveying pipe 400 is connected to
The upper entrance of condenser 500, the lower part outlet connection system liquid refrigerant return pipe 300 of condenser 500, the liquid of system
The top configuration liquid coolant storage bin 310 of refrigerant return pipe 300.The gas coolant on each heat exchange vaporization chamber 600 top connects
Arm 610 is connected to the top of evaporator main room, and the liquid coolant connecting branch 620 of heat exchange vaporization chamber 600 bottom is connected to main steaming
Send out the bottom of room.
The gas coolant conveying pipe 400 of system in the embodiment of the phase-change heat-exchange rack of the server hierarchies configuration that Fig. 4 is given
High-end outlet be connected to upper entrance and the upper entrance of standby air-cooled condenser 500 of water heat exchange condensers 700 in rack,
In rack, to be all connected to system liquid cold for the lower part outlet of water heat exchange condensers 700 and the lower part outlet of standby air cooling heat exchanger 500
The top of matchmaker's return duct 300.The water of cabinet inner bottom part in the embodiment of the phase-change heat-exchange rack of the server hierarchies configuration that Fig. 5 is given
The outlet at bottom of heat exchange condensers 700 connects liquid coolant collecting box 730, and the upper outlet of system gas coolant conveying pipe is connected to
The upper entrance of standby air-cooled condenser 500, the lower outlet of system gas coolant conveying pipe 400 is connected to water-cooled condenser 700
Upper entrance.The end opening of liquid coolant conveying pipe 860 is deep into the bottom of liquid coolant collecting box 730, and liquid coolant carries
The upper outlet of pipe 860 is connected to the temperature difference by the control of refrigerant inlet electromagnetic valve 830 and drives the top of refrigerant pump 800, and the temperature difference is driven
The lower part outlet of dynamic refrigerant pump 800 is connected to system liquid refrigerant return pipe 300 by the control of refrigerant exit electromagnetic valve 840.
The side, evaporator main room of the liquid coolant connecting tube 210 of each evaporator main room 200 is furnished with liquid level valve 230, liquid level valve
230 control the liquid level in vaporization chamber so that liquid level plane is higher than heater members, and the top of the most each vaporization chamber is left sufficiently
Space is for the coolant gas circulation after evaporation.Heat exchange vaporization chamber 600 is formed by metal sheet inner bag and outside framework, thin at 630
Metallic plate should appear framework by the method such as punching press or stretching at the contour heater element of CPU of server, passes through heat-conducting silicone grease
Or heat conduction adhesive sticker forms good thermo-contact, for the little device that generates heat, the metal sheet inner bag of heat exchange vaporization chamber can lead to
Contact after the capacity of heat transmission preferable jelly body resin of molding in advance.Coolant steam after server evaporation is by gas coolant
Connecting branch 610 send evaporator main room 200, and it is supplementary to obtain liquid coolant by liquid coolant connecting branch 620.Evaporator main room
The coolant gas that 200 collect passes through gas coolant connecting tube 220, and system gas coolant conveying pipe 400 is delivered to condenser 500 and dispelled the heat
It is converted into liquid, by the outlet bottom condenser 500, enters system liquid refrigerant return pipe 300, form circulation.
The data center that many is built up is configured with cooling water circulation refrigeration unit, and unification carries out comprehensive heat management.Fig. 4
With Fig. 5 be given be applicable to server hierarchies configuration phase-change heat-exchange rack embodiment in rack, be all provided with water-cooled heat exchange
Condenser 700, and it is furnished with standby air-cooled condenser 500.Standby air-cooled condenser 500 except maintaining clothes when water-cooling system fault
Business is outside device normally works, it is also possible to be machine room heating in the season of cold weather.The rack that Fig. 5 is given is adapted to water-cooled pipeline and exists
Pass through in underground, and rack bottom water circulation system is sealed dividing plate 110 and separates with server, occurs water pipe to leak and is not result in
The damage of server.
Owing to condenser is in the bottom of rack, the liquid coolant that its condensation is formed must rise to the top of rack and could be formed by pump
Circulation, it is of course possible to configure special refrigerant pump, owing to system has heat energy to utilize for the purpose of heat radiation, the art of this patent carries
Supply an optional temperature difference pump scheme.The evaporative cooling system of the normal work pressure reduction that only backflow fluid column is corresponding and corresponding the most very
The little temperature difference.Refrigerant inlet electromagnetic valve 830 cuts out, and electromagnetic valve 840 is opened, and after closing blower fan 850, the temperature difference drives refrigerant pump 800
Liquid coolant in cavity can influent coolant storage bin 310, the storage of liquid coolant storage bin 310 top under gravity
The coolant gas deposited can flow into the temperature difference and drive refrigerant pump 800 cavity, if being further added by the system gas coolant that a way solenoid valve controls
Conveying pipe 400 can increase the ability of temperature difference pump to the passage on refrigerant pump 800 cavity top.When the temperature difference drives refrigerant pump 800 cavity
In liquid level when being down to the position of lower liquid-level switch 820, close refrigerant exit electromagnetic valve 840, open refrigerant inlet electromagnetic valve 830,
Opening blower fan 850, the temperature difference drives the reduction of refrigerant pump 800 cavity temperature to be allowed to pressure and is less than whole system, passes through liquid coolant
Conveying pipe 860 extracts the liquid coolant in liquid coolant catcher 730, forms the circulation of whole system.
Above several embodiments of the present invention are made detailed statement, but the engineers and technicians of this area are it should be apparent that this is special
The range of application of profit is not limited to server cabinet, and such as the high power switching power supply of N+1 formula, powerful industry commutator etc. is all
There is similar problem, all combinations based on the several ways in the range of rights protection of the present invention and wanting without departing from right of the present invention
Asking objective to change all should be within protection scope of the present invention.
Claims (3)
1. the phase-change heat-exchange rack being applicable to server hierarchies configuration, a kind of liquid refrigerants distribution of each layer vaporization chamber for solving differing heights, it is allowed to be in the reasonable duty being partly full of, every layer at least evaporator main room be connected with system liquid refrigerant return pipe by liquid level valve, the top of bottom and evaporation cavity that this layer of remaining heat exchange vaporization chamber contains liquid with evaporator main room respectively by two refrigerant pipelines is connected, the evaporator main room of each floor of all racks is connected by system gas coolant conveying pipe, described system gas coolant conveying pipe and system liquid refrigerant return pipe are respectively connecting to described condenser top and bottom, described system liquid refrigerant return pipe top configuration liquid coolant storage bin.
The phase-change heat-exchange rack being applicable to server hierarchies configuration the most according to claim 1, it is characterized in that described condenser is water cooling the top being placed in rack, being furnished with standby air-cooled condenser, described water-cooled condenser and standby air-cooled condenser in rack is parallel relationship on pipeline.
nullThe phase-change heat-exchange rack being applicable to server hierarchies configuration the most according to claim 1,It is characterized in that described condenser is water cooling the bottom being placed in rack,And it is provided with liquid coolant collecting box at its outlet at bottom,It is furnished with the temperature difference in rack and drives liquid coolant pump,The described temperature difference respectively configures a liquid-level switch in upper and lower position in driving liquid coolant pump housing,The described temperature difference drives the top of liquid coolant pump housing to be risen the bottom of liquid coolant pipe UNICOM extremely described liquid coolant collecting box by pump,Described pump rises liquid coolant pipe top and is furnished with electromagnetic valve,The described temperature difference drives liquid coolant pump to be furnished with cooling blower,The described temperature difference drives the bottom of liquid coolant pump housing to be connected to the top of liquid coolant storage bin by being furnished with the vapour-liquid coolant connecting tube of electromagnetic valve,When top liquid-level switch described in the liquid level in the described temperature difference drives liquid coolant pump housing arrives,Cooling blower described in closedown,Close described pump and rise liquid coolant pipe electromagnetic valve,Open the electromagnetic valve of described vapour-liquid coolant connecting tube,When bottom liquid-level switch described in the liquid level in the described temperature difference drives liquid coolant pump housing arrives,Open described cooling blower,The electromagnetic valve of the vapour-liquid coolant connecting tube described in closedown,Open described pump and rise liquid coolant pipe electromagnetic valve.
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11044836B2 (en) | 2017-03-23 | 2021-06-22 | Nec Corporation | Refrigerant distribution device, cooling system, and refrigerant distribution method in refrigerant distribution |
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CN1409589A (en) * | 2001-09-26 | 2003-04-09 | 穆丹制造公司 | Modular cooling system and heat bus for large power electronic equipment cabinet |
CN101400241A (en) * | 2007-09-25 | 2009-04-01 | 王玉富 | Evaporation chamber for inner container type evaporative cooling device |
US20090154104A1 (en) * | 2007-12-14 | 2009-06-18 | Yoshihiro Kondo | Cooling Device and Electronic Apparatus Using the Same |
CN102835198A (en) * | 2010-03-30 | 2012-12-19 | 日本电气株式会社 | Cooling apparatus and cooling system for electronic-device exhaustion |
CN103081581A (en) * | 2010-08-31 | 2013-05-01 | 日本电气株式会社 | System for cooling electronic device |
WO2014087635A1 (en) * | 2012-12-03 | 2014-06-12 | 日本電気株式会社 | Cooling system for electronic equipment storage device and cooling system for electronic equipment storage facility |
WO2015004920A1 (en) * | 2013-07-12 | 2015-01-15 | 日本電気株式会社 | Cooling system, and method for controlling refrigerant supply volume in cooling systems |
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2015
- 2015-05-19 CN CN201510254540.7A patent/CN106304752A/en active Pending
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
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CN1409589A (en) * | 2001-09-26 | 2003-04-09 | 穆丹制造公司 | Modular cooling system and heat bus for large power electronic equipment cabinet |
CN101400241A (en) * | 2007-09-25 | 2009-04-01 | 王玉富 | Evaporation chamber for inner container type evaporative cooling device |
US20090154104A1 (en) * | 2007-12-14 | 2009-06-18 | Yoshihiro Kondo | Cooling Device and Electronic Apparatus Using the Same |
CN102835198A (en) * | 2010-03-30 | 2012-12-19 | 日本电气株式会社 | Cooling apparatus and cooling system for electronic-device exhaustion |
CN103081581A (en) * | 2010-08-31 | 2013-05-01 | 日本电气株式会社 | System for cooling electronic device |
WO2014087635A1 (en) * | 2012-12-03 | 2014-06-12 | 日本電気株式会社 | Cooling system for electronic equipment storage device and cooling system for electronic equipment storage facility |
WO2015004920A1 (en) * | 2013-07-12 | 2015-01-15 | 日本電気株式会社 | Cooling system, and method for controlling refrigerant supply volume in cooling systems |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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US11044836B2 (en) | 2017-03-23 | 2021-06-22 | Nec Corporation | Refrigerant distribution device, cooling system, and refrigerant distribution method in refrigerant distribution |
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Application publication date: 20170104 |